EP3C10E144C7

The EP3C10E144C7 is a Cyclone® III family field programmable gate array (FPGA) IC from Intel, providing 10,320 logic elements in a compact 144-LQFP exposed-pad package. It is targeted at designs that require moderate logic density, on-chip memory, and flexible I/O in a commercial-temperature, surface-mount form factor.

As part of the Cyclone III device family, this device leverages family-level optimizations for low power and system integration while offering on-chip memory and clock-management capabilities suitable for cost-sensitive and high-volume applications.

Key Features

• Logic Capacity 10,320 logic elements and 645 CLBs provide the programmable fabric for state machines, glue logic, and moderate-density processing tasks.
• Embedded Memory Approximately 0.424 Mbits of on-chip RAM for buffering, FIFOs, and small data structures without external memory.
• I/O Resources 94 I/O pins to support multiple interfaces and sensor or peripheral connections in I/O-constrained designs.
• Power Supply Core voltage supply range of 1.15 V to 1.25 V to match low-voltage system requirements.
• Package & Mounting 144-LQFP with exposed pad (supplier package: 144-EQFP 20×20), surface-mount mounting type for PCB integration and thermal dissipation through the exposed pad.
• Operating Range Commercial-grade operating temperature of 0 °C to 85 °C for standard environmental conditions.
• RoHS Compliance Device is RoHS-compliant to support lead-free assembly and global manufacturing requirements.
• Cyclone III Family Characteristics Family-level features include low-power silicon optimizations, multiple PLLs for clock management, and a library of pre-built IP; these ecosystem elements are available for Cyclone III devices.

Typical Applications

• Portable and Handheld Devices Use on-chip memory and low-voltage operation to extend battery life and reduce external component count in compact systems.
• Consumer Electronics Implement user-interface control, signal conditioning, and peripheral bridging where moderate logic capacity and plentiful I/O are required.
• Communications and Edge Equipment Provide protocol glue logic, buffering, and timing functions using available RAM and clock-management resources.
• Embedded Control and Instrumentation Implement control logic, finite-state machines, and small data-path processing without adding external processors for many control tasks.

Unique Advantages

• Balanced Logic and Memory: 10,320 logic elements combined with approximately 0.424 Mbits of embedded memory enables compact implementations of control, buffering, and stateful logic without large external memory.
• Flexible I/O Count: Ninety-four I/Os allow multiple peripheral interfaces and sensor connections while minimizing additional interface chips.
• Compact, Thermally-Aware Package: 144-LQFP with an exposed pad supports surface-mount assembly and aids thermal conduction to the PCB for reliable operation.
• Low-Voltage Core: 1.15–1.25 V core supply supports low-power designs and helps reduce overall system power consumption.
• Commercial Temperature Range: Rated 0 °C to 85 °C for standard commercial applications and environments.
• RoHS Compliance: Simplifies manufacturing into lead-free production flows and global supply chains.

Why Choose EP3C10E144C7?

The EP3C10E144C7 delivers a practical balance of programmable logic, embedded memory, and I/O in a package suited for surface-mount assembly. Its Cyclone III family heritage brings power-aware design optimizations and access to family-level IP and development resources, helping teams accelerate time-to-market for mid-density applications.

This device is well-suited for designers and procurement teams developing cost-sensitive, compact systems—where moderate logic density, on-chip RAM, and a robust I/O count are required—while relying on the Cyclone III ecosystem for IP, clock management, and development support.

Request a quote or submit an inquiry for pricing and availability for EP3C10E144C7 to evaluate it for your next design.