XPC823EZT66BA

IC MPU 66MHZ 256BGA
Part Description

PowerPC Microprocessor IC - 1 Core, 32-Bit 66MHz 256-PBGA (23x23)

Quantity 1,164 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesXPC823
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; RISC CPMCore ProcessorPowerPCDevice Package256-PBGA (23x23)
Display & Interface ControllersLCD, VideoECCNEAR99Ethernet10Mbps (1)
Graphics AccelerationNoHTS Code8542.31.0000Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature0°C ~ 95°C (TJ)Package / Case256-BBGAREACH ComplianceREACH Unknown
RoHS ComplianceRoHS non-compliantSpeed66MHzSupplier Device Package256-PBGA (23×23)
USBUSB 1.x (1)Voltage – I/O3.3V

Overview of XPC823EZT66BA – PowerPC Microprocessor 66MHz 256‑PBGA

The XPC823EZT66BA is a PowerPC microprocessor IC in the XPC823 series featuring a single 32‑bit core running at 66 MHz. It integrates communications co‑processors and peripheral controllers to address embedded consumer applications.

Designed for surface‑mount deployment in a 256‑PBGA (23×23) package, the device combines on‑chip DRAM control, display interfaces and multiple connectivity options to simplify embedded system designs operating at 3.3 V I/O.

Key Features

  • Core and Performance  Single 32‑bit PowerPC core operating at 66 MHz, suited for general embedded control tasks.
  • Co‑processors  Includes communications and RISC CPM co‑processors for offloading protocol and communications processing.
  • Memory Support  On‑chip DRAM controller to interface with external memory for system buffering and code storage.
  • Display Interfaces  Integrated LCD and video display controllers for user‑interface and graphics output (no dedicated graphics acceleration).
  • Connectivity  Built‑in Ethernet 10 Mbps (1) and USB 1.x (1) ports plus I2C for peripheral and network connectivity.
  • Power and I/O  3.3 V I/O voltage compatibility for common peripheral and board‑level interfacing.
  • Package and Mounting  256‑PBGA (23×23) supplier device package, surface‑mount mounting type for space‑efficient board layouts.
  • Operating Range and Qualification  Consumer qualification with an operating temperature range of 0 °C to 95 °C; RoHS compliant.

Typical Applications

  • Consumer Embedded Devices  General embedded control in consumer products where a single 32‑bit PowerPC core with integrated peripherals is required.
  • User Interface and Display Control  Devices requiring LCD or video output for menus, status displays or simple graphical interfaces.
  • Networked Peripherals  Low‑speed Ethernet‑enabled modules and accessories that need 10 Mbps network connectivity.
  • USB‑Connected Accessories  Peripherals and accessories that interface via USB 1.x and require onboard processing and peripheral control.

Unique Advantages

  • Integrated Communications Interfaces: Ethernet, USB and I2C support reduce external interface components and simplify PCB routing.
  • Built‑in DRAM Controller: Onboard memory controller streamlines external memory integration for buffering and code storage.
  • Compact PBGA Package: 256‑PBGA (23×23) package provides a dense, surface‑mount solution for space‑constrained designs.
  • 3.3 V I/O Compatibility: Standard 3.3 V I/O voltage eases interfacing with common sensors and peripherals.
  • Consumer‑Grade Operating Range: Rated for 0 °C to 95 °C, matching typical consumer environmental requirements.
  • RoHS Compliant: Meets RoHS requirements for lead‑free assembly and regulatory alignment.

Why Choose XPC823EZT66BA?

The XPC823EZT66BA positions itself as a compact, integrated PowerPC‑based microprocessor for consumer embedded designs that require a balance of processing, display control and communications interfaces. Its single 32‑bit core at 66 MHz, communications co‑processors, DRAM controller and multiple I/O options provide a cohesive platform for feature‑rich but space‑constrained products.

As part of NXP Semiconductors' XPC823 series, this device is suited for designers seeking a supplier‑backed component with on‑chip connectivity and display support, reducing board complexity and component count in consumer embedded applications.

Request a quote or submit an inquiry to obtain pricing and availability for the XPC823EZT66BA. Include part number XPC823EZT66BA and your quantity requirements for a prompt response.

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