EP2SGX90EF1152C5

IC FPGA 558 I/O 1152FBGA
Part Description

Stratix® II GX Field Programmable Gate Array (FPGA) IC 558 4520448 90960 1152-BBGA

Quantity 43 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGANumber of I/O558Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4548Number of Logic Elements/Cells90960
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4520448

Overview of EP2SGX90EF1152C5 – Stratix II GX FPGA, 1152-BBGA

The EP2SGX90EF1152C5 is a Stratix® II GX field-programmable gate array (FPGA) offered in a 1152-BBGA package. As part of the Stratix II GX family, the device combines a scalable high-performance logic array with high-speed serial transceiver technology and a 1.2‑V class logic array.

Designed for communications, backplane, and high-bandwidth interface applications, this commercial-grade FPGA provides a dense logic resource set, substantial on-chip memory, and broad I/O capability while operating from a 1.15 V to 1.25 V supply and a 0 °C to 85 °C temperature range.

Key Features

  • Logic Capacity  Approximately 90,960 logic elements and 4,548 LABs provide a high-density programmable fabric for complex digital functions.
  • Embedded Memory  Approximately 4.52 Mbits of on-chip RAM (4,520,448 bits) implemented in TriMatrix memory blocks for dual-port RAM and FIFO designs.
  • I/O Resources  558 user I/O pins support a wide range of external interfaces and board-level connectivity.
  • High‑Speed Transceivers (Series Feature)  Stratix II GX devices include serial transceivers with clock and data recovery supporting data rates from 600 Mbps to 6.375 Gbps for high-bandwidth links.
  • DSP and Clocking (Series Feature)  Integrated high-speed DSP blocks for multiplier and MAC functions (series documentation notes operation up to 450 MHz) and up to four enhanced PLLs for flexible clocking and spread‑spectrum support.
  • Package & Mounting  1152‑BBGA (supplier package: 1152‑FBGA, 35×35) in a surface‑mount form factor for compact board integration.
  • Power and Operating Range  Nominal supply range 1.15 V to 1.25 V; commercial operating temperature 0 °C to 85 °C.
  • Compliance  RoHS compliant.

Typical Applications

  • High‑Speed Communications  Implementation of protocol bridging and line interfaces that leverage the Stratix II GX series transceivers and programmable logic.
  • Backplane and Chip‑to‑Chip Interfaces  High-density I/O and serial link support for backplane PHYs, switch fabrics, and board‑level interface logic.
  • Memory Interface Controllers  Controllers and bridges for high‑speed external memories, using the device’s logic capacity and embedded memory resources.
  • Signal Processing and DSP  Hardware-accelerated signal processing using on‑chip DSP blocks and high-speed logic for tasks such as filtering and MAC operations.

Unique Advantages

  • High Logic Density:  Around 90,960 logic elements enable complex system functions and integration of multiple subsystems into a single device.
  • Substantial Embedded Memory:  Approximately 4.52 Mbits of on‑chip RAM reduces external memory needs for many buffer and FIFO designs.
  • Integrated High‑Speed SerDes (Series Feature):  Transceivers supporting multi‑Gbps links simplify board design for high-bandwidth interconnects.
  • Flexible Clocking and DSP:  Enhanced PLLs and DSP blocks (documented in the Stratix II GX family) provide flexible timing and compute building blocks for performance‑critical functions.
  • Compact, Surface‑Mount Package:  1152‑BBGA footprint enables high I/O count in a compact board area for space-constrained systems.
  • Commercial Temperature and RoHS Compliance:  Commercial grading (0 °C to 85 °C) and RoHS compliance support standard electronics manufacturing and environmental requirements.

Why Choose EP2SGX90EF1152C5?

The EP2SGX90EF1152C5 places substantial programmable logic, embedded memory, and board-level I/O in a single 1152‑BBGA package, making it suited for designs that require dense integration and high‑bandwidth connectivity. As a member of the Stratix II GX family, it benefits from architecture features documented for the series such as high‑speed serial transceivers, TriMatrix memory, DSP resources, and flexible PLL-based clocking.

This device is appropriate for engineers developing communications, backplane, and high‑performance interfacing solutions who need a commercially graded FPGA with verified series-level capabilities and a compact surface-mount package for production designs.

Request a quote or submit a pricing inquiry to evaluate EP2SGX90EF1152C5 for your next design project.

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