XPC850ZT50BU

The XPC850ZT50BU is an MPC8xx-series 32-bit microprocessor from NXP Semiconductors, featuring a single-core 50 MHz core in a 256‑PBGA (23×23) surface-mount package. It is targeted at embedded applications and consumer-class designs that require integrated communications support and standard 3.3 V I/O.

This device integrates communication-focused co-processing and a range of peripheral interfaces—making it suitable for embedded systems that need Ethernet, USB 1.x connectivity, and serial link protocols alongside DRAM support.

Key Features

• Core  Single MPC8xx 32‑bit core running at 50 MHz for deterministic embedded processing.
• Power and I/O  3.3 V I/O voltage for compatibility with common embedded system levels.
• Communications Co-Processor  Includes Communications/CPM co‑processor capabilities to handle communications tasks and offload the main core.
• Memory Controller  Built‑in DRAM controller to interface with external memory systems.
• Connectivity  On‑chip Ethernet (10 Mbps, 1 port), USB 1.x (1 port) and HDLC/SDLC interfaces for serial link and networked applications.
• Package and Mounting  256‑PBGA package (23×23) in a surface‑mount form factor for compact PCB designs.
• Operating Range  Rated for operation from 0 °C to 95 °C for consumer‑grade environments.
• Compliance  RoHS‑compliant component suitable for lead‑free manufacturing processes.
• Qualification  Consumer qualification for deployment in consumer embedded products.
• Graphics  No graphics acceleration—focus is on communications and embedded control functions.

Typical Applications

• Embedded Communications  Use the integrated CPM, Ethernet and HDLC/SDLC interfaces to implement protocol handling and networked endpoints.
• Consumer Embedded Devices  Consumer‑qualified MCU for embedded control in consumer products that require USB and serial communications.
• USB‑Enabled Peripherals  USB 1.x support enables integration into devices requiring basic USB connectivity and peripheral interfacing.
• Memory‑Backed Control Systems  On‑chip DRAM controller supports applications that need external DRAM for buffering or application data storage.

Unique Advantages

• Integrated Communications Subsystem: Communications/CPM co‑processor plus HDLC/SDLC and Ethernet simplify implementation of protocol‑heavy designs.
• Balanced Embedded Performance: Single 32‑bit core at 50 MHz provides predictable processing for control and communications tasks.
• Standard 3.3 V I/O: Voltage compatibility with common embedded peripherals reduces level‑shifting requirements.
• Compact Surface‑Mount Package: 256‑PBGA (23×23) enables dense PCB layouts while keeping a standardized footprint.
• Consumer Qualification and RoHS Compliance: Meets consumer‑grade qualification and RoHS requirements for lead‑free manufacturing and regulatory compliance.
• Wide Operating Range: 0 °C to 95 °C rating supports deployments across a range of consumer environmental conditions.

Why Choose XPC850ZT50BU?

The XPC850ZT50BU positions itself as a communication‑focused embedded microprocessor combining a 32‑bit MPC8xx core with integrated communications co‑processing, DRAM controller, Ethernet, USB and serial link interfaces. Its 3.3 V I/O and compact 256‑PBGA package make it suitable for space‑conscious consumer embedded designs that require on‑device protocol handling and external memory support.

Manufactured by NXP Semiconductors and RoHS‑compliant, this part is appropriate for designers seeking a consumer‑qualified, communications‑oriented MPU with a predictable operating range and standard I/O levels.

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