XPC8260VVIFBC
| Part Description |
PowerPC G2 Microprocessor IC MPC82xx 1 Core, 32-Bit 200MHz 480-TBGA (37.5x37.5) |
|---|---|
| Quantity | 1,232 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | XPC8260 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; RISC CPM | Core Processor | PowerPC G2 | Device Package | 480-TBGA (37.5x37.5) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 5A991B4B | Ethernet | 10/100Mbps (3) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | 0°C ~ 105°C (TA) | ||
| Package / Case | 480-LBGA Exposed Pad | RAM Controllers | DRAM, SDRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | Speed | 200MHz | Supplier Device Package | 480-TBGA (37.5×37.5) | ||
| Voltage – I/O | 3.3V |
Overview of XPC8260VVIFBC – IC MPU MPC82XX 200MHZ 480TBGA
The XPC8260VVIFBC is a PowerPC G2 microprocessor IC configured as a single 32-bit core running at 200 MHz. Designed for embedded applications, it integrates communications-centric peripherals and memory controllers to support systems requiring on-chip network and DRAM/SDRAM interfacing.
Key attributes include a 3.3 V I/O voltage, integrated communications co-processor (RISC CPM), 10/100 Mbps Ethernet capability, and a 480-TBGA package (37.5×37.5 mm), with an operating temperature range of 0 °C to 105 °C and RoHS compliance.
Key Features
- Core and Performance PowerPC G2 single-core 32-bit processor operating at 200 MHz for deterministic embedded processing.
- Communications and Co-processors Includes communications co-processor functionality (RISC CPM) and communications-focused feature set to support networked embedded designs.
- Memory Interfaces On-chip DRAM and SDRAM controllers provide direct support for common external system memory types.
- Ethernet Connectivity 10/100 Mbps Ethernet capability is provided to enable networked device communication.
- Peripheral Interfaces Includes I2C and additional embedded interfaces for peripheral control and system management.
- Power and I/O 3.3 V I/O voltage for standard embedded I/O interoperability.
- Package and Mounting Supplied in a 480-TBGA package (37.5×37.5 mm), 480-LBGA exposed pad, surface-mount for compact board-level integration.
- Environmental and Qualification RoHS compliant and specified for consumer qualification with an operating temperature range of 0 °C to 105 °C.
Typical Applications
- Embedded Networking Devices Used where on-board 10/100 Mbps Ethernet and communications processing are required for network connectivity and packet handling.
- Industrial and Control Systems Suited to embedded control applications that need a deterministic 32-bit processing core with external DRAM/SDRAM support.
- Communications Equipment Appropriate for communications-focused modules that leverage the RISC CPM co-processor and integrated Ethernet capability.
- Consumer Embedded Products Designed for consumer-grade embedded products that benefit from integrated memory controllers and standard I2C peripheral interfacing.
Unique Advantages
- Integrated Communications Co-Processor: RISC CPM functionality reduces the need for separate communication controllers and simplifies board-level design.
- On-Chip Memory Controllers: DRAM and SDRAM controllers provide direct support for external system memory, lowering BOM complexity.
- Built-In Ethernet Capability: 10/100 Mbps Ethernet support enables immediate network connectivity for embedded applications.
- Compact High-Lead-Count Package: 480-TBGA (37.5×37.5 mm) with exposed pad supports dense integration and thermal management on compact PCBs.
- Wide Operating Range for Consumer Use: 0 °C to 105 °C operating temperature and RoHS compliance align with many consumer embedded product requirements.
- Standard 3.3 V I/O: Ensures compatibility with common embedded peripherals and interfaces.
Why Choose XPC8260VVIFBC?
The XPC8260VVIFBC positions itself as a compact, integrated embedded processor solution that combines a PowerPC G2 single-core CPU with communications-focused peripherals, memory controllers, and Ethernet capability. This combination supports designers building networked and communications-aware embedded systems who require an on-chip communications co-processor and standard memory interfacing.
Ideal for engineers and procurement teams targeting consumer-grade embedded designs, the device offers a balance of performance, integration, and compliance (RoHS) to reduce board-level complexity and support streamlined system development and deployment.
Request a quote or submit an inquiry to obtain pricing, availability, and additional procurement details for XPC8260VVIFBC.

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