EP3C10F256C8N

The EP3C10F256C8N is a Field Programmable Gate Array (FPGA) from the Intel Cyclone® III device family. It combines a mid-range logic density with on-chip embedded memory and flexible I/O, designed for high-volume, low-power, cost-sensitive applications.

This device provides 10,320 logic elements, approximately 0.424 Mbits of embedded memory (423,936 bits), and 182 user I/Os in a 256‑LBGA package. It operates from a 1.15 V to 1.25 V supply and is rated for commercial temperature operation (0 °C to 85 °C); the device is RoHS compliant and intended for surface-mount assembly.

Key Features

• Core and Logic Density  10,320 logic elements provide mid-range programmable logic capacity suitable for a wide range of system functions.
• Embedded Memory  Approximately 0.424 Mbits of on-chip RAM (423,936 bits) for data buffering, FIFOs, and small embedded storage.
• I/O Count and Flexibility  182 user I/Os support broad system connectivity. Cyclone III family devices provide support for many industry I/O standards to simplify interfacing.
• Clock Management  Family-level clock resources include multiple phase-locked loops (PLLs) with multi-output capability, enabling robust clock synthesis and distribution.
• Low-Power Platform  Built on a TSMC low-power (LP) process with silicon and software optimizations for reduced static power consumption.
• Package and Mounting  256‑LBGA package (supplier device package: 256‑FBGA, 17×17) designed for surface-mount PCB assembly.
• Voltage and Temperature  Operates from 1.15 V to 1.25 V and rated for commercial operation from 0 °C to 85 °C.
• Regulatory Compliance  RoHS compliant.

Typical Applications

• Portable and Handheld Devices  Low-power characteristics make the device suitable for battery-powered equipment where extended run time is important.
• High‑Volume Consumer Electronics  Mid-range logic density and cost-sensitive Cyclone III architecture fit consumer products requiring integration and low power.
• Embedded System Integration  On-chip memory and programmable logic enable custom interfaces, glue logic, and embedded processing functions.
• I/O-Constrained Designs  High I/O count supports systems that require multiple external interfaces and signal routing options.

Unique Advantages

• Highly integrated mid-range FPGA: 10,320 logic elements and on-chip RAM reduce external components and simplify board-level design.
• Power-efficient silicon: TSMC low-power process and family-level power-aware optimizations help lower static power for thermally constrained designs.
• Flexible clocking: Multiple PLLs with multiple outputs and dynamic reconfiguration options improve timing architecture and enable complex clock domains.
• Broad interface support: 182 I/Os and Cyclone III I/O capabilities accommodate diverse signaling standards and peripheral connections.
• Commercial-grade availability: Designed for 0 °C to 85 °C operation and RoHS compliance for mainstream electronic product development.
• Ecosystem support: Family-level support for pre-built IP and development tools streamlines integration and shortens development time.

Why Choose EP3C10F256C8N?

The EP3C10F256C8N positions itself as a practical, cost-conscious FPGA option within the Cyclone III family, offering a balance of logic capacity, embedded memory, and I/O density for mid-range designs. Its low-power process and family-level clocking and I/O features make it suitable for applications where energy efficiency, integration, and flexible interfacing are important.

This device is a good fit for engineering teams building portable, consumer, or embedded systems that require a programmable logic element with commercial-temperature operation, RoHS compliance, and support from the Cyclone III ecosystem of IP and development tools.

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