XPC8240LZU200E

The XPC8240LZU200E from NXP Semiconductors is a PowerPC 603e microprocessor-class MPU in the XPC8240 series. It implements a single 32-bit PowerPC 603e core running at 200 MHz and targets embedded, industrial applications.

Designed with on-chip memory controllers and DMA support, this device is suited for embedded systems requiring a compact surface-mount package and industrial-temperature operation up to 105 °C.

Key Features

• Core  Single PowerPC 603e core, 32-bit architecture operating at 200 MHz for embedded processing tasks.
• Memory Support  Integrated DRAM and SDRAM controllers to interface with external system memory.
• Interfaces  Includes DMA support for efficient data movement without continuous CPU intervention.
• Power and I/O  3.3 V I/O voltage for compatibility with common embedded logic levels.
• Package and Mounting  Supplier device package: 352-TBGA (35×35); package case listed as 352-LBGA; surface-mount construction for PCB assembly.
• Qualification and Temperature  Industrial qualification with operating temperature range 0 °C to 105 °C for deployment in temperature-challenging environments.

Typical Applications

• Industrial control systems  Use the single 32-bit core and industrial temperature range for embedded controllers and process automation equipment.
• Embedded computing platforms  Integrate DRAM/SDRAM controllers and DMA to build compact system-on-board designs for general embedded computing.
• Communications and networking equipment  Leverage the PowerPC 603e core and DMA capability for protocol processing and data movement tasks in network appliances.

Unique Advantages

• Single 32-bit PowerPC 603e core at 200 MHz: Delivers deterministic embedded processing performance suitable for a range of control and processing tasks.
• Integrated DRAM/SDRAM controllers: Simplifies memory subsystem design and reduces external controller components.
• DMA support: Enables efficient bulk data transfers with reduced CPU overhead, improving system throughput.
• Industrial temperature rating (0 °C to 105 °C): Supports deployment in industrial environments with elevated thermal demands.
• Standard 3.3 V I/O: Matches common embedded logic voltage levels for easy interface with peripherals and board-level components.
• Compact surface-mount TBGA/LBGA package: 352-ball TBGA (35×35) supplier package provides a high-density footprint for space-constrained designs.

Why Choose XPC8240LZU200E?

The XPC8240LZU200E positions itself as a well-specified MPU for industrial embedded designs that need a 32-bit PowerPC 603e core at 200 MHz with on-chip memory controller support and DMA. Its industrial operating range and 3.3 V I/O make it suitable for long-lived, robust embedded systems where consistent thermal and electrical characteristics are required.

As part of the XPC8240 series from NXP Semiconductors, this device is targeted at engineers and OEMs building compact, surface-mount embedded platforms that benefit from integrated memory interfaces and efficient data-handling features.

Request a quote or submit an availability inquiry to check pricing and lead times for the XPC8240LZU200E.