XPC8240RVV250E

IC MPU MPC82XX 250MHZ 352TBGA
Part Description

PowerPC 603e Microprocessor IC MPC82xx 1 Core, 32-Bit 250MHz 352-TBGA (35x35)

Quantity 640 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesXPC8240
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Core ProcessorPowerPC 603eDevice Package352-TBGA (35x35)ECCN3A991A2
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature0°C ~ 105°C (TA)Package / Case352-LBGARAM ControllersDRAM, SDRAM
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSpeed250MHz
Supplier Device Package352-TBGA (35×35)Voltage – I/O3.3V

Overview of XPC8240RVV250E – PowerPC 603e 250 MHz 32‑Bit Microprocessor (1 Core, 352‑TBGA)

The XPC8240RVV250E is a single‑core PowerPC 603e microprocessor from the XPC8240 series by NXP Semiconductors. It delivers 32‑bit processing at 250 MHz with integrated memory controller support, targeted for embedded designs and consumer applications.

Designed for surface‑mount board designs, the device operates with 3.3 V I/O and supports DRAM and SDRAM memory interfaces, offering a compact BGA package option for OEMs and system integrators focused on embedded processing tasks.

Key Features

  • Core — PowerPC 603e single‑core 32‑bit processor running at 250 MHz, suitable for single‑threaded embedded workloads.
  • Memory — Integrated DRAM and SDRAM controllers to simplify external memory interfacing and board design.
  • Power and I/O — 3.3 V I/O voltage for standard board‑level integration with common peripherals and logic.
  • Interfaces — Includes I2C interface for system management and peripheral control.
  • Package and Mounting — Supplier device package: 352‑TBGA (35×35); package case listed as 352‑LBGA; designed for surface‑mount assembly.
  • Operating Range — Specified operating temperature range of 0 °C to 105 °C for consumer embedded environments.
  • Compliance — RoHS compliant to meet environmental requirement needs for consumer products.

Typical Applications

  • Consumer Embedded Systems — Use as the main processor in consumer devices that require a 32‑bit PowerPC core and external DRAM/SDRAM support.
  • Board‑Level OEM Designs — Suitable for OEMs needing a surface‑mount BGA microprocessor with 3.3 V I/O and integrated memory controllers.
  • Control and Management Functions — Ideal for embedded control tasks where a single‑core 250 MHz processor and I2C interface are sufficient.

Unique Advantages

  • Compact BGA Packaging: 352‑TBGA (35×35) supplier package and surface‑mount mounting reduce board footprint for space‑constrained designs.
  • Integrated Memory Support: On‑chip DRAM and SDRAM controllers simplify external memory design and reduce BOM complexity.
  • Standard 3.3 V I/O: Facilitates interoperability with a wide range of common peripherals and interface logic.
  • Consumer Qualification: Product qualification for consumer applications aligns with consumer product development and deployment.
  • RoHS Compliant: Meets environmental compliance needs for modern consumer electronics manufacturing.
  • Operating Temperature Range: 0 °C to 105 °C supports typical consumer‑grade environmental conditions.

Why Choose XPC8240RVV250E?

The XPC8240RVV250E positions itself as a practical single‑core PowerPC 603e solution for embedded and consumer applications that require a 32‑bit 250 MHz processor with integrated memory controller support. Its 352‑TBGA/352‑LBGA packaging and surface‑mount form factor make it well suited for compact, board‑level OEM implementations.

Backed by NXP Semiconductors and offered as part of the XPC8240 series, the device provides a balance of processing capability, standard 3.3 V I/O, and environmental compliance that supports consumer product lifecycles and streamlined system integration.

Request a quote or submit an inquiry for XPC8240RVV250E to discuss availability, pricing, and delivery for your design needs.

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