XOMAPL137DZKBA3

The XOMAPL137DZKBA3 is an ARM926EJ-S 32-bit microprocessor from the Texas Instruments OMAP-L13x series, delivering a single-core 375 MHz processing engine in a compact 256-ball BGA (17×17) package. Designed for embedded applications, it integrates a range of on-chip interfaces and peripherals to support networking, storage, display and industrial control tasks.

With industrial-grade qualification and an extended operating range from −40 °C to 105 °C, this device offers a balance of performance, integration and robustness for systems requiring Ethernet, SATA and USB connectivity alongside SDRAM support and security features.

Key Features

• Core ARM926EJ-S single 32-bit core operating at 375 MHz for deterministic control and embedded processing tasks.
• Co-processors Integrated signal-processing co-processor C674x and system control CP15 to assist specialized processing and system management.
• Memory Controller SDRAM controller support to interface with external system memory.
• Display On-chip LCD display interface controller for direct display connectivity in HMI applications.
• Networking Integrated 10/100 Mbps Ethernet port for wired network connectivity.
• Storage SATA 3 Gbps interface for direct connection to storage devices and subsystems.
• USB Connectivity USB 1.1 and USB 2.0 interfaces with PHYs to support a wide range of peripheral connections.
• Additional Interfaces Host Port Interface (HPI) for external host communication and control.
• Security Boot security and cryptography features to support secure boot and basic on-chip cryptographic functions.
• Package & Mounting 256-BGA (17×17) surface-mount package for high-density board designs.
• Operating Range & Grade Industrial grade with an operating temperature of −40 °C to 105 °C and RoHS compliance.
• Graphics Acceleration No hardware graphics acceleration.

Typical Applications

• Industrial Control Rugged embedded controllers and automation equipment that benefit from industrial-grade temperature support and on-chip interfaces.
• Networking Equipment Ethernet-enabled appliances and edge devices leveraging the integrated 10/100 Mbps controller for wired connectivity.
• Embedded Storage & NAS Compact storage controllers and network-attached solutions using the SATA 3 Gbps interface for direct drive attachment.
• Human-Machine Interfaces (HMI) Devices that require LCD display control and USB connectivity for user interaction and peripheral support.

Unique Advantages

• Integrated connectivity suite: Ethernet, SATA, USB 1.1/2.0 and LCD interfaces reduce external component count and simplify system design.
• Industrial temperature rating: −40 °C to 105 °C operation supports deployment in demanding thermal environments.
• Security features on-chip: Boot security and cryptography capabilities help protect system integrity from power-up.
• Compact, industry-standard package: 256-BGA (17×17) surface-mount footprint enables high-density PCB layouts and consistent manufacturing processes.
• Targeted processing and control: ARM926EJ-S core at 375 MHz with C674x co-processor support provides capable control and signal-processing assistance for embedded workloads.
• RoHS compliant: Meets lead-free manufacturing requirements for regulated markets.

Why Choose XOMAPL137DZKBA3?

The XOMAPL137DZKBA3 combines a focused ARM926EJ-S single-core architecture with a broad set of integrated interfaces—Ethernet, SATA, USB and LCD—making it suited to embedded designs that require balanced processing, connectivity and secure boot capabilities. Its industrial-grade temperature range and compact 256-BGA package support reliable, space-efficient designs for commercial and industrial deployments.

As part of the Texas Instruments OMAP-L13x series, this device is positioned for engineers building embedded systems that prioritize integration, deterministic processing and on-chip security while minimizing external components and board complexity.

Request a quote or submit an inquiry to obtain pricing and availability for XOMAPL137DZKBA3 and to discuss how it fits your next embedded design.