EP2SGX90FF1508I4

The EP2SGX90FF1508I4 is an Intel Stratix® II GX field-programmable gate array supplied in a 1508-BBGA FCBGA package. This device pairs a high-density logic array with the Stratix II GX series’ scalable architecture and high-speed serial transceiver technology.

Targeted at demanding communications and high-performance interface applications, the part delivers a large logic capacity, substantial on-chip memory, extensive I/O, and industrial-grade operating range—making it suitable for system designs that require integration, bandwidth, and robust thermal performance.

Key Features

• Logic Capacity  Approximately 90,960 logic elements provide large-scale programmable logic for complex digital designs.
• Embedded Memory  Approximately 4.52 Mbits of on-chip RAM for FIFOs, buffers, and memory-intensive functions.
• I/O Density  650 I/O pins support wide parallel interfaces and extensive system-level connectivity.
• Stratix II GX Transceiver Architecture  Based on the Stratix II GX family which includes high-speed serial transceiver technology; the series supports transceiver operation from hundreds of Mbps to multi-gigabit rates as defined in the Stratix II GX device documentation.
• DSP and Clocking Resources  Stratix II GX series architecture includes dedicated DSP resources and multiple PLLs for clocking and signal-processing tasks (series-level feature).
• Power and Supply  Core voltage supply range from 1.15 V to 1.25 V, enabling standard FPGA core power architectures.
• Package & Mounting  1508-BBGA (1508-FBGA, FC 40×40) surface-mount package suitable for compact board-level designs.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C to meet industrial deployment requirements.
• RoHS Compliant  Device is RoHS compliant for lead-free manufacturing processes.

Typical Applications

• High-speed Communications Infrastructure  Implements protocol bridging, packet processing, and interface logic leveraging the Stratix II GX series’ serial transceiver capability.
• Backplane and Chip-to-Chip Interfaces  Supports high-bandwidth board-level and card-edge interconnects using the device’s dense I/O and series transceiver features.
• Memory Interface Controllers  On-chip RAM and abundant logic can be used to implement controllers for external high-speed memories and buffering subsystems.
• Signal Processing and DSP Functions  Leverages the series’ DSP blocks and embedded memory for real-time filtering, accumulation, and arithmetic-intensive workloads.

Unique Advantages

• High Logic Density: Approximately 90,960 logic elements enable complex system integration on a single device, reducing external components.
• Substantial On‑Chip Memory: Approximately 4.52 Mbits of embedded RAM provide immediate capacity for FIFOs, frame buffering, and local data storage.
• Extensive I/O Count: 650 I/O pins allow broad parallel interfaces and mixed-signal board-level connectivity without excessive external glue logic.
• Industrial Temperature Range: −40 °C to 100 °C rating supports deployment in industrial environments with extended thermal requirements.
• Series-Level High-Speed Transceiver Support: Built on the Stratix II GX family architecture, offering multi-gigabit serial capabilities and flexible protocol support as defined in the device documentation.
• RoHS Compliance and Surface-Mount Package: 1508-FBGA surface-mount package and RoHS compliance facilitate modern assembly processes and regulatory requirements.

Why Choose EP2SGX90FF1508I4?

The EP2SGX90FF1508I4 combines a high-density logic array, multi-megabit on-chip RAM, and large I/O count in a compact 1508-FBGA package, delivering the integration needed for complex communications and interface applications. Its Stratix II GX family architecture brings series-level transceiver and DSP capabilities together with flexible clocking and memory resources.

This part is suited for system designers and engineers who require significant programmable logic and memory resources, robust industrial temperature operation, and compatibility with the Stratix II GX device feature set for high-speed data movement and signal processing.

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