XPC850DSLCZT50BU

The XPC850DSLCZT50BU is a single‑core, 32‑bit MPC8xx microprocessor operating at 50 MHz, packaged in a 256‑pin PBGA (23×23) surface‑mount package. Designed for embedded applications, it integrates core processing with communications‑oriented co‑processors and a range of hardware interfaces.

With 3.3 V I/O, DRAM controller support, industrial qualification and an extended operating temperature range, this device targets embedded and industrial designs that require integrated communications peripherals and robust operating range.

Key Features

• Core and Performance Single 32‑bit MPC8xx core running at 50 MHz, providing deterministic processing for embedded control tasks.
• Communications Co‑processors Integrated co‑processor functionality listed as Communications and CPM to support protocol and packet handling workloads.
• Interfaces On‑chip support for 10 Mbps Ethernet (1), USB 1.x (1) and HDLC/SDLC interfaces for serial and network connectivity.
• Memory Controller DRAM controller support for external memory interfacing to meet system memory requirements.
• Power and I/O 3.3 V I/O level for compatibility with common embedded peripherals and logic families.
• Package and Mounting 256‑PBGA (23×23) surface‑mount package providing a compact footprint for board designs.
• Industrial Qualification and Temperature Range Industrial qualification with an operating temperature range of −40 °C to 95 °C for deployment in demanding environments.

Typical Applications

• Embedded Communications Equipment Use the integrated communications co‑processors, Ethernet and HDLC/SDLC interfaces to handle protocol processing and network interfaces.
• Industrial Control Systems Industrial qualification and −40 °C to 95 °C operating range make the device suitable for control and automation hardware operating in harsh conditions.
• Network Appliances and Gateways 10 Mbps Ethernet, USB 1.x and CPM capabilities enable basic networking and gateway functions in compact embedded platforms.
• USB‑Enabled Embedded Devices USB 1.x support provides a standard host/device interface for peripherals and local configuration tasks.

Unique Advantages

• Integrated Communications Peripherals: Ethernet, USB and HDLC/SDLC interfaces reduce external component count for networked designs.
• Industrial‑Grade Operation: Qualification and an extended −40 °C to 95 °C temperature range support deployment in industrial environments.
• Compact PBGA Footprint: 256‑PBGA (23×23) surface‑mount package enables dense board layouts while maintaining signal integrity.
• Single‑Voltage I/O: 3.3 V I/O simplifies power rail design and compatibility with common peripheral logic levels.
• Memory Expansion Ready: Built‑in DRAM controller support allows scalable external memory configurations for varied application needs.

Why Choose XPC850DSLCZT50BU?

The XPC850DSLCZT50BU combines a 32‑bit MPC8xx core at 50 MHz with integrated communications co‑processors and a suite of connectivity interfaces, making it a practical choice for embedded designs that require network and serial protocol handling in a compact package. Its industrial qualification and wide operating temperature range position it for reliable operation in demanding environments.

As part of the XPC850 family from NXP Semiconductors, this device is suitable for designers seeking a balanced mix of integration, predictable performance and system‑level interfacing for embedded and industrial applications.

Request a quote or submit an inquiry to obtain pricing and availability for the XPC850DSLCZT50BU. Our team will provide the details you need to evaluate this microprocessor for your next embedded design.