EP3C10F256C7

The EP3C10F256C7 is a Cyclone® III family FPGA offered in a 256-LBGA package for surface-mount board designs. It delivers 10,320 logic elements and approximately 0.4 Mbits of embedded memory (423,936 bits), making it suitable for medium-density programmable logic implementations in cost- and power-sensitive designs.

Designed with the Cyclone III device family characteristics, the device targets high-volume, low-power, and cost-sensitive market segments where a balance of logic, memory, and I/O is required. Key system-level advantages include low-voltage operation and a commercial temperature grade for mainstream embedded and consumer applications.

Key Features

• Logic Capacity — 10,320 logic elements provide the resources needed for medium-density FPGA designs and custom logic implementation.
• Embedded Memory — Approximately 0.4 Mbits of on-chip RAM (423,936 bits) for buffering, FIFOs, and small on-chip data storage.
• I/O Density — 182 user I/Os to support multiple interfaces and board-level connectivity without external I/O expanders.
• Low-Voltage Core — Operates from 1.15 V to 1.25 V, supporting low-power system architectures and power-managed designs.
• Clock Management — Cyclone III family features such as integrated PLLs support flexible clocking and frequency synthesis for common interface and timing needs.
• Package & Mounting — 256-LBGA package (supplier device package listed as 256-FBGA 17×17) in a surface-mount form factor for compact PCB designs.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operation and specified as commercial grade for mainstream applications.
• Family-Level Low-Power Design — Based on the Cyclone III family optimizations for low power, making it suitable for battery-powered and thermally constrained systems.

Typical Applications

• Portable and Handheld Devices — Low-voltage operation and Cyclone III low-power characteristics help extend battery life in mobile and handheld systems.
• Consumer Electronics — Medium-density logic and on-chip memory enable user-interface control, signal processing, and peripheral aggregation in consumer products.
• Communications and Networking — High I/O count and integrated clock management support common interface tasks and board-level protocol bridging.
• Embedded Systems and Prototyping — Balanced logic-to-memory ratio and family support for embedded processor IP make the device useful for custom embedded logic and proof-of-concept designs.

Unique Advantages

• Balanced Logic and Memory: 10,320 logic elements paired with approximately 0.4 Mbits of embedded RAM provide a practical mix for mid-range designs without excessive external memory.
• High I/O Count: 182 user I/Os reduce reliance on external expanders and simplify interface routing on compact PCBs.
• Low-Voltage Operation: 1.15 V–1.25 V core supply supports low-power system architectures and assists in meeting tight power budgets.
• Compact Surface-Mount Package: 256-LBGA (256-FBGA 17×17) enables dense board layouts while retaining accessible I/O counts.
• Commercial Temperature and Grade: Specified 0 °C to 85 °C operation and commercial grade classification for mainstream embedded and consumer applications.
• Backed by Cyclone III Family Capabilities: Family-level features such as low-power optimizations and integrated clock management support accelerate system-level design decisions.

Why Choose EP3C10F256C7?

The EP3C10F256C7 positions itself as a cost- and power-aware mid-density FPGA option within the Cyclone III family. With 10,320 logic elements, a substantial on-chip memory footprint, and 182 I/Os in a compact 256-LBGA package, it suits projects that need a pragmatic balance of integration, I/O capability, and power efficiency.

Designers targeting high-volume, low-power, and cost-sensitive products will find this device appropriate for applications that require reliable commercial-grade operation and access to the Cyclone III family ecosystem of IP and design resources.

Request a quote or submit a purchase inquiry to evaluate EP3C10F256C7 for your next design project.