EP3C10E144C8
| Part Description |
Cyclone® III Field Programmable Gate Array (FPGA) IC 94 423936 10320 144-LQFP Exposed Pad |
|---|---|
| Quantity | 1,027 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Last Time Buy |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 144-EQFP (20x20) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP Exposed Pad | Number of I/O | 94 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 645 | Number of Logic Elements/Cells | 10320 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 423936 |
Overview of EP3C10E144C8 – Cyclone® III FPGA, 10,320 logic elements, 94 I/Os, 144-LQFP Exposed Pad
The EP3C10E144C8 is a Cyclone® III family field-programmable gate array (FPGA) in a 144-LQFP exposed-pad surface-mount package. It provides 10,320 logic elements and approximately 0.424 Mbits of embedded memory, aimed at cost-sensitive, low-power system designs that require flexible I/O and on-chip integration.
Built on the Cyclone III device family architecture, this device addresses applications that benefit from low static power consumption, multiple PLLs for clock management, and a variety of supported I/O standards—making it suitable for high-volume consumer and industrial commercial designs within its commercial temperature range.
Key Features
- Logic Capacity — 10,320 logic elements for mid-range integration and programmable logic implementations.
- Embedded Memory — Approximately 0.424 Mbits of on-chip RAM to support buffering, small FIFOs, and local storage.
- I/O Count and Flexibility — 94 user I/Os delivered in a package that supports a wide range of I/O standards as described by the Cyclone III family.
- Clock Management — Family-level support for multiple PLLs to manage and synthesize device clocks and I/O interfaces.
- Low-Power Process — Based on TSMC low-power (LP) process technology and silicon optimizations aimed at minimizing power consumption.
- Supply Voltage — Core voltage range of 1.15 V to 1.25 V for compatibility with Cyclone III power domains.
- Package and Mounting — 144-LQFP with exposed pad, surface-mount package (supplier package 144-EQFP, 20×20 footprint) for compact PCB integration and thermal conduction.
- Commercial Temperature Grade — Rated for 0 °C to 85 °C operation for general commercial applications.
- RoHS Compliant — Meets RoHS environmental compliance requirements.
Typical Applications
- Consumer Electronics — Programmable interfaces, control logic, and moderate-density processing in cost-sensitive household and portable devices.
- Industrial Control — I/O aggregation, protocol bridging, and control logic where low static power and flexible clocking are valuable within commercial temperature ranges.
- Communications Peripherals — Interface conditioning, transceiver control, and clock management for systems that require multiple PLLs and diverse I/O standards.
- Embedded Systems — Integration of custom logic, small embedded processors or IP cores, and local memory for feature-rich, compact system designs.
Unique Advantages
- Balanced Mid-Range Capacity: 10,320 logic elements and approximately 0.424 Mbits of embedded memory provide a practical balance of integration and cost for many designs.
- Low-Power Silicon: Leveraging the Cyclone III low-power process helps reduce static power consumption for battery-aware and thermally constrained applications.
- Flexible I/O and Clocking: 94 I/Os plus family-level support for multiple PLLs enable diverse interface support and robust clock management on a single device.
- Compact, PCB-Friendly Package: 144-LQFP with exposed pad simplifies board layout and thermal dissipation for surface-mount assembly.
- Commercial-Grade Reliability: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial deployments.
- Family Ecosystem: Access to Cyclone III family features such as pre-built IP and device-level capabilities (PLL resources, supported I/O standards) supports faster integration into existing design workflows.
Why Choose EP3C10E144C8?
The EP3C10E144C8 positions itself as a practical, cost-aware FPGA option within the Cyclone III family—offering a meaningful combination of programmable logic, embedded memory, and flexible I/O in a compact 144-LQFP exposed-pad package. Its low-power process foundation and multiple clock-management features suit designs that need efficient operation without sacrificing integration.
This device is well suited to engineers and procurement teams building mid-range embedded systems, communications peripherals, and industrial control equipment that require on-chip programmability, moderate logic capacity, and a proven device family ecosystem for IP and development support.
Request a quote or submit an inquiry to get pricing, availability, and ordering information for EP3C10E144C8 and start evaluating this Cyclone® III FPGA for your next design.

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