EP3C10E144I7N

The EP3C10E144I7N is an Intel Cyclone® III field-programmable gate array (FPGA) in a 144-LQFP exposed-pad package. It delivers a moderate-density programmable fabric with 10,320 logic elements and embedded memory targeted at low-power, cost-sensitive designs.

Built on the Cyclone III device family foundation, the device is optimized for low-power operation and system integration, and is offered in an industrial-grade variant with a wide operating temperature range and surface-mount packaging suitable for production assemblies.

Key Features

• Logic Capacity  Provides 10,320 logic elements for implementing combinational and sequential logic in medium-complexity designs.
• Embedded Memory  Approximately 0.424 Mbits of on-chip RAM (423,936 total RAM bits) for buffers, FIFOs, and small on-chip data storage.
• I/O Count and Standards  94 user I/Os to support a variety of external interfaces; Cyclone III family supports a wide range of I/O standards to match system signaling requirements.
• Clock Management  Family-level clocking resources include multiple PLLs for robust clock synthesis and distribution in system designs.
• Power and Supply  Operates from a core supply range of 1.15 V to 1.25 V and is designed with low-power process technology to help meet strict power budgets.
• Package and Mounting  144-LQFP exposed-pad package (surface mount); supplier device package listed as 144-EQFP (20 × 20) for PCB footprint planning.
• Industrial Temperature and Compliance  Industrial-grade device rated for operation from −40 °C to 100 °C and RoHS compliant.

Typical Applications

• Portable and handheld devices  Low-power characteristics make the device appropriate for designs where battery life and thermal constraints are important.
• I/O-constrained embedded systems  High I/O count and flexible I/O standard support suit applications that require diverse peripheral interfaces and board-level integration.
• High-volume, cost-sensitive products  Cyclone III family positioning for low cost and efficient silicon utilization aligns with production-focused designs.
• Industrial control and instrumentation  Industrial temperature rating and surface-mount LQFP packaging enable deployment in thermally and mechanically demanding environments.

Unique Advantages

• Low-power silicon: Leveraging Cyclone III low-power process technology and a 1.15–1.25 V core supply reduces static and dynamic power for energy-conscious designs.
• Balanced logic and memory: 10,320 logic elements combined with approximately 0.424 Mbits of embedded RAM provides a compact, integrated solution for typical mid-range FPGA use cases.
• Flexible I/O capability: Ninety-four I/Os and family support for many I/O standards make it easier to interface with a broad range of peripherals and board-level signals.
• Robust clocking options: Cyclone III family clock-management resources (multiple PLLs) allow flexible clock synthesis and distribution without external components.
• Production-ready package: 144-LQFP exposed-pad surface-mount package simplifies thermal management and PCB assembly for volume production.
• Industrial operating range: −40 °C to 100 °C rating and RoHS compliance support deployment in industrial applications and modern supply chains.

Why Choose EP3C10E144I7N?

The EP3C10E144I7N combines Cyclone III family low-power design and mid-range programmable capacity in a production-friendly 144-LQFP exposed-pad package. It is well suited to designers who need a balance of logic density, embedded memory, and flexible I/O in an industrial-temperature device.

For teams targeting cost-sensitive, energy-aware, or I/O-rich embedded systems, this FPGA delivers a compact integration point with the Cyclone III family feature set to support scalable designs and predictable system behavior.

Request a quote or submit an inquiry to get pricing and availability for the EP3C10E144I7N and to discuss volume or production timelines.