EP3C10F256C7N
| Part Description |
Cyclone® III Field Programmable Gate Array (FPGA) IC 182 423936 10320 256-LBGA |
|---|---|
| Quantity | 617 Available (as of May 26, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 182 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 645 | Number of Logic Elements/Cells | 10320 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 423936 |
Overview of EP3C10F256C7N – Cyclone® III FPGA, 10,320 logic elements, 256-LBGA
The EP3C10F256C7N is a Cyclone® III Field Programmable Gate Array (FPGA) optimized for low-power, cost-sensitive commercial applications. As part of the Cyclone III device family, it combines a mid-range logic capacity with embedded memory and a high I/O count to support compact, integrated system designs.
This device is targeted at high-volume, low-power applications where efficient integration, flexible I/O and modest embedded memory are required. It offers a balance of programmable logic, on-chip RAM and clock management features suitable for consumer, communications and embedded-control designs.
Key Features
- Logic Capacity – 10,320 logic elements for implementing moderate-complexity digital functions and custom logic blocks.
- Embedded Memory – Approximately 0.424 Mbits of on-chip RAM to support buffering, FIFOs and small data stores.
- I/O Density – 182 user I/O pins to accommodate parallel interfaces, multiple peripherals and board-level connectivity.
- Low-Power Architecture – Cyclone III family optimizations and TSMC low-power process technology reduce static power for battery-powered and thermally constrained applications.
- Clock Management – Family-level support for up to four PLLs enables robust clock synthesis and distribution for I/O interfaces and system clocks.
- Supply and Operating Range – Core voltage supply 1.15 V to 1.25 V; commercial operating temperature range 0 °C to 85 °C.
- Package & Mounting – 256-LBGA package (supplier device package listed as 256-FBGA 17×17) with surface-mount mounting for compact PCB designs.
- Compliance – RoHS compliant.
Typical Applications
- Portable and Handheld Electronics – Low-power operation and modest logic/memory make this device well suited for battery-aware portable designs requiring custom logic and interface control.
- Communications and Networking – High I/O count and clock-management features support protocol bridging, packet buffering and interface adaptation in mid-range network equipment.
- Instrumentation and Test Equipment – Programmable logic and on-chip RAM enable custom measurement logic, data capture buffering and control tasks in benchtop instruments.
- Embedded Control and User Interfaces – Implement control state machines, peripheral interfaces and display/user interface functions while keeping board area compact with the 256-LBGA package.
Unique Advantages
- Highly integrated mid-range FPGA: 10,320 logic elements and embedded memory reduce external component count and simplify system architecture.
- Generous I/O capability: 182 user I/Os accommodate multiple parallel interfaces and help minimize external multiplexing or I/O expanders.
- Low-power family design: Cyclone III’s low-power process and power-aware features support lower static power budgets for portable and thermally constrained products.
- Compact package: 256-LBGA / 256-FBGA (17×17) mounting allows for space-efficient PCB layouts in compact commercial equipment.
- Clocking flexibility: Up to four PLLs per device provide the clock synthesis and phase control needed for diverse timing domains and interface requirements.
- Commercial temperature rating: Rated for 0 °C to 85 °C to match typical commercial electronic product environments.
Why Choose EP3C10F256C7N?
The EP3C10F256C7N positions itself as a balanced, low-power FPGA option for commercial designs that require moderate logic resources, a substantial I/O complement and embedded memory in a compact package. It is suitable for teams building cost-sensitive, high-volume products where power efficiency and integration reduce BOM and board complexity.
Backed by the Cyclone III device family feature set—including low-power process benefits, clock management resources and a library of family-level IP—this device supports scalable designs and streamlined development for commercial embedded systems and consumer applications.
Request a quote or submit an inquiry for pricing and availability of EP3C10F256C7N to move your design forward.

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