XPC8260ZUIHBC

The XPC8260ZUIHBC is a PowerPC G2 microprocessor (MPC82xx series) with a single 32-bit core running at 200 MHz. Designed for embedded and consumer applications, it integrates communications co-processors and memory controllers to support compact, network-capable system designs.

This device combines on-chip DRAM/SDRAM controllers, 10/100Mbps Ethernet capability, and standard I/O support in a high-density 480-TBGA (37.5×37.5) package while operating from 3.3 V I/O and meeting RoHS compliance.

Key Features

• Core & Performance PowerPC G2 architecture, single 32-bit core at 200 MHz for deterministic embedded processing.
• Memory Support Integrated DRAM and SDRAM controllers to simplify external memory interfacing and system design.
• Communications Co-processors Includes communications and RISC CPM co-processors to offload protocol and packet handling tasks.
• Ethernet Connectivity 10/100Mbps Ethernet capability (10/100Mbps (3)) to support networked embedded applications.
• I/O and Interfaces 3.3 V I/O signaling and additional interfaces such as I2C for peripheral control and system integration.
• Package & Mounting 480-LBGA exposed pad / 480-TBGA (37.5×37.5) supplier device package for surface-mount PCBs where board-level density is required.
• Operating Conditions Rated for operation from 0 °C to 105 °C, suitable for a range of consumer and embedded temperature environments.
• Compliance RoHS compliant and qualified for consumer applications.

Typical Applications

• Embedded Systems Core processing and on-chip memory controllers make the device suitable for compact embedded controllers and application processors.
• Consumer Electronics Consumer-grade qualification and RoHS compliance align the part with consumer product designs requiring integrated communications and memory support.
• Networking Equipment On-chip 10/100Mbps Ethernet and communications co-processors support network interface and packet-handling tasks.
• Memory-Intensive Modules Integrated DRAM/SDRAM controllers provide the interface needed for designs that require external volatile memory.

Unique Advantages

• Integrated Communications Processing: On-chip communications and RISC CPM co-processors reduce external component count and offload protocol processing.
• Memory Interface Integration: Built-in DRAM and SDRAM controllers simplify board design and speed time-to-market for memory-driven applications.
• Compact High-Density Package: The 480-TBGA (37.5×37.5) package delivers high pin density in a surface-mount form factor for space-constrained designs.
• Network-Ready Connectivity: 10/100Mbps Ethernet capability supports integration into networked consumer and embedded products.
• Standards-Friendly I/O: 3.3 V I/O and I2C interface support common peripheral and subsystem connections.
• Regulatory and Environmental Fit: RoHS compliance and consumer qualification help meet regulatory requirements for consumer market products.

Why Choose XPC8260ZUIHBC?

XPC8260ZUIHBC combines a 200 MHz PowerPC G2 core with integrated memory controllers, communications co-processors, and Ethernet capability in a compact 480-TBGA package—providing a balanced platform for embedded and consumer designs that require onboard communications and external memory support. Its 3.3 V I/O, I2C interface, and consumer qualification make it a practical choice for system designers targeting network-capable, compact products.

Manufactured by NXP Semiconductors and RoHS compliant, this part is suited to customers seeking a proven microprocessor building block for embedded applications where integration, predictable performance, and compact packaging are priorities.

Request a quote or submit a pricing inquiry for XPC8260ZUIHBC to receive availability and lead-time details for your next design.