EP2SGX90FF1508I4N

IC FPGA 650 I/O 1508FBGA
Part Description

Stratix® II GX Field Programmable Gate Array (FPGA) IC 650 4520448 90960 1508-BBGA, FCBGA

Quantity 387 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1508-FBGA, FC (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1508-BBGA, FCBGANumber of I/O650Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4548Number of Logic Elements/Cells90960
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4520448

Overview of EP2SGX90FF1508I4N – Stratix® II GX Field Programmable Gate Array (FPGA) IC 650 I/O, ~4.52 Mbits RAM, 90,960 Logic Elements, 1508-BBGA

The EP2SGX90FF1508I4N is a Stratix® II GX family FPGA providing a high-performance, scalable logic array with advanced on-chip memory and transceiver technology. Built for demanding communications and high-speed interface designs, the device combines a large logic capacity with abundant I/O and on-chip RAM to handle complex, data-intensive applications.

With support for industrial temperature operation and a compact 1508-BBGA FCBGA package, this surface-mount FPGA targets system designs that require dense integration, flexible I/O, and the Stratix II GX feature set such as high-speed serial transceivers, TriMatrix memory, and dedicated DSP resources.

Key Features

  • Logic Capacity — Approximately 90,960 logic elements for implementing complex gate-level and control logic.
  • Embedded Memory — Approximately 4.52 Mbits of on-chip RAM (TriMatrix memory architecture) to support dual-port memory and FIFO buffers for high-performance data buffering and packet handling.
  • High-Speed Transceivers (Series Capability) — Stratix II GX family transceivers support serial data rates from 600 Mbps up to 6.375 Gbps per channel, suitable for high-speed backplane and chip-to-chip links; dynamic programmability and adaptive equalization are supported at the family level.
  • Dedicated DSP Resources — High-speed DSP blocks are available in the Stratix II GX architecture for multipliers and MAC operations, enabling accelerated signal processing and filtering functions.
  • Clocking and PLLs — Up to four enhanced PLLs per device in the Stratix II GX family provide programmable bandwidth, spread-spectrum, clock switch-over, and real-time reconfiguration capabilities.
  • I/O and Interfaces — 650 I/O pins enable broad external connectivity and support for numerous single-ended and differential I/O standards (family-level support).
  • Power and Supply — Core voltage supply range 1.15 V to 1.25 V, suitable for system designs targeting the Stratix II GX power profile.
  • Package and Mounting — 1508-BBGA (FCBGA) package; supplier package reported as 1508-FBGA, FC (40×40); surface-mount device for compact board-level integration.
  • Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for use in industrial environments.
  • Security and Configuration (Family Features) — Stratix II GX device family supports configuration bitstream encryption and remote configuration updates (family-level capabilities).
  • RoHS Compliant — Device meets RoHS environmental requirements.

Typical Applications

  • High-Speed Networking and Telecom Equipment — Implements protocol bridging, packet processing, and line-rate interfaces using the family’s high-speed serial transceiver capabilities and large logic fabric.
  • Backplane and Chip-to-Chip Interfaces — Enables high-bandwidth backplane links and board-to-board communication leveraging multi-gigabit transceiver support.
  • Signal Processing and DSP Systems — Uses embedded DSP blocks and on-chip RAM for FIR filters, MAC-heavy algorithms, and media processing pipelines.
  • High-Performance Embedded Systems — Combines abundant logic elements, memory, and I/O to implement complex SoC glue logic, custom accelerators, and control planes in industrial systems.

Unique Advantages

  • Large Logic and Memory Integration: Approximately 90,960 logic elements and ~4.52 Mbits of embedded memory reduce the need for external logic and RAM, simplifying board design.
  • High I/O Count for Dense Connectivity: 650 I/O pins provide flexibility to interface with multiple external devices, memory, and high-speed peripherals.
  • Stratix II GX Transceiver Technology: Family-level support for up to 6.375 Gbps serial links, dynamic reconfiguration, and adaptive equalization enables robust high-speed link design options.
  • Industrial Temperature Rating: −40 °C to 100 °C operation supports deployment in industrial environments where extended thermal range is required.
  • Compact FCBGA Package: 1508-BBGA (FCBGA) provides a high-pin-count, surface-mount footprint for space-constrained, high-density PCBs.
  • Design Security and Update Options: Family-level support for configuration encryption and remote updates helps protect IP and enables field reconfiguration workflows.

Why Choose EP2SGX90FF1508I4N?

EP2SGX90FF1508I4N positions itself as a high-capacity Stratix II GX FPGA optimized for systems requiring a balance of large logic resources, substantial on-chip memory, and extensive I/O. The device’s family heritage provides access to advanced transceiver features, TriMatrix memory architecture, DSP blocks, and flexible clocking needed for demanding communications and signal-processing applications.

This FPGA suits designers building networking, telecom, and high-performance embedded systems who need a robust, industrial-temperature device in a compact FCBGA package. The combination of logic density, memory, I/O, and family-level transceiver and IP capabilities delivers a scalable platform for long-term designs.

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