EP2SGX90EF1152C3N

The EP2SGX90EF1152C3N is a Stratix® II GX field programmable gate array (FPGA) in a 1152‑BBGA (35 × 35) package. It combines a high-performance logic array with the Stratix II GX series’ high-speed transceiver architecture to address demanding communications, backplane and protocol‑bridging designs.

With 90,960 logic elements, approximately 4.52 Mbits of embedded RAM and 558 I/O pins, this device targets applications that require dense logic, substantial on‑chip memory, and large I/O capacity while operating from a 1.15 V to 1.25 V core supply over a commercial temperature range.

Key Features

• High‑capacity logic — 90,960 logic elements provide substantial programmable logic resources for complex FPGA designs.
• Embedded memory — Approximately 4.52 Mbits of on‑chip RAM to support FIFOs, buffers and data path storage directly in the fabric.
• Extensive I/O — 558 I/O pins for large external connectivity and complex board‑level interfaces.
• Stratix II GX transceiver technology — Series transceivers support clock/data recovery and high‑speed serial operation up to 6.375 Gbps per channel for high‑bandwidth links (series capability).
• Power and voltage — Core voltage range 1.15 V to 1.25 V for compatibility with Stratix II GX power domains.
• Package — 1152‑FBGA (35 × 35) surface‑mount package for high pin‑count board implementations.
• Commercial temperature grade — Rated for 0 °C to 85 °C operation for standard commercial applications.
• RoHS compliant — Conforms to lead‑free manufacturing requirements.

Typical Applications

• High‑speed communications — Implement backplane interfaces, protocol bridging, and serial links leveraging the Stratix II GX transceiver capabilities.
• Networking equipment — Use for packet processing, buffering and interface aggregation where high logic density and large I/O counts are required.
• Chip‑to‑chip and board‑to‑board interconnect — Deploy the device for high‑bandwidth serial connections and data lane aggregation.
• Memory interface controllers — Implement controllers and buffering for external high‑speed memories using abundant embedded RAM and logic resources.

Unique Advantages

• Large programmable fabric: 90,960 logic elements enable complex RTL implementations and system partitioning within a single device.
• Significant on‑chip memory: Approximately 4.52 Mbits of embedded RAM reduces external memory dependence and simplifies board design.
• High I/O count: 558 I/Os support dense external connectivity and multiple high‑speed interfaces without multiplexing compromises.
• Series transceiver performance: Stratix II GX transceiver architecture supports multi‑gigabit serial links for high‑bandwidth applications.
• Compact, high‑pin‑count package: 1152‑BBGA (35 × 35) provides the pin density required for advanced board layouts while maintaining a surface‑mount form factor.

Why Choose EP2SGX90EF1152C3N?

The EP2SGX90EF1152C3N combines substantial logic capacity, multi‑Mbit on‑chip RAM and a high I/O count in a single Stratix II GX FPGA package, making it well suited for communications and networking designs that demand dense logic, embedded buffering and extensive external connectivity. The device’s compatibility with the Stratix II GX transceiver architecture provides headroom for multi‑gigabit serial links in system designs.

Designed for commercial temperature operation and RoHS compliance, this device is appropriate for production systems requiring proven FPGA architecture, scalable logic resources and integrated memory to reduce BOM complexity and streamline board integration.

Request a quote or submit an inquiry for pricing and availability to evaluate the EP2SGX90EF1152C3N for your next design.