EP3C10E144C8

IC FPGA 94 I/O 144EQFP
Part Description

Cyclone® III Field Programmable Gate Array (FPGA) IC 94 423936 10320 144-LQFP Exposed Pad

Quantity 1,027 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusLast Time Buy
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package144-EQFP (20x20)GradeCommercialOperating Temperature0°C – 85°C
Package / Case144-LQFP Exposed PadNumber of I/O94Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs645Number of Logic Elements/Cells10320
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits423936

Overview of EP3C10E144C8 – Cyclone® III FPGA, 10,320 logic elements, 94 I/Os, 144-LQFP Exposed Pad

The EP3C10E144C8 is a Cyclone® III family field-programmable gate array (FPGA) in a 144-LQFP exposed-pad surface-mount package. It provides 10,320 logic elements and approximately 0.424 Mbits of embedded memory, aimed at cost-sensitive, low-power system designs that require flexible I/O and on-chip integration.

Built on the Cyclone III device family architecture, this device addresses applications that benefit from low static power consumption, multiple PLLs for clock management, and a variety of supported I/O standards—making it suitable for high-volume consumer and industrial commercial designs within its commercial temperature range.

Key Features

  • Logic Capacity — 10,320 logic elements for mid-range integration and programmable logic implementations.
  • Embedded Memory — Approximately 0.424 Mbits of on-chip RAM to support buffering, small FIFOs, and local storage.
  • I/O Count and Flexibility — 94 user I/Os delivered in a package that supports a wide range of I/O standards as described by the Cyclone III family.
  • Clock Management — Family-level support for multiple PLLs to manage and synthesize device clocks and I/O interfaces.
  • Low-Power Process — Based on TSMC low-power (LP) process technology and silicon optimizations aimed at minimizing power consumption.
  • Supply Voltage — Core voltage range of 1.15 V to 1.25 V for compatibility with Cyclone III power domains.
  • Package and Mounting — 144-LQFP with exposed pad, surface-mount package (supplier package 144-EQFP, 20×20 footprint) for compact PCB integration and thermal conduction.
  • Commercial Temperature Grade — Rated for 0 °C to 85 °C operation for general commercial applications.
  • RoHS Compliant — Meets RoHS environmental compliance requirements.

Typical Applications

  • Consumer Electronics — Programmable interfaces, control logic, and moderate-density processing in cost-sensitive household and portable devices.
  • Industrial Control — I/O aggregation, protocol bridging, and control logic where low static power and flexible clocking are valuable within commercial temperature ranges.
  • Communications Peripherals — Interface conditioning, transceiver control, and clock management for systems that require multiple PLLs and diverse I/O standards.
  • Embedded Systems — Integration of custom logic, small embedded processors or IP cores, and local memory for feature-rich, compact system designs.

Unique Advantages

  • Balanced Mid-Range Capacity: 10,320 logic elements and approximately 0.424 Mbits of embedded memory provide a practical balance of integration and cost for many designs.
  • Low-Power Silicon: Leveraging the Cyclone III low-power process helps reduce static power consumption for battery-aware and thermally constrained applications.
  • Flexible I/O and Clocking: 94 I/Os plus family-level support for multiple PLLs enable diverse interface support and robust clock management on a single device.
  • Compact, PCB-Friendly Package: 144-LQFP with exposed pad simplifies board layout and thermal dissipation for surface-mount assembly.
  • Commercial-Grade Reliability: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial deployments.
  • Family Ecosystem: Access to Cyclone III family features such as pre-built IP and device-level capabilities (PLL resources, supported I/O standards) supports faster integration into existing design workflows.

Why Choose EP3C10E144C8?

The EP3C10E144C8 positions itself as a practical, cost-aware FPGA option within the Cyclone III family—offering a meaningful combination of programmable logic, embedded memory, and flexible I/O in a compact 144-LQFP exposed-pad package. Its low-power process foundation and multiple clock-management features suit designs that need efficient operation without sacrificing integration.

This device is well suited to engineers and procurement teams building mid-range embedded systems, communications peripherals, and industrial control equipment that require on-chip programmability, moderate logic capacity, and a proven device family ecosystem for IP and development support.

Request a quote or submit an inquiry to get pricing, availability, and ordering information for EP3C10E144C8 and start evaluating this Cyclone® III FPGA for your next design.

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