XPC823EVR75B2

The XPC823EVR75B2 is a PowerPC-based microprocessor device designed for embedded consumer applications. It integrates a single 32-bit PowerPC core running at 75 MHz with on-chip controllers and communication interfaces to support display, USB, Ethernet and DRAM connectivity.

This surface-mount 256-PBGA (23×23) packaged device provides a compact, RoHS-compliant solution for embedded designs requiring a balanced mix of processing, peripheral integration and standard I/O at 3.3 V I/O and an operating range of 0 °C to 95 °C.

Key Features

• Core and Performance Single 32-bit PowerPC core operating at 75 MHz suitable for mainstream embedded control and processing tasks.
• Memory and Controllers Integrated DRAM controller to interface with external memory for system and application data storage.
• Communications Co-processor Includes a Communications RISC CPM co-processor to offload communications tasks and support system-level connectivity.
• Interfaces and Peripherals On-chip support for USB 1.x and I2C, plus display interface controllers for LCD and video applications.
• Networking Single 10 Mbps Ethernet interface for basic network connectivity in embedded systems.
• Power and Mounting 3.3 V I/O voltage and surface-mount package format for straightforward integration into standard PCB designs.
• Package and Thermal 256-PBGA (23×23) package with an operating temperature range of 0 °C to 95 °C, suited to consumer-grade environments.
• Compliance RoHS-compliant construction for environmental regulatory alignment.

Typical Applications

• Consumer Embedded Devices — System control and peripheral management in consumer electronics that require integrated I/O and display support.
• User Interface and Display Control — Driving LCD/video interfaces and managing UI tasks with the on-chip display controllers and PowerPC core.
• Networked Appliances — Basic network connectivity and local communications using the 10 Mbps Ethernet and USB 1.x interfaces.
• Peripheral and Sensor Hubs — Local control nodes that combine I2C sensor interfacing with USB and communications offload via the CPM co-processor.

Unique Advantages

• Integrated Communications Processing: On-chip Communications RISC CPM reduces host CPU overhead for networking and serial tasks.
• Compact PBGA Package: 256-PBGA (23×23) offers a dense, surface-mount form factor for space-constrained boards.
• Standard I/O Suite: Built-in USB 1.x, I2C and 10 Mbps Ethernet provide common connectivity options without additional controllers.
• Designed for Consumer Environments: Qualified to consumer specifications and rated for 0 °C to 95 °C operation for typical consumer product conditions.
• Single-Supply I/O: 3.3 V I/O simplifies power domain planning in many embedded designs.
• RoHS Compliant: Meets environmental compliance requirements for product manufacturing.

Why Choose XPC823EVR75B2?

The XPC823EVR75B2 positions itself as a balanced embedded microprocessor solution combining a PowerPC 32-bit core with integrated communication and display interfaces. Its mix of on-chip controllers, peripheral interfaces and a compact 256-PBGA package makes it suitable for consumer-focused embedded systems that need integrated connectivity and display support.

Designed and supplied by NXP Semiconductors, this RoHS-compliant device targets designers seeking a compact, single-core microprocessor with standard I/O options and modest performance for cost- and space-conscious applications.

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