XPC850SRZT50BU

The XPC850SRZT50BU is a single-core 32-bit microprocessor from the XPC850 series by NXP Semiconductors, featuring the MPC8xx core running at 50 MHz. Designed for embedded applications, it integrates communications-focused peripherals and memory controllers to support control and connectivity tasks in consumer-grade products.

This device operates with 3.3 V I/O, supports DRAM controllers, and provides multiple serial and networking interfaces in a compact 256-PBGA (23×23) surface-mount package, with an operating range of 0 °C to 95 °C.

Key Features

• Core  MPC8xx single 32-bit core running at 50 MHz, suitable for control and embedded processing tasks.
• Memory & Controllers  Integrated DRAM controller to interface with external memory for system storage and runtime data buffering.
• Communications Coprocessors  Includes communications-focused coprocessors (CPM) to offload protocol handling and DSP-related functions.
• Network & USB  Built-in 10 Mbps Ethernet interface (1) and USB 1.x support (1) for wired networking and host/device connectivity.
• Serial Protocols  Additional interfaces for HDLC/SDLC to support synchronous serial communication protocols.
• Power & I/O  3.3 V I/O voltage standard for compatibility with common embedded peripherals and logic levels.
• Package & Mounting  256-PBGA (23×23) package in a surface-mount form factor for compact board designs.
• Operating Range  Rated for operation from 0 °C to 95 °C, targeted to consumer-qualified applications.
• Compliance  RoHS compliant for environmental and manufacturing requirements.

Typical Applications

• Embedded control systems  Use the MPC8xx core and DRAM controller for general-purpose control and data handling in embedded products.
• Connected consumer devices  On-chip Ethernet and USB interfaces enable networked and USB-enabled consumer applications.
• Serial communications equipment  HDLC/SDLC support and communications coprocessors allow implementation of synchronous serial protocol handlers.

Unique Advantages

• Integrated communications peripherals: Ethernet, USB 1.x and HDLC/SDLC interfaces reduce external component count for connectivity-focused designs.
• Dedicated communications coprocessors: CPM and DSP-oriented resources help offload protocol processing from the main core for efficient throughput.
• Standard 3.3 V I/O: Ensures compatibility with common peripheral voltage domains and simplifies power supply design.
• Compact surface-mount package: 256-PBGA (23×23) supports dense board layouts while providing a robust mounting solution.
• Consumer qualification and RoHS compliance: Suited for consumer market deployments with environmental compliance for manufacturing.

Why Choose XPC850SRZT50BU?

XPC850SRZT50BU combines a 32-bit MPC8xx core with integrated communications coprocessors and multiple I/O interfaces to deliver a balanced solution for embedded designs that require moderate processing and robust connectivity. Its DRAM controller and standard 3.3 V I/O help streamline system architecture while the 256-PBGA package supports compact board implementation.

As part of the XPC850 series from NXP Semiconductors, this device is positioned for consumer-grade embedded applications where connectivity, integration, and predictable operating range (0 °C to 95 °C) are important considerations for product design and deployment.

Request a quote or submit an inquiry today to get pricing and availability information for XPC850SRZT50BU and support for your embedded design needs.