EP3C10F256I7N

The EP3C10F256I7N is an Intel Cyclone® III field-programmable gate array (FPGA) packaged in a 256-ball BGA intended for industrial applications. It combines mid-range logic density with on-chip memory and a high I/O count to address cost-sensitive, low-power system designs.

Targeted use cases include portable and battery-powered products, thermally-challenged systems, and embedded control platforms that require moderate logic capacity, flexible I/O, and industrial temperature operation.

Key Features

• Logic and Memory — 10,320 logic elements and approximately 0.42 Mbits (423,936 bits) of embedded RAM provide balanced resources for mid-range designs.
• I/O Capacity — 182 user I/O pins support complex system interfaces and peripheral connections while enabling flexible board-level routing.
• Clocking — Family-level clock management includes four phase-locked loops (PLLs) with five outputs per PLL, enabling robust clock synthesis and distribution for multiple domains.
• I/O Standards & Signal Integrity — Supports a wide range of I/O standards listed for the Cyclone III family (for example LVTTL, LVCMOS, SSTL, HSTL, PCI, LVDS variants and others) and includes features such as adjustable I/O slew rates and on-chip termination calibration to maintain signal integrity across PVT variations.
• Power — Built on a low-power process and designed for reduced static power; nominal core voltage specified at 1.15 V to 1.25 V for predictable power budgeting.
• Package & Mounting — 256-LBGA package (supplier device package listed as 256-FBGA 17×17) in a surface-mount form factor for compact board integration.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C to meet harsher-environment deployment requirements.
• System Reliability Features (family) — Cyclone III family documentation includes on-chip resources such as PLL cascade capability and memory/logic integration intended to support reliable system functions and remote upgrade scenarios.
• Compliance — RoHS-compliant device.

Typical Applications

• Portable and Handheld Devices — Low-power Cyclone III family characteristics help extend battery life for portable controllers and data-acquisition modules.
• Industrial Control — Industrial temperature rating and 182 I/Os make the device suitable for motor control, sensor aggregation, and machine-interface logic in factory automation.
• Embedded Processing and Custom Logic — Mid-range logic density and embedded RAM enable glue logic, protocol bridging, and offload functions in embedded systems.
• Test and Measurement — Flexible I/O standards and PLL-based clock management allow implementation of custom interfacing and timed acquisition across mixed-signal test systems.

Unique Advantages

• Balanced mid-range resources: 10,320 logic elements and ~0.42 Mbits of embedded memory provide an efficient datapath for control, interface, and glue-logic implementations without overprovisioning.
• High I/O count: 182 user I/Os let designers consolidate multiple interfaces on a single device, reducing external components and PCB complexity.
• Industrial robustness: −40 °C to 100 °C rating and surface-mount BGA packaging support deployment in demanding environments.
• Predictable power envelope: Core voltage specified at 1.15–1.25 V and family low-power optimizations help with thermal and power budgeting in constrained systems.
• Flexible clocking: Multiple PLLs with cascaded and reconfigurable options simplify multi-clock domain designs and timing management.
• Signal-integrity features: Adjustable I/O slew rates and on-chip termination calibration help maintain reliable high-speed interfaces across process, voltage, and temperature variations.

Why Choose EP3C10F256I7N?

The EP3C10F256I7N positions itself as a practical, mid-density Cyclone III FPGA option for designers who need an efficient mix of logic, embedded memory, and I/O without the complexity of higher-density families. Its combination of approximately 10k logic elements, substantial on-chip RAM, multiple PLLs, and 182 I/Os makes it well suited for embedded control, interface consolidation, and portable or industrial applications where power, integration, and thermal performance matter.

Backed by Cyclone III family capabilities, this device offers a scalable path for designs that may require modest logic growth while leveraging established FPGA tool flows and IP resources for development and long-term support.

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