EP3C10F256C6N

The EP3C10F256C6N is a Cyclone® III field-programmable gate array (FPGA) designed for low-power, cost-sensitive digital designs. It combines a moderate logic density with a high I/O count and on-chip memory to support control, glue-logic and mid-range integration tasks.

As a member of the Cyclone III device family, this device leverages low-power process technology and device-level features targeted at high-volume, power-conscious applications such as portable/handheld systems and thermally-constrained environments.

Key Features

• Logic Capacity — 10,320 logic elements provide the programmable fabric for implementing custom logic, state machines and control functions.
• Embedded Memory — Approximately 0.424 Mbits of on-chip RAM (423,936 bits) for data buffering, FIFOs and small lookup tables.
• I/O Resources — 182 user I/Os to support extensive peripheral and interface connectivity on moderate-complexity boards.
• Clock Management — Family-level support includes four phase-locked loops (PLLs) per device for flexible clock synthesis and distribution (Cyclone III family feature).
• Power and Voltage — Operates from a core supply range of 1.15 V to 1.25 V, benefitting low-power system budgets.
• Packaging and Mounting — 256-ball L/BGA package (supplier device package listed as 256-FBGA, 17 × 17) with surface-mount mounting for compact PCB designs.
• Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C suited to standard commercial environments.
• Regulatory — RoHS compliant.

Typical Applications

• Portable and handheld devices — Low-power Cyclone III family characteristics and compact packaging support battery-conscious and space-constrained designs.
• Communication and interface bridging — High I/O count and on-chip memory allow protocol translation, buffering and glue-logic between subsystems.
• Embedded control and feature integration — Programmable logic and embedded RAM enable consolidation of control functions and peripheral handling into a single device.
• Thermally-challenged systems — Low-power process technology and device-level power optimizations make the device suitable for environments where cooling is limited.

Unique Advantages

• Balanced integration: 10,320 logic elements combined with approximately 0.424 Mbits of embedded memory and 182 I/Os reduce the need for additional discrete logic and memories.
• Low-power family heritage: Built on the Cyclone III low-power process, the device is optimized for power-sensitive applications and extended battery life.
• Flexible clocking: Family support for multiple PLLs enables robust clock management and simplifies multi‑domain timing designs.
• Compact, surface-mount package: The 256-ball BGA footprint (256-FBGA, 17 × 17) supports high-density PCB layouts while maintaining manufacturability.
• Commercial temperature rating: 0 °C to 85 °C operation matches standard commercial product requirements and deployment scenarios.
• Standards-compliant materials: RoHS compliance supports global manufacturing and environmental requirements.

Why Choose EP3C10F256C6N?

The EP3C10F256C6N positions itself as a practical, low-power Cyclone III FPGA option for designers who need mid-range logic capacity, substantial I/O, and embedded memory in a compact surface-mount package. It is suited to applications that require power-efficient operation and flexible interfacing without moving to higher-density or higher-cost device families.

Developers targeting portable equipment, interface bridging, or consolidated control implementations will find the device’s combination of logic resources, on-chip RAM, clocking capability and commercial-grade operating range useful for reducing board-level complexity and BOM count while relying on the Cyclone III ecosystem for development and IP support.

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