EP3C10U256A7N

IC FPGA 182 I/O 256UBGA
Part Description

Cyclone® III Field Programmable Gate Array (FPGA) IC 182 423936 10320 256-LFBGA

Quantity 181 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package256-UBGA (14x14)GradeAutomotiveOperating Temperature-40°C – 125°C
Package / Case256-LFBGANumber of I/O182Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs645Number of Logic Elements/Cells10320
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationAEC-Q100Total RAM Bits423936

Overview of EP3C10U256A7N – Cyclone® III FPGA, 256-LFBGA

The EP3C10U256A7N is a Cyclone III field-programmable gate array (FPGA) in a 256‑LFBGA package designed for applications that require a balance of configurable logic, on-chip memory, and robust I/O capability. As a Cyclone III device, it is positioned for low-power, cost-sensitive designs while providing the integration and flexibility of a programmable logic device.

Targeted for automotive and embedded markets, this device combines 10,320 logic elements, approximately 0.424 Mbits of embedded memory, and 182 user I/Os in a compact surface-mount package. It is qualified to AEC‑Q100 and rated for operation from −40 °C to 125 °C, making it suitable for temperature-challenging applications in the field.

Key Features

  • Logic Capacity — 10,320 logic elements provide substantial programmable resources for glue logic, state machines, protocol handling, and custom datapaths.
  • Embedded Memory — Approximately 0.424 Mbits of on-chip RAM for buffering, FIFOs, and small lookup tables to support data-intensive functions without external memory.
  • I/O Capability — 182 user I/Os to support multiple parallel interfaces, sensor arrays, and board-level connectivity.
  • Power and Supply — Operates from a core voltage range of 1.15 V to 1.25 V, aligning with low-power design goals.
  • Package and Assembly — 256‑LFBGA (supplier package: 256‑UBGA, 14×14) in a surface-mount form factor for compact PCB layouts.
  • Automotive Qualification — Grade: Automotive with AEC‑Q100 qualification, supporting use in automotive electronic systems.
  • Wide Operating Temperature — Specified for −40 °C to 125 °C operation, suitable for harsh thermal environments.
  • RoHS Compliant — Conforms to RoHS requirements for environmental compliance.

Typical Applications

  • Automotive Electronics — Embedded control, sensor interfacing, and in-vehicle processing where AEC‑Q100 qualification and wide temperature range are required.
  • Industrial Control — Motor control, PLC interfaces, and real-time I/O aggregation leveraging the device’s programmable logic and dense I/O count.
  • Communications & Connectivity — Protocol bridging, custom interface logic, and timing adaptation using available logic and on-chip memory.
  • Embedded Systems — Offload and accelerate custom datapaths, glue logic, and peripheral management in space-constrained, low-power designs.

Unique Advantages

  • Automotive-ready qualification: AEC‑Q100 rating and automotive grade mean the device meets industry requirements for many in-vehicle designs.
  • Compact, high-density package: 256‑LFBGA (14×14 UBGA) provides a small PCB footprint while delivering 182 user I/Os and 10,320 logic elements.
  • On-chip memory for efficient designs: Approximately 0.424 Mbits of embedded RAM reduces dependence on external memory for buffering and small data stores.
  • Wide operating temperature: −40 °C to 125 °C rating supports deployment in thermally challenging environments common to automotive and industrial applications.
  • Low-voltage core operation: 1.15 V to 1.25 V supply range supports low-power system architectures and modern power-rail designs.
  • Regulatory and environmental compliance: RoHS compliance simplifies use in regions and applications where lead-free components are required.

Why Choose EP3C10U256A7N?

The EP3C10U256A7N delivers a practical mix of programmable logic, embedded memory, and extensive I/O in a compact, automotive-qualified package. Its Cyclone III heritage provides designers with a low-power FPGA platform suitable for cost-sensitive, high-volume, and temperature-challenging applications.

This device is well suited for engineers building embedded control systems, automotive modules, or industrial interfaces who need verified qualification, dependable operating range, and flexible I/O without compromising PCB area or power budget. The result is a scalable, robust component that integrates into established FPGA development flows and yields long-term value for production designs.

Request a quote or submit an inquiry to get pricing, availability, and lead-time information for the EP3C10U256A7N. Our team can provide the details you need to evaluate this Cyclone III FPGA for your next design.

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