XPC823ECZT66BA

The XPC823ECZT66BA is a PowerPC-based microprocessor IC from NXP Semiconductors’ XPC823 series. It implements a single 32-bit core running at 66 MHz and is targeted at embedded applications that require integrated communications and display interfaces.

Designed for industrial environments, the device combines a PowerPC core with on-chip peripheral controllers and I/O to simplify system design while supporting operation across a wide temperature range.

Key Features

• Core Architecture Single 32-bit PowerPC core operating at 66 MHz for deterministic embedded processing.
• Co-Processors Integrated communications and RISC CPM co-processors to offload protocol and communications tasks.
• Memory Controller On-chip DRAM controller for external memory interfacing and system memory management.
• Display Interfaces Built-in LCD and video controllers to support user interfaces and basic video output requirements.
• Ethernet & USB Single 10 Mbps Ethernet interface and one USB 1.x port for network and peripheral connectivity.
• Additional I/O I2C interface and other peripheral I/O to integrate sensors and system components.
• Power and Mounting 3.3 V I/O voltage and surface-mount package for standard embedded board designs.
• Package 256-PBGA (23×23) package for compact board footprint and solder-down assembly.
• Industrial Qualification & Temperature Range Industrial-qualified device rated for operation from -40°C to 95°C for reliable field performance.
• Environmental Compliance RoHS compliant to meet lead-free and hazardous substance requirements.

Typical Applications

• Industrial Control — Embedded controllers and automation nodes that require an industrial-temperature-rated MPU with communications interfaces.
• Human–Machine Interfaces — Systems using on-chip LCD/video controllers to drive local displays and basic graphical interfaces.
• Communications Equipment — Devices that need integrated Ethernet and USB connectivity alongside communications co-processing.
• Embedded OEM Systems — Compact, surface-mount designs where a single-chip MPU with DRAM controller and I/O reduces board complexity.

Unique Advantages

• Integrated Communications Peripherals: Built-in Ethernet, USB and I2C interfaces reduce external component count and simplify board design.
• Dedicated Co-Processing: Communications and RISC CPM co-processors offload protocol handling from the main PowerPC core, improving system determinism.
• Industrial-Grade Operation: Rated for -40°C to 95°C and industrial qualification for deployment in harsh environments.
• Compact PBGA Package: 256-PBGA (23×23) surface-mount package enables space-efficient layouts for embedded products.
• Vendor Backing: Part of the XPC823 series from NXP Semiconductors, offering continuity within a known product family.
• Regulatory Compliance: RoHS compliant for alignment with environmental requirements.

Why Choose XPC823ECZT66BA?

The XPC823ECZT66BA positions performance and integration for embedded and industrial applications by combining a 32-bit PowerPC core with communications co-processors, display controllers, and a DRAM interface in a single 256-PBGA package. Its 3.3 V I/O and industrial temperature rating make it suitable for compact, field-deployed systems that require reliable operation.

This MPU is well suited to designers seeking a small-footprint, surface-mount processor module with built-in networking and peripheral interfaces, backed by NXP Semiconductors and compliant with RoHS requirements for long-term product planning.

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