XPC850DEZT50BU

The XPC850DEZT50BU is a single‑core, 32‑bit MPC8xx microprocessor operating at 50 MHz, designed for embedded applications. It combines a general‑purpose core with integrated communications and peripheral interfaces to support consumer‑grade embedded systems.

Key on‑chip capabilities include a communications processor module (CPM), DRAM controller, 10 Mbps Ethernet, USB 1.x, and HDLC/SDLC support. The device is packaged in a 256‑PBGA (23x23) surface‑mount package, uses 3.3 V I/O, and is RoHS compliant with an operating temperature range of 0 °C to 95 °C.

Key Features

• Core & Performance  Single 32‑bit MPC8xx core running at 50 MHz for embedded control and protocol handling.
• Communications Coprocessor  On‑chip CPM (communications processor module) to offload protocol processing and assist with serial communications.
• Network & Peripheral Interfaces  Integrated 10 Mbps Ethernet (1), USB 1.x (1), and HDLC/SDLC interfaces for networked and serial connectivity.
• Memory Controller  On‑chip DRAM controller to simplify external memory interfacing and reduce system BOM.
• Power & I/O  3.3 V I/O voltage compatibility for common embedded peripherals and board designs.
• Package & Assembly  256‑PBGA (23x23) package, surface mount for compact board layouts.
• Operating Range & Qualification  Consumer qualification with an operating temperature range of 0 °C to 95 °C.
• Regulatory  RoHS compliant.

Typical Applications

• Consumer Embedded Devices  Suitable for consumer‑grade systems that require a 32‑bit processor with integrated communications and memory control.
• Networking and Communication Modules  Use the onboard Ethernet, USB and HDLC/SDLC interfaces alongside the CPM for compact communication subsystems.
• Peripheral Interface Controllers  Ideal for designs that need USB 1.x connectivity and serial protocol handling with offloaded CPM support.

Unique Advantages

• Integrated Communications Support: On‑chip CPM plus Ethernet, USB and HDLC/SDLC reduce the need for external protocol processors.
• Simplified Memory Integration: Built‑in DRAM controller streamlines external memory interfacing and board design.
• Standard 3.3 V I/O: Compatible with a wide range of modern peripherals and logic families for easier system integration.
• Compact Surface‑Mount Package: 256‑PBGA (23x23) package supports dense PCB layouts for space‑constrained designs.
• Consumer‑Grade Temperature Range: Operating range of 0 °C to 95 °C matched to many commercial applications.
• RoHS Compliant: Supports environmental and regulatory requirements for lead‑free assemblies.

Why Choose XPC850DEZT50BU?

The XPC850DEZT50BU positions itself as a compact, integrated solution for embedded designs that require a 32‑bit single‑core processor with built‑in communications and memory support. Its combination of CPM, Ethernet, USB, HDLC/SDLC and DRAM controller reduces external component count and simplifies system architecture.

This device is well suited to engineering teams developing consumer‑grade embedded systems and communication‑centric modules that benefit from 3.3 V I/O, a 256‑PBGA surface‑mount package, and a 0 °C to 95 °C operating range. RoHS compliance further supports modern manufacturing requirements.

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