EP3C10U256A7N
| Part Description |
Cyclone® III Field Programmable Gate Array (FPGA) IC 182 423936 10320 256-LFBGA |
|---|---|
| Quantity | 181 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-UBGA (14x14) | Grade | Automotive | Operating Temperature | -40°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LFBGA | Number of I/O | 182 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 645 | Number of Logic Elements/Cells | 10320 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | AEC-Q100 | Total RAM Bits | 423936 |
Overview of EP3C10U256A7N – Cyclone® III FPGA, 256-LFBGA
The EP3C10U256A7N is a Cyclone III field-programmable gate array (FPGA) in a 256‑LFBGA package designed for applications that require a balance of configurable logic, on-chip memory, and robust I/O capability. As a Cyclone III device, it is positioned for low-power, cost-sensitive designs while providing the integration and flexibility of a programmable logic device.
Targeted for automotive and embedded markets, this device combines 10,320 logic elements, approximately 0.424 Mbits of embedded memory, and 182 user I/Os in a compact surface-mount package. It is qualified to AEC‑Q100 and rated for operation from −40 °C to 125 °C, making it suitable for temperature-challenging applications in the field.
Key Features
- Logic Capacity — 10,320 logic elements provide substantial programmable resources for glue logic, state machines, protocol handling, and custom datapaths.
- Embedded Memory — Approximately 0.424 Mbits of on-chip RAM for buffering, FIFOs, and small lookup tables to support data-intensive functions without external memory.
- I/O Capability — 182 user I/Os to support multiple parallel interfaces, sensor arrays, and board-level connectivity.
- Power and Supply — Operates from a core voltage range of 1.15 V to 1.25 V, aligning with low-power design goals.
- Package and Assembly — 256‑LFBGA (supplier package: 256‑UBGA, 14×14) in a surface-mount form factor for compact PCB layouts.
- Automotive Qualification — Grade: Automotive with AEC‑Q100 qualification, supporting use in automotive electronic systems.
- Wide Operating Temperature — Specified for −40 °C to 125 °C operation, suitable for harsh thermal environments.
- RoHS Compliant — Conforms to RoHS requirements for environmental compliance.
Typical Applications
- Automotive Electronics — Embedded control, sensor interfacing, and in-vehicle processing where AEC‑Q100 qualification and wide temperature range are required.
- Industrial Control — Motor control, PLC interfaces, and real-time I/O aggregation leveraging the device’s programmable logic and dense I/O count.
- Communications & Connectivity — Protocol bridging, custom interface logic, and timing adaptation using available logic and on-chip memory.
- Embedded Systems — Offload and accelerate custom datapaths, glue logic, and peripheral management in space-constrained, low-power designs.
Unique Advantages
- Automotive-ready qualification: AEC‑Q100 rating and automotive grade mean the device meets industry requirements for many in-vehicle designs.
- Compact, high-density package: 256‑LFBGA (14×14 UBGA) provides a small PCB footprint while delivering 182 user I/Os and 10,320 logic elements.
- On-chip memory for efficient designs: Approximately 0.424 Mbits of embedded RAM reduces dependence on external memory for buffering and small data stores.
- Wide operating temperature: −40 °C to 125 °C rating supports deployment in thermally challenging environments common to automotive and industrial applications.
- Low-voltage core operation: 1.15 V to 1.25 V supply range supports low-power system architectures and modern power-rail designs.
- Regulatory and environmental compliance: RoHS compliance simplifies use in regions and applications where lead-free components are required.
Why Choose EP3C10U256A7N?
The EP3C10U256A7N delivers a practical mix of programmable logic, embedded memory, and extensive I/O in a compact, automotive-qualified package. Its Cyclone III heritage provides designers with a low-power FPGA platform suitable for cost-sensitive, high-volume, and temperature-challenging applications.
This device is well suited for engineers building embedded control systems, automotive modules, or industrial interfaces who need verified qualification, dependable operating range, and flexible I/O without compromising PCB area or power budget. The result is a scalable, robust component that integrates into established FPGA development flows and yields long-term value for production designs.
Request a quote or submit an inquiry to get pricing, availability, and lead-time information for the EP3C10U256A7N. Our team can provide the details you need to evaluate this Cyclone III FPGA for your next design.

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