EP2SGX90EF1152C5
| Part Description |
Stratix® II GX Field Programmable Gate Array (FPGA) IC 558 4520448 90960 1152-BBGA |
|---|---|
| Quantity | 43 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA | Number of I/O | 558 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4548 | Number of Logic Elements/Cells | 90960 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4520448 |
Overview of EP2SGX90EF1152C5 – Stratix II GX FPGA, 1152-BBGA
The EP2SGX90EF1152C5 is a Stratix® II GX field-programmable gate array (FPGA) offered in a 1152-BBGA package. As part of the Stratix II GX family, the device combines a scalable high-performance logic array with high-speed serial transceiver technology and a 1.2‑V class logic array.
Designed for communications, backplane, and high-bandwidth interface applications, this commercial-grade FPGA provides a dense logic resource set, substantial on-chip memory, and broad I/O capability while operating from a 1.15 V to 1.25 V supply and a 0 °C to 85 °C temperature range.
Key Features
- Logic Capacity Approximately 90,960 logic elements and 4,548 LABs provide a high-density programmable fabric for complex digital functions.
- Embedded Memory Approximately 4.52 Mbits of on-chip RAM (4,520,448 bits) implemented in TriMatrix memory blocks for dual-port RAM and FIFO designs.
- I/O Resources 558 user I/O pins support a wide range of external interfaces and board-level connectivity.
- High‑Speed Transceivers (Series Feature) Stratix II GX devices include serial transceivers with clock and data recovery supporting data rates from 600 Mbps to 6.375 Gbps for high-bandwidth links.
- DSP and Clocking (Series Feature) Integrated high-speed DSP blocks for multiplier and MAC functions (series documentation notes operation up to 450 MHz) and up to four enhanced PLLs for flexible clocking and spread‑spectrum support.
- Package & Mounting 1152‑BBGA (supplier package: 1152‑FBGA, 35×35) in a surface‑mount form factor for compact board integration.
- Power and Operating Range Nominal supply range 1.15 V to 1.25 V; commercial operating temperature 0 °C to 85 °C.
- Compliance RoHS compliant.
Typical Applications
- High‑Speed Communications Implementation of protocol bridging and line interfaces that leverage the Stratix II GX series transceivers and programmable logic.
- Backplane and Chip‑to‑Chip Interfaces High-density I/O and serial link support for backplane PHYs, switch fabrics, and board‑level interface logic.
- Memory Interface Controllers Controllers and bridges for high‑speed external memories, using the device’s logic capacity and embedded memory resources.
- Signal Processing and DSP Hardware-accelerated signal processing using on‑chip DSP blocks and high-speed logic for tasks such as filtering and MAC operations.
Unique Advantages
- High Logic Density: Around 90,960 logic elements enable complex system functions and integration of multiple subsystems into a single device.
- Substantial Embedded Memory: Approximately 4.52 Mbits of on‑chip RAM reduces external memory needs for many buffer and FIFO designs.
- Integrated High‑Speed SerDes (Series Feature): Transceivers supporting multi‑Gbps links simplify board design for high-bandwidth interconnects.
- Flexible Clocking and DSP: Enhanced PLLs and DSP blocks (documented in the Stratix II GX family) provide flexible timing and compute building blocks for performance‑critical functions.
- Compact, Surface‑Mount Package: 1152‑BBGA footprint enables high I/O count in a compact board area for space-constrained systems.
- Commercial Temperature and RoHS Compliance: Commercial grading (0 °C to 85 °C) and RoHS compliance support standard electronics manufacturing and environmental requirements.
Why Choose EP2SGX90EF1152C5?
The EP2SGX90EF1152C5 places substantial programmable logic, embedded memory, and board-level I/O in a single 1152‑BBGA package, making it suited for designs that require dense integration and high‑bandwidth connectivity. As a member of the Stratix II GX family, it benefits from architecture features documented for the series such as high‑speed serial transceivers, TriMatrix memory, DSP resources, and flexible PLL-based clocking.
This device is appropriate for engineers developing communications, backplane, and high‑performance interfacing solutions who need a commercially graded FPGA with verified series-level capabilities and a compact surface-mount package for production designs.
Request a quote or submit a pricing inquiry to evaluate EP2SGX90EF1152C5 for your next design project.

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