XPC8260CVVIHBC

The XPC8260CVVIHBC from NXP Semiconductors is a PowerPC G2 microprocessor IC featuring a single 32‑bit core running at 200 MHz. It is supplied in a 480‑TBGA (37.5×37.5 mm) package and is intended for embedded applications.

Integration highlights include a Communications RISC CPM co‑processor, on‑chip DRAM/SDRAM controllers, three 10/100 Mbps Ethernet interfaces and I2C. With 3.3 V I/O, industrial qualification and an operating range of −40 °C to 105 °C, the device targets embedded and industrial use cases that require consolidated communications and memory functionality.

Key Features

• Core Single PowerPC G2 32‑bit processor core running at 200 MHz, providing deterministic processing for embedded tasks.
• Co‑processors & Offload Integrated Communications RISC CPM co‑processor to handle communications processing and offload host CPU tasks.
• Memory Controllers Built‑in DRAM and SDRAM controllers simplify system memory design and reduce external controller requirements.
• Ethernet Connectivity Three 10/100 Mbps Ethernet interfaces enable multi‑port networked designs.
• Peripheral Interfaces I2C support for peripheral and sensor interfacing.
• Power I/O 3.3 V I/O voltage for compatibility with common embedded peripherals and interfaces.
• Package & Mounting 480‑LBGA exposed pad / 480‑TBGA (37.5×37.5 mm) supplier device package, designed for surface‑mount assembly and high I/O density.
• Environmental & Qualification Industrial qualification and an operating temperature range of −40 °C to 105 °C for extended‑environment deployments.
• Compliance RoHS compliant for environmental regulatory requirements.

Typical Applications

• Industrial Control & Automation Embedded controllers and automation equipment that benefit from industrial qualification, extended temperature operation and integrated communications.
• Networking & Gateways Multi‑port network devices and gateways leveraging three 10/100 Mbps Ethernet interfaces and the Communications RISC CPM for packet handling.
• Embedded Systems General embedded appliances requiring a 32‑bit PowerPC G2 core, memory controller integration and I2C peripheral support.

Unique Advantages

• Integrated Communications Processing: The Communications RISC CPM offloads networking tasks from the main core, simplifying protocol handling and system design.
• Multi‑port Ethernet: Three 10/100 Mbps Ethernet interfaces enable compact multi‑port networking without external PHY aggregation.
• On‑chip Memory Support: DRAM and SDRAM controllers reduce external component count and simplify memory subsystem integration.
• Industrial Temperature Capability: −40 °C to 105 °C operating range supports deployment in harsh and temperature‑varying environments.
• High‑density Package: 480‑TBGA (37.5×37.5 mm) with exposed pad supports many I/Os in a surface‑mount form factor for compact board layouts.
• Regulatory Compliance: RoHS compliance meets environmental requirements for manufactured products.

Why Choose XPC8260CVVIHBC?

The XPC8260CVVIHBC delivers a balanced combination of processing capability and integrated system features for embedded and industrial applications. Its PowerPC G2 single‑core 200 MHz architecture, communications co‑processor, memory controllers and multiple Ethernet ports provide a focused platform for designs that require consolidated communications and memory functionality.

Industrial qualification, a wide operating temperature range and RoHS compliance make this NXP Semiconductors device suitable for projects that prioritize reliability and regulatory compliance in demanding environments.

Request a quote or submit an inquiry today to check availability and pricing for the XPC8260CVVIHBC.