XPC8260VVIFBC

IC MPU MPC82XX 200MHZ 480TBGA
Part Description

PowerPC G2 Microprocessor IC MPC82xx 1 Core, 32-Bit 200MHz 480-TBGA (37.5x37.5)

Quantity 1,232 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesXPC8260
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; RISC CPMCore ProcessorPowerPC G2Device Package480-TBGA (37.5x37.5)
ECCN5A991B4BEthernet10/100Mbps (3)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 105°C (TA)
Package / Case480-LBGA Exposed PadRAM ControllersDRAM, SDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSpeed200MHzSupplier Device Package480-TBGA (37.5×37.5)
Voltage – I/O3.3V

Overview of XPC8260VVIFBC – IC MPU MPC82XX 200MHZ 480TBGA

The XPC8260VVIFBC is a PowerPC G2 microprocessor IC configured as a single 32-bit core running at 200 MHz. Designed for embedded applications, it integrates communications-centric peripherals and memory controllers to support systems requiring on-chip network and DRAM/SDRAM interfacing.

Key attributes include a 3.3 V I/O voltage, integrated communications co-processor (RISC CPM), 10/100 Mbps Ethernet capability, and a 480-TBGA package (37.5×37.5 mm), with an operating temperature range of 0 °C to 105 °C and RoHS compliance.

Key Features

  • Core and Performance  PowerPC G2 single-core 32-bit processor operating at 200 MHz for deterministic embedded processing.
  • Communications and Co-processors  Includes communications co-processor functionality (RISC CPM) and communications-focused feature set to support networked embedded designs.
  • Memory Interfaces  On-chip DRAM and SDRAM controllers provide direct support for common external system memory types.
  • Ethernet Connectivity  10/100 Mbps Ethernet capability is provided to enable networked device communication.
  • Peripheral Interfaces  Includes I2C and additional embedded interfaces for peripheral control and system management.
  • Power and I/O  3.3 V I/O voltage for standard embedded I/O interoperability.
  • Package and Mounting  Supplied in a 480-TBGA package (37.5×37.5 mm), 480-LBGA exposed pad, surface-mount for compact board-level integration.
  • Environmental and Qualification  RoHS compliant and specified for consumer qualification with an operating temperature range of 0 °C to 105 °C.

Typical Applications

  • Embedded Networking Devices  Used where on-board 10/100 Mbps Ethernet and communications processing are required for network connectivity and packet handling.
  • Industrial and Control Systems  Suited to embedded control applications that need a deterministic 32-bit processing core with external DRAM/SDRAM support.
  • Communications Equipment  Appropriate for communications-focused modules that leverage the RISC CPM co-processor and integrated Ethernet capability.
  • Consumer Embedded Products  Designed for consumer-grade embedded products that benefit from integrated memory controllers and standard I2C peripheral interfacing.

Unique Advantages

  • Integrated Communications Co-Processor: RISC CPM functionality reduces the need for separate communication controllers and simplifies board-level design.
  • On-Chip Memory Controllers: DRAM and SDRAM controllers provide direct support for external system memory, lowering BOM complexity.
  • Built-In Ethernet Capability: 10/100 Mbps Ethernet support enables immediate network connectivity for embedded applications.
  • Compact High-Lead-Count Package: 480-TBGA (37.5×37.5 mm) with exposed pad supports dense integration and thermal management on compact PCBs.
  • Wide Operating Range for Consumer Use: 0 °C to 105 °C operating temperature and RoHS compliance align with many consumer embedded product requirements.
  • Standard 3.3 V I/O: Ensures compatibility with common embedded peripherals and interfaces.

Why Choose XPC8260VVIFBC?

The XPC8260VVIFBC positions itself as a compact, integrated embedded processor solution that combines a PowerPC G2 single-core CPU with communications-focused peripherals, memory controllers, and Ethernet capability. This combination supports designers building networked and communications-aware embedded systems who require an on-chip communications co-processor and standard memory interfacing.

Ideal for engineers and procurement teams targeting consumer-grade embedded designs, the device offers a balance of performance, integration, and compliance (RoHS) to reduce board-level complexity and support streamlined system development and deployment.

Request a quote or submit an inquiry to obtain pricing, availability, and additional procurement details for XPC8260VVIFBC.

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