EP3C10F256I7

The EP3C10F256I7 is a Cyclone III family FPGA in a 256-pin BGA package designed for industrial applications that require a balance of integration, low power, and cost efficiency. This device provides 10,320 logic elements, approximately 0.42 Mbits of embedded memory, and 182 user I/Os to address mid-range logic, memory, and I/O requirements.

Built on the Cyclone III architecture and optimized for low-power operation, the device is suited to high-volume, cost-sensitive designs and thermally-challenged environments where reliable operation from −40°C to 100°C is required. It supports a narrow core supply range (1.15 V to 1.25 V) and is RoHS compliant.

Key Features

• FPGA Core Cyclone III architecture offering a mid-range density with 10,320 logic elements for programmable logic and control functions.
• Embedded Memory Approximately 0.42 Mbits of on-chip RAM to implement buffers, FIFOs, and small data stores without external memory.
• I/O Capacity and Standards 182 device I/Os provide flexible connectivity; the Cyclone III family supports a wide range of I/O standards including LVTTL, LVCMOS, SSTL, HSTL, PCI, PCI‑X, LVPECL, BLVDS, LVDS, mini‑LVDS, RSDS, and PPDS.
• Clock Management Family-level clocking features include up to four phase-locked loops (PLLs) per device, supporting multiple clock domains and dynamic reconfiguration for phase and frequency adjustments.
• Low-Power Technology Based on TSMC low-power (LP) process technology and Cyclone III silicon optimizations to minimize static power consumption for battery-conscious or thermally-limited designs.
• Package and Mounting Surface-mount 256-LBGA package (supplier package listed as 256-FBGA, 17×17) for compact PCB integration.
• Industrial Temperature Range Rated for operation from −40°C to 100°C, suitable for industrial environments.
• Supply Voltage Core voltage range of 1.15 V to 1.25 V to match system power rails and device requirements.
• Compliance RoHS compliant for environmental and regulatory alignment.

Typical Applications

• Portable and Handheld Devices Low-power Cyclone III technology helps extend battery life and reduce cooling requirements in portable designs.
• High-Volume, Cost-Sensitive Products Mid-range logic density and on-chip memory make the device suitable for designs where cost and integration matter.
• I/O-Constrained Systems High I/O count supports applications that require multiple interfaces or dense peripheral connectivity.
• Industrial Control and Monitoring Industrial temperature rating and surface-mount BGA package enable deployment in factory automation and process-control equipment.

Unique Advantages

• Balanced Integration: Combines 10,320 logic elements and embedded RAM to reduce reliance on external components and simplify board-level design.
• Low-Power Operation: TSMC LP process and family-level power optimizations reduce static power draw, benefiting battery-powered and thermally-limited systems.
• Flexible Clocking: Multiple PLLs with dynamic reconfiguration capability allow robust clock domain management and on-the-fly adjustments without full device reconfiguration.
• Broad I/O Support: Support for a wide range of industry-standard I/O levels enables easy interfacing with legacy and modern peripherals.
• Industrial Readiness: Rated for −40°C to 100°C operation and supplied in a compact BGA package for durable, space-efficient deployment.
• Regulatory Alignment: RoHS compliance simplifies environmental compliance in production and distribution.

Why Choose EP3C10F256I7?

The EP3C10F256I7 offers a practical mid-range Cyclone III FPGA option when you need a combination of programmable logic, embedded memory, and a high I/O count in an industrial-temperature, RoHS-compliant package. Its low-power heritage and family-level clocking and I/O capabilities make it a solid fit for designers targeting cost-sensitive, space-constrained, or thermally-challenged applications.

This device is well suited to engineering teams and procurement groups looking for a field-programmable solution that balances integration and reliability while minimizing external components and power overhead.

Request a quote or submit a procurement inquiry to receive pricing, lead-time, and availability information for EP3C10F256I7.