XPC8240RZU250E

The XPC8240RZU250E is a PowerPC 603e microprocessor from NXP Semiconductors, implemented as a single 32-bit core running at 250 MHz. Designed for embedded use, this industrial-qualified device integrates DRAM/SDRAM controllers and DMA support in a compact 352-TBGA (35×35) surface-mount package.

Its combination of a PowerPC core, 3.3 V I/O, and an operating temperature range of 0 °C to 105 °C makes it suitable for embedded and industrial systems requiring a deterministic 32-bit processing element with on-chip memory controller support.

Key Features

• Core PowerPC 603e single-core, 32-bit microprocessor running at 250 MHz for deterministic embedded processing.
• Memory Controllers Integrated DRAM and SDRAM controllers to simplify external memory interfacing and board design.
• I/O Voltage 3.3 V I/O level for compatibility with common 3.3 V system logic.
• Interfaces Built-in DMA support to offload data transfers and improve system throughput.
• Package & Mounting 352-TBGA (35×35) supplier package in a 352-LBGA case, designed for surface mount PCB assembly.
• Qualification & Temperature Industrial qualification with an operating temperature range of 0 °C to 105 °C for extended ambient operation.
• Graphics No graphics acceleration—optimized for control and data-processing tasks rather than graphics workloads.

Typical Applications

• Industrial Embedded Control — Use in industrial embedded systems where the industrial qualification and 0 °C to 105 °C operating range are required.
• Memory-Centric Systems — Designs that leverage onboard DRAM/SDRAM controllers for straightforward external memory integration.
• Board-Level Embedded Modules — Compact, surface-mount 352-TBGA packaging suited to dense PCB layouts and module-level implementations.
• DMA-Accelerated Data Handling — Applications that benefit from DMA to reduce CPU load during data transfers.

Unique Advantages

• Deterministic PowerPC Processing: Single 32-bit PowerPC 603e core at 250 MHz provides a known processing profile for embedded control tasks.
• Integrated Memory Support: On-chip DRAM and SDRAM controllers reduce external logic and simplify memory subsystem design.
• Industrial Temperature Range: Rated 0 °C to 105 °C to support extended ambient environments common in industrial deployments.
• Compact TBGA Footprint: 352-TBGA (35×35) surface-mount package enables high-density board designs and module implementations.
• Efficient Data Movement: DMA interface support helps offload and accelerate data transfers, improving overall system efficiency.
• 3.3 V I/O Compatibility: Standard 3.3 V I/O levels simplify interfacing with widely used logic families and peripherals.

Why Choose XPC8240RZU250E?

The XPC8240RZU250E positions itself as a practical choice for embedded and industrial designs that require a single 32-bit PowerPC 603e core at 250 MHz, integrated DRAM/SDRAM controllers, and DMA support in a compact TBGA package. Its industrial qualification and 0 °C to 105 °C operating range make it suitable for applications that need extended ambient tolerance.

Backed by NXP Semiconductors, this microprocessor is appropriate for engineers and procurement teams seeking a reliable, board-level processing element with on-chip memory controller functionality, compact packaging, and standard 3.3 V I/O for straightforward system integration.

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