EP2SGX90FF1508C3

The EP2SGX90FF1508C3 is a Stratix® II GX field-programmable gate array supplied in a 1508-BBGA (FCBGA) surface-mount package. As part of the Stratix II GX family, the device pairs a scalable, high-performance logic array with the family’s high-speed serial transceiver architecture, making it suitable for designs that require high logic density and advanced serial I/O capability.

This commercial-grade FPGA operates from a 1.15 V to 1.25 V supply and across a 0 °C to 85 °C operating range, and offers a combination of abundant logic resources, significant embedded memory, and a high I/O count for complex system integration.

Key Features

• High-density logic — 90,960 logic elements provide substantial programmable logic capacity for complex control, data-processing, and protocol handling.
• Embedded memory — Approximately 4.52 Mbits of on-chip RAM to implement FIFOs, dual-port memories, and buffering close to logic.
• I/O capacity — 650 I/O pins to support broad external interfacing and multi-channel connectivity in a single device.
• Family-level transceiver capability — Stratix II GX devices include high-speed serial transceivers that support 600 Mbps to 6.375 Gbps per channel for high-bandwidth serial links (family specification).
• DSP and clocking resources — Family architecture includes high-speed DSP blocks and enhanced PLLs for multiply-accumulate operations and flexible clock management (family specification).
• Package and mounting — 1508-BBGA (FCBGA) package, surface-mount mounting type; supplier package reference 1508-FBGA, FC (40×40).
• Power and temperature — Device supply range 1.15 V to 1.25 V; commercial operating temperature 0 °C to 85 °C.
• Compliance — RoHS compliant, supporting regulatory requirements for lead-free assembly.

Typical Applications

• High-speed communications — Implement serial link endpoints, protocol bridging, and backplane interfaces using the Stratix II GX family transceiver capabilities.
• Memory interface controllers — Support for high-speed external memory interfaces and on-chip memory resources for buffering and memory controllers.
• DSP and signal processing — Use the device’s logic density and embedded memory for FIR filters, MAC engines, and other DSP-centric functions.
• Chip-to-chip bridging — High I/O count and family transceiver performance facilitate complex chip-to-chip and board-to-board data transfers.

Unique Advantages

• Substantial programmable capacity — 90,960 logic elements enable large, feature-rich designs without partitioning across multiple devices.
• Significant embedded memory — Approximately 4.52 Mbits of on-chip RAM reduces external memory dependence and improves data locality.
• High I/O integration — 650 I/Os simplify system routing and reduce the need for additional interface devices.
• High-speed serial support (family) — Access to transceiver data rates up to 6.375 Gbps (Stratix II GX family) for high-bandwidth link implementations.
• Commercial-grade operating window — 1.15–1.25 V supply range and 0 °C to 85 °C operation fit standard commercial product environments.
• RoHS compliant — Facilitates lead-free manufacturing and environmental compliance.

Why Choose EP2SGX90FF1508C3?

EP2SGX90FF1508C3 brings the Stratix II GX family architecture into a high-density FPGA package, delivering large logic capacity, substantial on-chip memory, and broad I/O resources for demanding applications. Its family-level support for high-speed serial transceivers and integrated DSP/clocking features makes it well suited for communication systems, memory interface controllers, and DSP-heavy designs.

For projects requiring a commercially graded, RoHS-compliant FPGA with a 1508-BBGA package, 90,960 logic elements, approximately 4.52 Mbits of embedded memory, and 650 I/Os, EP2SGX90FF1508C3 offers a balanced mix of performance and integration to streamline system design and deployment.

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