EP2SGX90EF1152C4
| Part Description |
Stratix® II GX Field Programmable Gate Array (FPGA) IC 558 4520448 90960 1152-BBGA |
|---|---|
| Quantity | 726 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA | Number of I/O | 558 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4548 | Number of Logic Elements/Cells | 90960 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4520448 |
Overview of EP2SGX90EF1152C4 – Stratix® II GX FPGA (1152‑BBGA)
The EP2SGX90EF1152C4 is a Stratix® II GX field‑programmable gate array (FPGA) in a 1152‑ball BGA package designed for high‑density, high‑performance logic implementations. It combines a large logic array with substantial on‑chip memory and extensive I/O to address demanding communications, interface bridging, and high‑performance digital processing applications.
Built on the Stratix II GX family architecture, the device targets applications that require dense programmable logic, significant embedded RAM, and support for advanced high‑speed serial and parallel interfaces while operating from a 1.15 V–1.25 V core supply and within a commercial temperature range.
Key Features
- Logic Capacity — 90,960 logic elements (cells) for complex digital designs and large‑scale programmable logic integration.
- Embedded Memory — Approximately 4.5 Mbits of on‑chip RAM, using the Stratix II TriMatrix memory architecture to support varied RAM block sizes and dual‑port/FIFO implementations.
- I/O Density — 558 I/O pins to support broad parallel interface requirements and board‑level connectivity.
- High‑Speed Transceiver Family Features — Stratix II GX family devices include high‑speed serial transceivers with clock/data recovery supporting 600 Mbps to 6.375 Gbps per channel (family capability) and features such as dynamic reconfiguration, adaptive equalization, and programmable transmitter settings.
- DSP and Clocking — Family‑level support for dedicated high‑speed DSP blocks (for multipliers/multiply‑accumulate functions) and up to four enhanced PLLs for clock management and phase/control features.
- Package & Mounting — 1152‑BBGA surface‑mount package (supplier package: 1152‑FBGA 35×35) suitable for dense board layouts.
- Power & Temperature — Core supply range 1.15 V to 1.25 V; commercial operating temperature 0 °C to 85 °C.
- Configuration & Security (Family) — Stratix II GX family supports configuration bitstream encryption and remote configuration updates as part of device configuration features.
- Compliance — RoHS compliant.
Typical Applications
- High‑Speed Networking and Backplane Interfaces — Use the device’s high logic count, abundant I/O, and family transceiver capabilities to implement packet processing, protocol bridging, and backplane serialization/deserialization.
- Chip‑to‑Chip and Protocol Conversion — Leverage the family’s high‑speed serial features and reconfigurable logic for chip‑to‑chip links and protocol translation tasks.
- High‑Performance DSP and Signal Processing — Employ embedded RAM and DSP resources (family features) for FIR filtering, multiply‑accumulate operations, and other streaming data algorithms.
- Memory Interface Controllers — Implement controllers for external high‑speed memories using the device’s logic density and TriMatrix memory flexibility.
Unique Advantages
- High Logic Density: 90,960 logic elements enable integration of large digital subsystems on a single device, reducing board count and interconnect complexity.
- Substantial On‑Chip Memory: Approximately 4.5 Mbits of embedded RAM (TriMatrix architecture) simplifies implementation of FIFOs, buffers, and on‑chip data storage without external memory in many use cases.
- Extensive I/O Count: 558 I/Os provide the flexibility to connect to numerous parallel interfaces and peripherals directly from the FPGA.
- Family‑Level High‑Speed Serial Capability: Stratix II GX transceiver features (600 Mbps–6.375 Gbps) and adaptive signal conditioning options support a range of serial protocols and link conditions.
- Robust Clocking and DSP Support: Dedicated DSP blocks and enhanced PLL features at the family level facilitate high‑throughput signal processing and precise clock management.
- Commercial‑Grade and RoHS Compliant: Designed for commercial temperature ranges (0 °C to 85 °C) and meets RoHS environmental requirements for regulated applications.
Why Choose EP2SGX90EF1152C4?
The EP2SGX90EF1152C4 positions itself where high logic capacity, sizable on‑chip memory, and extensive I/O are required together with the proven Stratix II GX family feature set. It is well suited to designs that need scalable, high‑performance programmable logic alongside family capabilities for high‑speed serial links, DSP acceleration, and flexible memory architectures.
For engineering teams building communications, interface, or signal‑processing systems, this device offers a balance of integration and configurable resources that simplifies board design and supports complex, high‑bandwidth functions within a commercial operating environment.
If you would like pricing, availability, or technical ordering information for EP2SGX90EF1152C4, request a quote or submit an inquiry and our team will respond with the details you need.

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