EP3C10M164I7N

The EP3C10M164I7N is a Cyclone® III field programmable gate array (FPGA) IC from Intel designed for low-power, cost-sensitive applications. It integrates 10,320 logic elements and approximately 0.424 Mbits of embedded memory in a 164-TFBGA surface-mount package, delivering a compact programmable fabric for embedded and industrial designs.

With 106 user I/Os, an industrial operating temperature range of −40 °C to 100 °C, and a core voltage supply range of 1.15 V to 1.25 V, this device targets applications that require a balance of integration, configurable logic, and thermal robustness.

Key Features

• Core Architecture Cyclone III family FPGA architecture providing low-power operation and scalable logic capacity suitable for volume-conscious designs.
• Logic Capacity 10,320 logic elements for implementing custom logic, control functions, and glue-logic in a single device.
• Embedded Memory Approximately 0.424 Mbits of on-chip RAM for buffering, state storage, and small data structures.
• I/O 106 user I/Os to support a wide range of external interfaces and peripheral connections.
• Clock Management Cyclone III family devices include multiple PLL resources for robust clock synthesis and management (family-level feature).
• Power Supply Core voltage supply range of 1.15 V to 1.25 V for predictable power budgeting.
• Package & Mounting 164-TFBGA (supplier package: 164-MBGA 8×8) in a surface-mount form factor for compact board-level integration.
• Industrial Grade Qualified for operation from −40 °C to 100 °C, suitable for industrial environmental requirements.
• RoHS Compliant Meets RoHS environmental requirements.

Typical Applications

• Industrial Control Programmable logic for control, sequencing, and sensor interfacing where industrial temperature range and flexible I/O are required.
• Communications & Networking Protocol bridging, packet handling, and custom I/O implementations leveraging the device’s I/O count and clocking features.
• Embedded Systems Custom peripherals, glue logic, and small embedded processing subsystems that benefit from on-chip memory and reprogrammability.
• Data Acquisition & Instrumentation Frontend logic, timing control, and buffering for measurement systems that require deterministic, configurable hardware functions.

Unique Advantages

• Low-power family architecture: Based on Cyclone III technology optimized for reduced power consumption, helping meet constrained power budgets.
• Balanced integration: 10,320 logic elements and on-chip RAM combine to reduce external component count and simplify board design.
• Flexible I/O and clocking: 106 I/Os and family-level PLL resources support diverse interface needs and robust clock management.
• Industrial-temperature operation: Rated from −40 °C to 100 °C to support industrial deployments and thermally challenging environments.
• Compact package: 164-TFBGA surface-mount package enables high-density PCB integration while keeping solution size small.
• Standards compliance: RoHS-compliant construction for environmental regulation alignment.

Why Choose EP3C10M164I7N?

The EP3C10M164I7N positions itself as a practical, industrial-grade Cyclone III FPGA option for engineers who need a balance of programmable logic density, on-chip memory, and flexible I/O in a compact surface-mount package. Its specified core voltage range and extended operating temperature make it suitable for production designs that must operate reliably across industrial environments.

Designed within the Cyclone III family, this device benefits from an established ecosystem of device documentation, design flows, and family-level features such as integrated clock management and available embedded processing IP, helping accelerate development and reduce time to market.

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