EP3C10U256C7

IC FPGA 182 I/O 256UBGA
Part Description

Cyclone® III Field Programmable Gate Array (FPGA) IC 182 423936 10320 256-LFBGA

Quantity 637 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package256-UBGA (14x14)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LFBGANumber of I/O182Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs645Number of Logic Elements/Cells10320
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits423936

Overview of EP3C10U256C7 – Cyclone® III Field Programmable Gate Array (FPGA) 256-LFBGA

The EP3C10U256C7 is a Cyclone® III family FPGA in a 256-LFBGA package offering 10,320 logic elements and approximately 0.424 Mbits of embedded memory (423,936 bits). Designed for low-power, high-functionality, cost-sensitive applications, this device provides a balance of logic capacity, on-chip RAM, and I/O density for commercial-grade designs.

With 182 user I/Os, support for a broad set of I/O standards, integrated clock-management resources and a compact surface-mount package, the EP3C10U256C7 targets applications that require efficient integration, flexible interfacing, and low-voltage operation (1.15–1.25 V).

Key Features

  • Logic Capacity — 10,320 logic elements suitable for low- to mid-range FPGA functions and custom logic integration.
  • Embedded Memory — Approximately 0.424 Mbits of on-chip RAM (423,936 bits) to support buffering, state storage, and small lookup tables.
  • I/O Density and Flexibility — 182 user I/Os with support for multiple I/O standards, enabling diverse interface requirements and board-level connectivity.
  • Clock Management — Family-level clock features include multiple phase-locked loops (PLLs) for clock synthesis and management (Cyclone III family capability).
  • Low-Voltage Operation — Core supply range of 1.15 V to 1.25 V to support low-power system designs.
  • Package and Mounting — 256-LFBGA (supplier package: 256-UBGA, 14 × 14 mm) in a surface-mount format for compact board layouts.
  • Commercial Temperature Grade — Rated for 0 °C to 85 °C operation for standard commercial environments.
  • RoHS Compliant — Meets RoHS requirements for lead-free assembly and environmental compliance.
  • Design Ecosystem (family) — Cyclone III family features in the datasheet include low-power process technology, on-chip security and configuration options for applicable variants, and a library of family IP and the Nios II embedded processor option.

Typical Applications

  • Portable and Handheld Devices — Low-power family characteristics and compact package make the device suitable for battery-conscious portable applications that need programmable logic.
  • Consumer and Industrial Interfaces — Use for protocol bridging, user-interface control, and I/O expansion where diverse signal standards and 182 I/Os enable flexible connectivity.
  • Communications and Networking — Implement custom packet processing, interface logic, and clocking functions leveraging the device’s embedded memory and PLL resources.
  • Embedded Control and Prototyping — Mid-range logic capacity and on-chip RAM are appropriate for proof-of-concept, embedded controllers, and feature integration in commercial products.

Unique Advantages

  • Balanced Logic and Memory: 10,320 logic elements combined with roughly 0.424 Mbits of embedded RAM provide a compact platform for control, buffering, and stateful logic without external memory for many designs.
  • High I/O Count: 182 user I/Os accommodate multiple interfaces and reduce the need for external multiplexing or additional IO expanders.
  • Low-Voltage, Low-Power Operation: Core supply between 1.15 V and 1.25 V supports designs targeting reduced power consumption.
  • Compact Surface-Mount Package: 256-LFBGA (14 × 14 mm UBGA) supports dense PCB integration while maintaining a robust mounting style.
  • Commercial Temperature Range: Rated 0 °C to 85 °C for standard commercial deployments and product lifecycles.
  • RoHS Compliance: Suitable for lead-free assembly and environmentally conscious manufacturing processes.

Why Choose EP3C10U256C7?

The EP3C10U256C7 provides a practical combination of mid-range logic capacity, on-chip memory, and a high I/O count in a compact, surface-mount 256-LFBGA package. It is well suited for commercial designs that require programmable logic integration with low-voltage, low-power operation and flexible interfacing options.

As part of the Cyclone III family, this device benefits from family-level features documented in the datasheet—such as clock management and a portfolio of IP options—delivering a robust platform for cost-sensitive, high-functionality applications and rapid development cycles.

Request a quote or submit an inquiry to obtain pricing, availability, and lead-time information for the EP3C10U256C7 and to discuss how it fits your design requirements.

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