XPC8260ZUIFBC

The XPC8260ZUIFBC is a PowerPC G2 microprocessor (MPC82xx series) in a single-core, 32-bit configuration running at 200 MHz. It integrates communications-focused coprocessors and memory controller capabilities suited for embedded applications.

Designed and manufactured by NXP Semiconductors, this device targets embedded and consumer systems that require integrated Ethernet connectivity, DRAM/SDRAM support, and a compact 480-TBGA surface-mount package with an exposed pad.

Key Features

• Core Single PowerPC G2 core, 32-bit architecture operating at 200 MHz for deterministic embedded processing.
• Coprocessors & Communications Includes communications and RISC CPM coprocessors to offload protocol and communications tasks from the main core.
• Memory Controllers Integrated DRAM and SDRAM controllers to support external memory interfaces for system memory expansion.
• Ethernet Connectivity 10/100 Mbps Ethernet capability (10/100Mbps (3)) for wired network interfacing and connectivity.
• Interfaces Additional peripheral connectivity including I2C for sensor and peripheral control.
• Power and Thermal 3.3 V I/O voltage and an operating temperature range of 0 °C to 105 °C to match consumer embedded environments.
• Package & Mounting 480-TBGA surface-mount package (37.5×37.5 mm) with an exposed pad (480-LBGA), optimized for compact board layouts.
• Qualification & Compliance Consumer qualification and RoHS compliance suitable for consumer-focused embedded products.

Typical Applications

• Embedded Consumer Devices Suitable for consumer-grade embedded systems that require a single 32-bit PowerPC G2 processor and integrated memory interfaces.
• Networked Equipment Devices that need 10/100 Mbps Ethernet connectivity and communications offload via dedicated coprocessors.
• Peripheral and Interface Controllers Systems using I2C and external DRAM/SDRAM where a compact, surface-mount package and exposed pad are preferred.

Unique Advantages

• Integrated PowerPC G2 Core: Single 32-bit core at 200 MHz provides a known processor architecture for embedded control tasks.
• Communications Offload: Built-in communications and RISC CPM coprocessors reduce CPU load for networking and protocol processing.
• Broad Memory Support: On-chip DRAM and SDRAM controllers simplify external memory interfacing and system design.
• Multiple Ethernet Capability: 10/100 Mbps Ethernet support (10/100Mbps (3)) enables wired connectivity options for networking applications.
• Compact, Serviceable Package: 480-TBGA (37.5×37.5 mm) with exposed pad and surface-mount compatibility supports dense board layouts and thermal management.
• Consumer Qualification & RoHS Compliance: Suited for consumer products with environmental compliance for lead-free manufacturing.

Why Choose XPC8260ZUIFBC?

The XPC8260ZUIFBC combines a 200 MHz PowerPC G2 core with integrated communications coprocessors, memory controllers, and Ethernet capability in a compact 480-TBGA package. Its 3.3 V I/O, consumer qualification, and 0 °C to 105 °C operating range make it appropriate for embedded consumer designs that require balanced processing and connectivity.

Manufactured by NXP Semiconductors, this MPU is well suited for designers seeking a single-chip embedded processing solution with on-chip communications support, external memory interfacing, and a surface-mount package for space-constrained boards.

Request a quote or contact sales to discuss availability, lead times, and pricing for the XPC8260ZUIFBC.