XPC823EVR66B2

The XPC823EVR66B2 is a PowerPC-based microprocessor IC from the XPC823 series, featuring a single 32-bit core running at 66 MHz. Designed for embedded applications, it combines a PowerPC core with on-chip communications co-processing and a set of peripheral interfaces for systems that require integrated connectivity and display control.

This device targets embedded systems that need a compact, surface-mount solution with on-chip DRAM control, basic networking and USB support, and LCD/video interface capability while operating within a 0 °C to 95 °C range.

Key Features

• Core PowerPC 32-bit single core running at 66 MHz for deterministic embedded processing.
• Voltage 3.3 V I/O voltage compatible with common embedded logic levels.
• Co-processors Communications co-processor and RISC CPM present to offload protocol and communications tasks.
• Memory Control On-chip DRAM controller for external memory interfacing.
• Display Interfaces Includes LCD and video interface controllers for basic display subsystem integration.
• Connectivity Integrated 10 Mbps Ethernet (1) and USB 1.x (1) support plus I2C for peripheral communication.
• Package & Mounting 256-PBGA (23x23) supplier device package, surface-mount for compact board designs.
• Operating Range Rated for operation from 0 °C to 95 °C.
• Regulatory RoHS compliant.
• Graphics Acceleration No dedicated graphics acceleration; display tasks handled by provided LCD/video controllers.

Typical Applications

• Embedded controllers Single-core PowerPC processing with integrated DRAM control for compact embedded control units.
• Display-driven devices LCD and video interface controllers support user-interface and basic graphical displays.
• Communications equipment On-chip Ethernet, USB and I2C interfaces enable networked and peripheral-connected embedded products.
• Consumer electronics RoHS compliance and 0 °C to 95 °C operating range suit consumer-grade embedded designs.

Unique Advantages

• PowerPC architecture Provides a familiar 32-bit core for developers targeting PowerPC instruction sets and toolchains.
• Integrated communications support Built-in Ethernet, USB 1.x and I2C interfaces simplify system-level connectivity requirements.
• On-chip co-processing Communications and RISC CPM co-processors help offload protocol tasks from the main core.
• Compact surface-mount package 256-PBGA (23x23) minimizes board area for space-constrained designs.
• Wide commercial temperature range 0 °C to 95 °C operation fits many consumer and industrial ambient conditions.
• Regulatory compliance RoHS status supports lead-free manufacturing processes.

Why Choose XPC823EVR66B2?

The XPC823EVR66B2 positions itself as a balanced embedded microprocessor offering a PowerPC core, integrated communications interfaces and display controllers in a compact 256-PBGA package. Its combination of on-chip DRAM control, communications co-processing and standard interfaces (Ethernet, USB 1.x, I2C) makes it suitable for products that require moderate processing with integrated connectivity and display support.

Engineers and procurement teams seeking a RoHS-compliant, surface-mount PowerPC solution for consumer or embedded designs will find the XPC823EVR66B2 appropriate for systems that operate within the documented voltage and temperature ranges and that benefit from built-in peripheral interfaces.

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