XPC850DECVR50BU

The XPC850DECVR50BU is a single‑core, 32‑bit MPC8xx microprocessor running at 50 MHz in a 256‑PBGA (23×23) package. Designed for embedded and industrial applications, it integrates core processing, memory control and multiple communications interfaces to support compact system designs.

With a 3.3 V I/O voltage, industrial-grade qualification and an extended operating temperature range of −40 °C to 95 °C, this device is suited for embedded systems requiring stable operation across demanding environments.

Key Features

• Core  MPC8xx single 32‑bit core operating at 50 MHz, providing deterministic processing for embedded control tasks.
• Memory & Controllers  On‑chip DRAM controller support to interface system memory for application and data storage needs.
• Communications Co‑processor  Includes a communications co‑processor (CPM) for offloading protocol handling and improving overall system throughput.
• Interfaces  Integrated Ethernet (10 Mbps) and USB 1.x interfaces plus HDLC/SDLC support for common industrial and networking connectivity.
• Power & I/O  3.3 V I/O signaling to match common embedded peripherals and board‑level designs.
• Package & Mounting  256‑PBGA (23×23) / 256‑BBGA package in a surface‑mount form factor for compact PCB layouts.
• Qualification & Temperature Range  Industrial qualification with an operating range from −40 °C to 95 °C for deployment in robust environments.
• Compliance  RoHS‑compliant construction for regulatory and environmental requirements.

Typical Applications

• Industrial Control  Embedded controller platforms that require predictable 32‑bit processing and industrial temperature operation for machine control and automation.
• Embedded Networking  Low‑bandwidth networked devices using the integrated 10 Mbps Ethernet and HDLC/SDLC interfaces for protocol connectivity.
• Communications Equipment  Systems that benefit from a dedicated communications co‑processor (CPM) to handle serial and protocol processing tasks.
• Peripheral Interface Systems  Embedded designs requiring USB 1.x host/device connectivity and DRAM support for buffering and application memory.

Unique Advantages

• Integrated communications offload: The on‑chip communications co‑processor (CPM) simplifies protocol handling and reduces main CPU overhead.
• Multiple built‑in interfaces: Ethernet, USB 1.x and HDLC/SDLC support consolidated I/O needs and reduces external controller requirements.
• Industrial temperature rating: Rated for −40 °C to 95 °C to support deployment in environments with wide temperature swings.
• Compact BGA package: 256‑PBGA (23×23) surface‑mount package enables dense PCB integration and space‑constrained designs.
• Standard 3.3 V I/O: Compatibility with common embedded peripherals simplifies power domain design and interconnect choices.
• RoHS compliant: Meets common environmental compliance needs for modern electronics manufacturing.

Why Choose XPC850DECVR50BU?

The XPC850DECVR50BU positions itself as a compact, integrated microprocessor solution for embedded and industrial systems that need a reliable 32‑bit core, communications offload, and a range of on‑chip interfaces. Its combination of DRAM controller, Ethernet, USB and protocol interfaces supports systems that require both control processing and communications capability in a single device.

Designed for engineers and procurement teams building industrial and embedded products, this part delivers a balance of integration, temperature robustness and standard‑level I/O to reduce external components and simplify board design while maintaining clear, verifiable hardware specifications.

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