EP2SGX90FF1508I4N
| Part Description |
Stratix® II GX Field Programmable Gate Array (FPGA) IC 650 4520448 90960 1508-BBGA, FCBGA |
|---|---|
| Quantity | 387 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1508-FBGA, FC (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1508-BBGA, FCBGA | Number of I/O | 650 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4548 | Number of Logic Elements/Cells | 90960 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4520448 |
Overview of EP2SGX90FF1508I4N – Stratix® II GX Field Programmable Gate Array (FPGA) IC 650 I/O, ~4.52 Mbits RAM, 90,960 Logic Elements, 1508-BBGA
The EP2SGX90FF1508I4N is a Stratix® II GX family FPGA providing a high-performance, scalable logic array with advanced on-chip memory and transceiver technology. Built for demanding communications and high-speed interface designs, the device combines a large logic capacity with abundant I/O and on-chip RAM to handle complex, data-intensive applications.
With support for industrial temperature operation and a compact 1508-BBGA FCBGA package, this surface-mount FPGA targets system designs that require dense integration, flexible I/O, and the Stratix II GX feature set such as high-speed serial transceivers, TriMatrix memory, and dedicated DSP resources.
Key Features
- Logic Capacity — Approximately 90,960 logic elements for implementing complex gate-level and control logic.
- Embedded Memory — Approximately 4.52 Mbits of on-chip RAM (TriMatrix memory architecture) to support dual-port memory and FIFO buffers for high-performance data buffering and packet handling.
- High-Speed Transceivers (Series Capability) — Stratix II GX family transceivers support serial data rates from 600 Mbps up to 6.375 Gbps per channel, suitable for high-speed backplane and chip-to-chip links; dynamic programmability and adaptive equalization are supported at the family level.
- Dedicated DSP Resources — High-speed DSP blocks are available in the Stratix II GX architecture for multipliers and MAC operations, enabling accelerated signal processing and filtering functions.
- Clocking and PLLs — Up to four enhanced PLLs per device in the Stratix II GX family provide programmable bandwidth, spread-spectrum, clock switch-over, and real-time reconfiguration capabilities.
- I/O and Interfaces — 650 I/O pins enable broad external connectivity and support for numerous single-ended and differential I/O standards (family-level support).
- Power and Supply — Core voltage supply range 1.15 V to 1.25 V, suitable for system designs targeting the Stratix II GX power profile.
- Package and Mounting — 1508-BBGA (FCBGA) package; supplier package reported as 1508-FBGA, FC (40×40); surface-mount device for compact board-level integration.
- Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for use in industrial environments.
- Security and Configuration (Family Features) — Stratix II GX device family supports configuration bitstream encryption and remote configuration updates (family-level capabilities).
- RoHS Compliant — Device meets RoHS environmental requirements.
Typical Applications
- High-Speed Networking and Telecom Equipment — Implements protocol bridging, packet processing, and line-rate interfaces using the family’s high-speed serial transceiver capabilities and large logic fabric.
- Backplane and Chip-to-Chip Interfaces — Enables high-bandwidth backplane links and board-to-board communication leveraging multi-gigabit transceiver support.
- Signal Processing and DSP Systems — Uses embedded DSP blocks and on-chip RAM for FIR filters, MAC-heavy algorithms, and media processing pipelines.
- High-Performance Embedded Systems — Combines abundant logic elements, memory, and I/O to implement complex SoC glue logic, custom accelerators, and control planes in industrial systems.
Unique Advantages
- Large Logic and Memory Integration: Approximately 90,960 logic elements and ~4.52 Mbits of embedded memory reduce the need for external logic and RAM, simplifying board design.
- High I/O Count for Dense Connectivity: 650 I/O pins provide flexibility to interface with multiple external devices, memory, and high-speed peripherals.
- Stratix II GX Transceiver Technology: Family-level support for up to 6.375 Gbps serial links, dynamic reconfiguration, and adaptive equalization enables robust high-speed link design options.
- Industrial Temperature Rating: −40 °C to 100 °C operation supports deployment in industrial environments where extended thermal range is required.
- Compact FCBGA Package: 1508-BBGA (FCBGA) provides a high-pin-count, surface-mount footprint for space-constrained, high-density PCBs.
- Design Security and Update Options: Family-level support for configuration encryption and remote updates helps protect IP and enables field reconfiguration workflows.
Why Choose EP2SGX90FF1508I4N?
EP2SGX90FF1508I4N positions itself as a high-capacity Stratix II GX FPGA optimized for systems requiring a balance of large logic resources, substantial on-chip memory, and extensive I/O. The device’s family heritage provides access to advanced transceiver features, TriMatrix memory architecture, DSP blocks, and flexible clocking needed for demanding communications and signal-processing applications.
This FPGA suits designers building networking, telecom, and high-performance embedded systems who need a robust, industrial-temperature device in a compact FCBGA package. The combination of logic density, memory, I/O, and family-level transceiver and IP capabilities delivers a scalable platform for long-term designs.
Request a quote or submit an inquiry to obtain pricing and availability for EP2SGX90FF1508I4N. Provide your project details and quantity requirements to receive a tailored response.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018