XPC850DECZT50BU

The XPC850DECZT50BU is a microprocessor from NXP Semiconductors' XPC850 series featuring a single 32-bit MPC8xx core running at 50 MHz. Designed for embedded and industrial applications, it integrates communications-focused co-processor support and a range of peripheral interfaces to address control and connectivity requirements.

This device combines a 3.3 V I/O voltage, on-chip DRAM controller support, and industrial qualification with an extended operating temperature range of -40°C to 95°C, delivered in a 256-PBGA (23x23) surface-mount package.

Key Features

• Core and Performance  Single 32-bit MPC8xx core running at 50 MHz for deterministic embedded processing.
• Communications Co-Processors  Includes communications DSP/CPM support to offload and accelerate protocol handling.
• Memory Interface  Integrated DRAM controller support for external memory interfacing.
• Connectivity  Built-in Ethernet (10 Mbps, 1 port) and USB 1.x (1 port) plus HDLC/SDLC interfaces for serial and networked communications.
• Power and I/O  3.3 V I/O voltage suitable for common embedded system voltage domains.
• Package and Mounting  256-PBGA (23x23) package in a surface-mount form factor for compact board designs.
• Qualification and Temperature  Industrial qualification with an operating temperature range of -40°C to 95°C for deployment in harsh environments.

Typical Applications

• Industrial Embedded Systems  Use in embedded control modules and industrial controllers where extended temperature range and industrial qualification are required.
• Communications Equipment  Suitable for devices requiring protocol handling and network interfaces, leveraging the communications co-processor, HDLC/SDLC, Ethernet and USB support.
• Networked Control and Monitoring  Integration into networked monitoring or remote I/O modules that need Ethernet and serial protocol connectivity.

Unique Advantages

• Integrated Communications Support:  Dedicated communications co-processor functionality plus HDLC/SDLC, Ethernet and USB interfaces reduce external component count for protocol handling.
• Industrial-Grade Operation:  Industrial qualification and a -40°C to 95°C operating range enable deployment in temperature-challenging environments.
• Compact Surface-Mount Package:  256-PBGA (23x23) package supports high-density board layouts and surface-mount assembly processes.
• Standard 3.3 V I/O:  3.3 V I/O compatibility simplifies integration with common embedded peripherals and power domains.
• Single-Chip Embedded Processing:  A single 32-bit core at 50 MHz provides deterministic processing for control and communication tasks in compact embedded designs.

Why Choose XPC850DECZT50BU?

The XPC850DECZT50BU balances embedded processing and communications capability in a single, industrially qualified package. With a 32-bit MPC8xx core, dedicated communications co-processor support, Ethernet, USB and serial protocol interfaces, it is positioned for embedded designs that require integrated connectivity and reliable operation across a wide temperature range.

Engineers and procurement teams building industrial or communications-focused embedded products will find this device suitable for designs that prioritize deterministic processing, on-board communications features, and a compact 256-PBGA surface-mount footprint backed by NXP Semiconductors.

Request a quote or submit an inquiry to obtain pricing and availability for the XPC850DECZT50BU and to discuss how it fits your embedded design requirements.