EP3C10E144C7N
| Part Description |
Cyclone® III Field Programmable Gate Array (FPGA) IC 94 423936 10320 144-LQFP Exposed Pad |
|---|---|
| Quantity | 1,040 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 144-EQFP (20x20) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP Exposed Pad | Number of I/O | 94 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 645 | Number of Logic Elements/Cells | 10320 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 423936 |
Overview of EP3C10E144C7N – Cyclone® III FPGA, 10,320 logic elements, 94 I/Os, 144‑LQFP
The EP3C10E144C7N is a Cyclone III field programmable gate array (FPGA) in a 144‑lead LQFP exposed‑pad package, designed for commercial applications that require a balance of functionality and low power. Built on the Cyclone III device family, it targets high‑volume, cost‑sensitive designs that benefit from integrated logic, on‑chip memory and flexible I/O.
This device provides 10,320 logic elements and approximately 0.42 Mbits of embedded memory, supporting designs that need moderate logic density, significant embedded RAM, and up to 94 user I/Os in a surface‑mount 144‑LQFP package.
Key Features
- Logic Capacity — 10,320 logic elements to implement mid‑range FPGA functions and custom logic.
- Embedded Memory — Approximately 0.42 Mbits of on‑chip RAM for data buffering, FIFOs, and small lookup tables.
- I/O Resources — 94 user I/Os with support for a wide range of industry I/O standards, enabling flexible board‑level interfacing.
- Clocking and PLLs — Family‑level support for multiple phase‑locked loops: four PLLs per device with five outputs per PLL; PLLs are cascadable and dynamically reconfigurable for robust clock management.
- Low‑Power Technology — Based on TSMC low‑power (LP) process technology and Cyclone III low‑power design optimizations to help meet strict power budgets.
- Supply and Temperature — Core voltage range 1.15 V to 1.25 V; commercial operating temperature 0 °C to 85 °C.
- Package and Mounting — Surface‑mount 144‑LQFP exposed pad (supplier package 144‑EQFP, 20×20 mm) to simplify PCB placement and thermal conduction.
- Compliance — RoHS compliant; specified as commercial grade.
Typical Applications
- Portable and handheld devices — Low‑power Cyclone III technology helps extend battery life for portable applications while providing necessary logic and memory resources.
- High‑volume consumer electronics — Mid‑range logic density and cost‑sensitive packaging make this device suitable for mass production designs that require programmable logic integration.
- I/O‑constrained systems — Up to 94 I/Os and support for many I/O standards enable flexible interfacing for sensor hubs, user interfaces, and peripheral aggregation.
- Clock‑managed subsystems — Multiple PLLs and dynamic reconfiguration capability support complex clocking schemes for data‑path and interface timing.
Unique Advantages
- Balanced mid‑range capability: 10,320 logic elements and on‑chip RAM provide the right mix of resources for moderate complexity designs without excess cost.
- Power‑efficient architecture: TSMC low‑power process and Cyclone III power optimizations reduce static and dynamic power consumption for thermally constrained designs.
- Flexible clocking: Four PLLs with multiple outputs and dynamic reconfiguration let you manage and synthesize clocks on‑chip, simplifying board design.
- Wide I/O support: High I/O count and family‑level support for many industry standards ease integration with a broad range of peripherals and signaling requirements.
- Compact surface‑mount package: 144‑LQFP exposed pad delivers a small footprint with improved thermal conduction for PCB integration.
- RoHS compliant commercial grade: Meets environmental compliance requirements for many consumer and commercial products.
Why Choose EP3C10E144C7N?
The EP3C10E144C7N is positioned as a practical Cyclone III FPGA choice for engineers seeking a cost‑sensitive, low‑power programmable logic device with moderate logic capacity and embedded memory. Its combination of 10,320 logic elements, approximately 0.42 Mbits of on‑chip RAM, multiple PLLs, and flexible I/O makes it suitable for a wide range of commercial applications where power, integration, and board space are key considerations.
Designed within the Cyclone III family, this device benefits from family‑level features such as low‑power process technology and extensive clocking resources, providing a scalable path for designs that may evolve across device densities within the same family.
Request a quote or submit a procurement inquiry to start evaluation and ordering of EP3C10E144C7N for your next design.

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