EP3C10E144I7

The EP3C10E144I7 is a Cyclone® III field-programmable gate array (FPGA) in a 144-LQFP exposed-pad surface-mount package. It delivers a mix of programmable logic—10,320 logic elements organized across 645 logic blocks—along with approximately 423,936 bits of embedded memory and 94 I/O pins, suited for cost- and power-sensitive embedded and industrial designs.

Built on the Cyclone III device family architecture, this device targets applications that need low-power operation, flexible I/O support, and on-chip integration for system functions such as clock management and embedded processing integration.

Key Features

• Logic Capacity — 10,320 logic elements arranged across 645 logic blocks, providing mid-range programmable logic density for complex control and glue-logic functions.
• Embedded Memory — Approximately 423,936 bits of on-chip RAM for buffering, packet storage, and intermediate data processing.
• I/O and Interfaces — 94 user I/O pins with support for a broad set of I/O standards at the Cyclone III family level; adjustable I/O slew rates and multi-value on-chip termination (OCT) calibration help maintain signal integrity across PVT conditions.
• Clock Management — Family-level support for multiple phase-locked loops (PLLs) enables robust clock synthesis and distribution for synchronous designs.
• Power — Designed for low-power operation within a core voltage range of 1.15 V to 1.25 V, supporting thermally constrained and battery-powered applications outlined by the Cyclone III family.
• Package and Mounting — 144-LQFP exposed-pad (supplier package 144-EQFP, 20×20) in a surface-mount format with exposed pad for thermal dissipation.
• Industrial Temperature Grade — Rated for operation from –40 °C to 100 °C, suitable for industrial-environment deployments.
• Standards and Compliance — RoHS-compliant manufacturing to meet common environmental requirements.
• Design Ecosystem (Family-Level) — Cyclone III family documentation references integrated options such as the Nios II embedded processor and a library of pre-built IP cores to accelerate system development.

Typical Applications

• Industrial Control — Mid-density programmable logic and industrial temperature rating make the device suitable for motor control, PLC interfaces, and factory automation subsystems.
• Embedded Processing — On-chip memory and family-level support for the Nios II soft processor enable embedded control, protocol handling, and system management functions.
• Communications and I/O Aggregation — 94 configurable I/O pins and clock management resources support interface bridging, I/O expansion, and protocol conversion tasks.
• Portable and Thermally-Constrained Systems — Low-power family characteristics support battery-operated or thermally-challenged devices where power efficiency is a priority.

Unique Advantages

• Balanced Logic and Memory — Combines 10,320 logic elements with ~423,936 bits of embedded RAM to implement control logic alongside local data buffering without external memory.
• Flexible I/O Integration — A 94-pin I/O complement with adjustable slew rates and OCT calibration improves signal integrity and simplifies board-level interface design.
• Industrial Temperature Range — Rated –40 °C to 100 °C to meet the environmental demands of industrial applications.
• Low-Voltage Core Operation — 1.15 V–1.25 V core supply helps reduce power consumption in designs aiming for lower energy budgets.
• Surface-Mount Thermal Management — 144-LQFP exposed-pad package supports improved thermal dissipation in compact board layouts.
• RoHS-Compliant — Manufactured to meet RoHS requirements for environmental compliance.

Why Choose EP3C10E144I7?

The EP3C10E144I7 provides a practical balance of programmable logic density, on-chip memory, and flexible I/O in an industrial-temperature, surface-mount package. Its Cyclone III family characteristics—focused on low power, integrated clock management, and available embedded processor and IP ecosystem—make it a strong choice for mid-range embedded and industrial designs that require reliable operation and on-board integration.

Engineers building control systems, protocol bridges, or embedded instrumentation will find the device’s mix of logic, memory, and I/O helpful for reducing component count, simplifying PCB routing, and shortening development cycles.

Request a quote or submit a procurement inquiry to check availability and obtain pricing for the EP3C10E144I7.