XPC850DSLZT50BU

The XPC850DSLZT50BU is a single‑core 32‑bit MPC8xx microprocessor designed for embedded applications. It integrates a 50 MHz core with communications and memory controller features to support embedded systems and consumer‑grade devices.

Built for designs requiring on‑chip communications peripherals and standard 3.3 V I/O, this part is offered in a 256‑PBGA (23 × 23) surface‑mount package and is RoHS compliant.

Key Features

• Core  Single 32‑bit MPC8xx core operating at 50 MHz, providing deterministic processing for embedded control and communications tasks.
• Memory and Controllers  Integrated DRAM controller support to interface with external memory for program and data storage.
• Communications and Peripherals  On‑chip Communications Processor Module (CPM) and DSP co‑processor support, plus HDLC/SDLC and USB 1.x interfaces and a 10 Mbps Ethernet interface for networking and serial protocol handling.
• Power and I/O  3.3 V I/O voltage compatibility for standard embedded logic-level interfacing.
• Package and Mounting  256‑PBGA (23 × 23) package in a surface‑mount form factor, suitable for compact board layouts.
• Operating Range and Qualification  Rated for operation from 0 °C to 95 °C and qualified for consumer applications; RoHS compliant for regulatory alignment.

Typical Applications

• Embedded communications equipment  Use the integrated CPM, HDLC/SDLC, USB 1.x and 10 Mbps Ethernet interfaces for protocol handling and data transport in compact embedded systems.
• Consumer electronics  Consumer‑grade qualification and standard 3.3 V I/O make this MPU suitable for control and interface duties in consumer products.
• USB‑enabled peripherals  The on‑chip USB 1.x interface supports development of USB host/device peripherals and connected accessory control.
• Networked embedded controllers  Use the 10 Mbps Ethernet interface and communications co‑processor to add basic network connectivity to embedded controllers.

Unique Advantages

• Integrated communications co‑processor: The CPM and DSP communication support reduce external buffering and protocol handling complexity.
• Multiple built‑in interfaces: Native USB 1.x, HDLC/SDLC and 10 Mbps Ethernet simplify connectivity for a range of embedded networking tasks.
• Standard voltage I/O: 3.3 V I/O compatibility eases integration with common peripheral chips and logic families.
• Compact surface‑mount package: 256‑PBGA (23 × 23) package enables high‑density PCB designs while supporting the necessary I/O connections.
• Consumer qualification and RoHS compliance: Suitable for consumer applications while meeting RoHS environmental requirements.

Why Choose XPC850DSLZT50BU?

The XPC850DSLZT50BU combines a 32‑bit MPC8xx core at 50 MHz with integrated communications and memory controller features to deliver a compact, embedded‑focused MPU option. Its on‑chip CPM, USB 1.x, HDLC/SDLC and 10 Mbps Ethernet interfaces make it well suited for designs that require integrated protocol support and standard 3.3 V I/O.

As part of the XPC850 series from NXP Semiconductors, this device is positioned for consumer‑grade embedded designs that need a balanced integration of processing and communications capabilities in a 256‑PBGA surface‑mount package, operating across 0 °C to 95 °C.

Request a quote or submit an inquiry to receive pricing and availability for the XPC850DSLZT50BU and support for your embedded design needs.