XPC850DEZT50BT

The XPC850DEZT50BT is a single-core MPC8xx 32-bit microprocessor operating at 50 MHz, designed for embedded applications. It integrates communications-focused peripherals and memory controllers to support compact system designs in consumer and embedded markets.

With 3.3 V I/O, an on-chip DRAM controller, a Communications Processor Module (CPM) for communications/DSP tasks, and native interfaces such as 10 Mbps Ethernet, USB 1.x and HDLC/SDLC, this device delivers a balanced combination of processing and connectivity in a 256-PBGA (23×23) surface-mount package.

Key Features

• Core & Performance Single 32-bit MPC8xx core running at 50 MHz for deterministic embedded processing.
• Power & I/O Voltage 3.3 V I/O support suitable for common embedded logic levels.
• Memory & Controllers Integrated DRAM controller to support external memory without additional controller ICs.
• Communications & Co-Processing Communications/DSP co-processor (CPM) provides dedicated handling of communications tasks.
• Network & Peripheral Interfaces Built-in 10 Mbps Ethernet (1) and USB 1.x (1) plus HDLC/SDLC interfaces for serial link and networking implementations.
• Package & Mounting 256-PBGA (23×23) package in a surface-mount form factor for compact PCB layouts.
• Qualification & Environmental Consumer-qualified device and RoHS-compliant for regulatory and environmental alignment.
• Operating Range Rated for operation from 0 °C to 95 °C to cover typical consumer and embedded operating environments.
• Graphics No graphics acceleration—focused on control and communications functions.

Typical Applications

• Embedded control systems — Single-core 32-bit processing and DRAM controller support control and management tasks in compact embedded designs.
• Networking and communications equipment — Integrated CPM, Ethernet, and HDLC/SDLC interfaces enable protocol handling and network connectivity.
• USB-enabled consumer devices — USB 1.x support provides basic host/device connectivity for consumer peripherals.
• Consumer electronics — Consumer qualification and RoHS compliance make the device suitable for consumer-focused products requiring integrated communications.

Unique Advantages

• Integrated communications peripherals: CPM plus Ethernet, USB and HDLC/SDLC interfaces reduce external component count for networked designs.
• On-chip DRAM controller: Simplifies memory subsystem design and lowers BOM complexity.
• Compact PBGA package: 256-PBGA (23×23) delivers a small footprint for space-constrained PCB layouts.
• Industry-standard I/O voltage: 3.3 V I/O compatibility with common embedded logic families.
• RoHS-compliant and consumer-qualified: Aligns with environmental standards and consumer product requirements.
• Extended operating range: 0 °C to 95 °C supports deployment across typical consumer and embedded temperature conditions.

Why Choose XPC850DEZT50BT?

The XPC850DEZT50BT positions itself as a focused embedded microprocessor solution that combines a 32-bit MPC8xx core with communications-oriented peripherals and memory control. Its integration of Ethernet, USB, HDLC/SDLC and a CPM co-processor reduces external components and simplifies system design for consumer and embedded products.

Products and teams looking for a compact, RoHS-compliant processor option with built-in communications interfaces and a 256-PBGA footprint will find the XPC850DEZT50BT suitable for space- and BOM-constrained designs backed by NXP Semiconductors’ MPC8xx series pedigree.

Request a quote or submit an inquiry today to receive pricing and availability for XPC850DEZT50BT. Our team can provide the information you need to evaluate this MCU for your next embedded design.