EP3C10U256C7N

IC FPGA 182 I/O 256UBGA
Part Description

Cyclone® III Field Programmable Gate Array (FPGA) IC 182 423936 10320 256-LFBGA

Quantity 416 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package256-UBGA (14x14)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LFBGANumber of I/O182Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs645Number of Logic Elements/Cells10320
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits423936

Overview of EP3C10U256C7N – Cyclone® III FPGA, 10,320 logic elements, 256‑LFBGA

The EP3C10U256C7N is a Cyclone® III field programmable gate array (FPGA) in a 256‑LFBGA package designed for low‑power, cost‑sensitive applications. It combines 10,320 logic elements with approximately 0.42 Mbits of embedded memory and 182 user I/Os to enable mid‑range integration for control, interface, and signal processing functions.

Built on the Cyclone III device family architecture, this device targets designs that require efficient power use, flexible I/O support, and system integration features such as on‑chip PLLs and vendor IP for fast time‑to‑market.

Key Features

  • Logic Capacity — 10,320 logic elements to implement mid‑range digital functions and custom logic.
  • Embedded Memory — Approximately 0.42 Mbits of on‑chip RAM (423,936 bits) for buffering, FIFOs, and small data structures.
  • I/O Count and Flexibility — 182 user I/O pins with device family support for multiple I/O standards and adjustable slew rates to aid signal‑integrity tuning.
  • Clock Management — Cyclone III family clocks and PLL resources for robust clock synthesis and distribution (family supports up to four PLLs per device).
  • Low‑Voltage Operation — Core supply range of 1.15 V to 1.25 V consistent with low‑power device family operation.
  • Package & Mounting — 256‑LFBGA (supplier package: 256‑UBGA, 14 × 14 mm) in a surface‑mount form factor for compact PCB integration.
  • Commercial Temperature Grade — Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial deployments.
  • Family Integration & Tools — Leverages Cyclone III device family features such as low‑power silicon optimizations and support for pre‑built IP and vendor tool flows to accelerate development.

Typical Applications

  • Portable and Handheld Systems — Low‑power family characteristics and low core voltage make the device suitable for battery‑sensitive designs.
  • I/O‑Intensive Interfaces — High I/O count and support for multiple I/O standards enable protocol bridging, display/sensor interfaces, and peripheral aggregation.
  • Embedded Control and Signal Processing — Mid‑range logic and embedded memory support custom control logic, peripherals, and small data buffering tasks.
  • System Integration and Upgrades — Cyclone III family features support in‑field upgrades and use of vendor IP to simplify system‑level functions and reduce development time.

Unique Advantages

  • Highly configurable mid‑range logic: 10,320 logic elements provide a balance of capacity and cost for mid‑complexity designs.
  • Compact packaging: 256‑LFBGA (14 × 14 mm) surface‑mount package helps minimize PCB footprint while preserving I/O density.
  • Power‑aware platform: Cyclone III family low‑power process and 1.15–1.25 V core operation reduce power budget impact in constrained systems.
  • Flexible I/O and clocking: 182 I/Os plus family PLL resources and I/O standard support simplify interfacing and timing architectures.
  • Commercial readiness: Rated for 0 °C to 85 °C and RoHS compliant for standard commercial product deployments.
  • Vendor ecosystem: Access to Cyclone III family IP and development flows accelerates design delivery and validation.

Why Choose EP3C10U256C7N?

The EP3C10U256C7N positions itself as a practical mid‑range Cyclone III FPGA that combines a substantial logic count with meaningful on‑chip memory and a large I/O complement in a compact 256‑LFBGA package. It is well suited for engineers developing cost‑sensitive, low‑power commercial products that require moderate integration of control, interface, and signal processing functions.

Choosing this device gives you a balance of performance, power efficiency, and development support from the Cyclone III family, enabling scalable designs that leverage pre‑built IP and vendor tool flows to reduce time to market.

Request a quote or submit an inquiry to check availability, lead times, and pricing for the EP3C10U256C7N.

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