XPC850CZT50BU

The XPC850CZT50BU is an NXP Semiconductors XPC850 series microprocessor built on the MPC8xx core architecture. It provides a single 32‑bit core running at 50 MHz with integrated communications co‑processing and a DRAM controller, targeted for embedded and industrial applications.

Designed for integration into embedded systems, the device combines on‑chip communications interfaces with standard I/O voltage and industrial temperature qualification to simplify system design and deployment.

Key Features

• Core Single MPC8xx 32‑bit core operating at 50 MHz delivering deterministic processing for embedded control and communication tasks.
• Memory and Controllers Integrated DRAM controller support for system memory interfacing.
• Communications Co‑processor On‑chip Communications Processor Module (CPM) for handling communications and DSP‑oriented tasks.
• Interfaces Built‑in networking and peripheral interfaces including a 10 Mbps Ethernet port (1), USB 1.x port (1), and HDLC/SDLC support for serial data link protocols.
• Power 3.3 V I/O voltage for standard embedded system compatibility.
• Package and Mounting 256‑pin PBGA package (23 × 23 mm) in a surface‑mount format for compact board integration.
• Operating Range and Qualification Industrial qualification with an operating temperature range of −40 °C to 95 °C for demanding environments.
• Compliance RoHS‑compliant manufacturing status.

Typical Applications

• Industrial Embedded Controllers — Suitable for embedded control systems that require industrial temperature qualification and deterministic 32‑bit processing.
• Industrial Networking Equipment — On‑chip Ethernet and HDLC/SDLC interfaces enable use in networked communication nodes and protocol handling devices.
• Peripheral Controllers with USB — USB 1.x connectivity supports attachment of legacy USB peripherals or host interfaces in embedded systems.

Unique Advantages

• Integrated Communications Engine: Built‑in CPM supports communications and DSP tasks, reducing external component count and offloading the main core.
• Embedded‑Ready I/O Voltage: 3.3 V I/O simplifies integration with common peripherals and board-level power domains.
• Industrial Temperature Qualification: −40 °C to 95 °C operating range enables deployment in harsh and temperature‑sensitive environments.
• Compact BGA Footprint: 256‑pin PBGA (23 × 23 mm) offers high I/O density in a compact surface‑mount package.
• Versatile Interface Set: Native Ethernet, USB 1.x, and HDLC/SDLC support enable a range of communication and peripheral use cases without extensive external logic.
• RoHS Compliance: Environmentally compliant manufacturing status for regulated markets.

Why Choose XPC850CZT50BU?

The XPC850CZT50BU positions itself as a compact, industrially qualified microprocessor option that balances integration and predictable 32‑bit performance. With integrated communications processing, DRAM controller support, and essential interfaces such as Ethernet and USB, it is suited to embedded designs that require on‑board protocol handling and reliable operation across a wide temperature range.

Engineers and procurement teams seeking a single‑chip solution for industrial embedded systems will find the XPC850CZT50BU offers a focused feature set from NXP Semiconductors’ XPC850 series, enabling reduced system complexity and dependable field performance.

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