XPC823CZT66B2T

The XPC823CZT66B2T is a PowerPC-based microprocessor IC from the XPC823 series, featuring a single 32-bit core running at 66 MHz. Designed for embedded and industrial markets, it integrates communications co-processors, display interface controllers, and a DRAM controller to support compact, connected embedded systems.

Key Features

• Core  Single PowerPC 32-bit core at 66 MHz providing deterministic processing for embedded tasks.
• Co-processors  Integrated communications and RISC CPM co-processors to offload protocol and communications tasks.
• Memory Controller  Built-in DRAM controller simplifies external memory interfacing for system-level memory needs.
• Interfaces  On-chip support for Ethernet (10 Mbps), USB 1.x, I2C, and display interfaces (LCD, Video) to enable networking, peripheral connectivity, and user display functionality.
• Power and I/O  3.3 V I/O voltage for compatibility with common embedded peripherals and board-level designs.
• Package & Mounting  Available in a 256-pin PBGA package (23 × 23 mm) / 256-BBGA case and intended for surface-mount assembly to support compact board layouts.
• Operational Range & Qualification  Industrial qualification with an operating temperature range of −40 °C to 95 °C for deployment in thermally demanding environments.
• Regulatory Compliance  RoHS-compliant material status for conformity with lead-free manufacturing requirements.

Typical Applications

• Industrial Embedded Control  Suited for industrial controllers and embedded systems that require a PowerPC core, DRAM support, and an extended temperature range.
• Networking and Communications Equipment  Ethernet 10 Mbps, USB 1.x, and communications co-processors enable use in networked devices and communication modules.
• Human-Machine Interfaces (HMI)  Integrated LCD and video display controllers with USB support make this processor applicable for compact HMI designs.

Unique Advantages

• Integrated Communications Offload: Communications and RISC CPM co-processors reduce host core overhead for protocol processing and I/O tasks.
• Multiple On-chip Interfaces: Native Ethernet, USB 1.x, I2C, and display controllers lower system BOM and simplify peripheral integration.
• Industrial Temperature Qualification: Rated for −40 °C to 95 °C operation, supporting deployments in harsh or variable-temperature environments.
• Compact Surface-Mount Package: 256-pin PBGA (23 × 23 mm) packaging enables dense PCB layouts for space-constrained embedded designs.
• 3.3 V I/O Compatibility: Standard 3.3 V I/O simplifies integration with common peripheral devices and board-level power domains.
• RoHS Compliant: Material compliance helps meet modern manufacturing and environmental requirements.

Why Choose XPC823CZT66B2T?

The XPC823CZT66B2T combines a PowerPC 32-bit core with integrated communications co-processors, display controllers, and a DRAM controller to deliver a compact, connected processing solution for industrial embedded designs. Its 3.3 V I/O, surface-mount 256-PBGA package, and industrial temperature rating make it suitable for robust, space-conscious applications.

Backed by NXP Semiconductors as part of the XPC823 series, this device targets engineers and purchasers seeking a verified industrial microprocessor with built-in peripheral interfaces and compliance for modern manufacturing requirements.

Request a quote or submit an inquiry for XPC823CZT66B2T to get pricing, availability, and technical support for your next embedded design.