EP3C10U256C7
| Part Description |
Cyclone® III Field Programmable Gate Array (FPGA) IC 182 423936 10320 256-LFBGA |
|---|---|
| Quantity | 637 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-UBGA (14x14) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LFBGA | Number of I/O | 182 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 645 | Number of Logic Elements/Cells | 10320 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 423936 |
Overview of EP3C10U256C7 – Cyclone® III Field Programmable Gate Array (FPGA) 256-LFBGA
The EP3C10U256C7 is a Cyclone® III family FPGA in a 256-LFBGA package offering 10,320 logic elements and approximately 0.424 Mbits of embedded memory (423,936 bits). Designed for low-power, high-functionality, cost-sensitive applications, this device provides a balance of logic capacity, on-chip RAM, and I/O density for commercial-grade designs.
With 182 user I/Os, support for a broad set of I/O standards, integrated clock-management resources and a compact surface-mount package, the EP3C10U256C7 targets applications that require efficient integration, flexible interfacing, and low-voltage operation (1.15–1.25 V).
Key Features
- Logic Capacity — 10,320 logic elements suitable for low- to mid-range FPGA functions and custom logic integration.
- Embedded Memory — Approximately 0.424 Mbits of on-chip RAM (423,936 bits) to support buffering, state storage, and small lookup tables.
- I/O Density and Flexibility — 182 user I/Os with support for multiple I/O standards, enabling diverse interface requirements and board-level connectivity.
- Clock Management — Family-level clock features include multiple phase-locked loops (PLLs) for clock synthesis and management (Cyclone III family capability).
- Low-Voltage Operation — Core supply range of 1.15 V to 1.25 V to support low-power system designs.
- Package and Mounting — 256-LFBGA (supplier package: 256-UBGA, 14 × 14 mm) in a surface-mount format for compact board layouts.
- Commercial Temperature Grade — Rated for 0 °C to 85 °C operation for standard commercial environments.
- RoHS Compliant — Meets RoHS requirements for lead-free assembly and environmental compliance.
- Design Ecosystem (family) — Cyclone III family features in the datasheet include low-power process technology, on-chip security and configuration options for applicable variants, and a library of family IP and the Nios II embedded processor option.
Typical Applications
- Portable and Handheld Devices — Low-power family characteristics and compact package make the device suitable for battery-conscious portable applications that need programmable logic.
- Consumer and Industrial Interfaces — Use for protocol bridging, user-interface control, and I/O expansion where diverse signal standards and 182 I/Os enable flexible connectivity.
- Communications and Networking — Implement custom packet processing, interface logic, and clocking functions leveraging the device’s embedded memory and PLL resources.
- Embedded Control and Prototyping — Mid-range logic capacity and on-chip RAM are appropriate for proof-of-concept, embedded controllers, and feature integration in commercial products.
Unique Advantages
- Balanced Logic and Memory: 10,320 logic elements combined with roughly 0.424 Mbits of embedded RAM provide a compact platform for control, buffering, and stateful logic without external memory for many designs.
- High I/O Count: 182 user I/Os accommodate multiple interfaces and reduce the need for external multiplexing or additional IO expanders.
- Low-Voltage, Low-Power Operation: Core supply between 1.15 V and 1.25 V supports designs targeting reduced power consumption.
- Compact Surface-Mount Package: 256-LFBGA (14 × 14 mm UBGA) supports dense PCB integration while maintaining a robust mounting style.
- Commercial Temperature Range: Rated 0 °C to 85 °C for standard commercial deployments and product lifecycles.
- RoHS Compliance: Suitable for lead-free assembly and environmentally conscious manufacturing processes.
Why Choose EP3C10U256C7?
The EP3C10U256C7 provides a practical combination of mid-range logic capacity, on-chip memory, and a high I/O count in a compact, surface-mount 256-LFBGA package. It is well suited for commercial designs that require programmable logic integration with low-voltage, low-power operation and flexible interfacing options.
As part of the Cyclone III family, this device benefits from family-level features documented in the datasheet—such as clock management and a portfolio of IP options—delivering a robust platform for cost-sensitive, high-functionality applications and rapid development cycles.
Request a quote or submit an inquiry to obtain pricing, availability, and lead-time information for the EP3C10U256C7 and to discuss how it fits your design requirements.

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