EP3C10U256C6

The EP3C10U256C6 is a Cyclone® III family FPGA from Intel, combining a mid-range logic capacity with low-power operation and flexible I/O for cost-sensitive, high-volume applications. It integrates 10,320 logic elements and a high I/O count in a compact 256-LFBGA surface-mount package, making it suitable for embedded control, interface bridging, and system integration tasks where power efficiency and integration matter.

Key Features

• Core logic — 10,320 logic elements and 645 LABs provide a balanced mid-range fabric for custom logic, glue-logic, and moderate compute tasks.
• On-chip memory — Approximately 0.424 Mbits of embedded memory (423,936 total RAM bits) to support buffering, state machines, and small data stores on-chip.
• I/O capacity — 182 user I/Os for broad interfacing to peripherals, sensors, and external logic domains.
• Power and supply — Core supply range of 1.15 V to 1.25 V enabling low-power operation consistent with the Cyclone III family’s low-power process optimizations.
• Package and mounting — 256-LFBGA (256-UBGA, 14 × 14 mm) surface-mount package for compact board layouts and reliable surface-mount assembly.
• Operating conditions — Commercial grade device rated for 0 °C to 85 °C operation and RoHS compliant for environmental regulation alignment.
• Family-level capabilities — Built on the Cyclone III architecture, which emphasizes low power, high functionality, and system integration features such as multiple PLLs and IP support (as described in Cyclone III family documentation).

Typical Applications

• Portable and battery-powered devices — Low-voltage core and Cyclone III family low-power characteristics help extend battery life in handheld and portable designs.
• Embedded control and glue logic — Mid-range logic density and embedded RAM support control algorithms, finite-state machines, and peripheral management.
• Interface bridging — High I/O count allows the FPGA to act as a flexible interface translator and aggregator between multiple digital subsystems.
• Consumer and industrial electronics — Commercial-grade temperature range and package size fit board-level integration for user interfaces, housekeeping, and I/O expansion tasks.

Unique Advantages

• Balanced logic and memory — 10,320 logic elements paired with approximately 0.424 Mbits of embedded memory provides the resources needed for mid-complexity designs without over-provisioning.
• High I/O density — 182 available I/Os reduce the need for external I/O expanders and simplify PCB routing for multi-device systems.
• Low-voltage, low-power operation — Core voltage range of 1.15 V–1.25 V supports power-sensitive designs aligned with Cyclone III low-power process optimizations.
• Compact surface-mount package — 256-LFBGA (14 × 14 mm) enables a small PCB footprint while maintaining robust connectivity for SMD assembly.
• Commercial-grade reliability — Rated for 0 °C to 85 °C operation and RoHS compliant for mainstream electronic products.
• Family ecosystem support — As part of the Cyclone III device family, the device benefits from established device-level features and documented IP and design flows described in Cyclone III materials.

Why Choose EP3C10U256C6?

The EP3C10U256C6 delivers a practical mix of programmable logic, embedded memory, and high I/O in a compact, surface-mount 256-LFBGA package—designed for developers who need mid-range FPGA capability with power-conscious operation. Its combination of 10,320 logic elements, approximately 0.424 Mbits of on-chip RAM, and 182 I/Os makes it well suited for embedded control, interface bridging, and cost-sensitive consumer or industrial applications within the commercial temperature range.

Choosing this Cyclone III device provides designers with a scalable, documented FPGA platform and the integration headroom to consolidate functions, reduce component count, and streamline PCB design while adhering to RoHS environmental requirements.

Request a quote or submit a purchase inquiry to evaluate EP3C10U256C6 for your next design and confirm availability and lead times.