XOMAPL137BZKB3

IC MPU OMAP-L1X 375MHZ 256BGA
Part Description

ARM926EJ-S Microprocessor IC OMAP-L1x 1 Core, 32-Bit 375MHz 256-BGA (17x17)

Quantity 1,398 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesOMAP-L13x
ManufacturerTexas Instruments
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPSignal Processing; C674x, System Control; CP15Core ProcessorARM926EJ-SDevice Package256-BGA (17x17)
Display & Interface ControllersLCDECCN3A991A2Ethernet10/100Mbps (1)
GradeCommercialGraphics AccelerationNoHTS Code8542.31.0001
Moisture Sensitivity Level4 (72 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 90°C (TJ)Package / Case256-BGA
RAM ControllersSDRAMREACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Speed375MHzSupplier Device Package256-BGA (17×17)USBUSB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage – I/O1.8V, 3.3V

Overview of XOMAPL137BZKB3 – IC MPU OMAP-L1X 375MHZ 256BGA

The XOMAPL137BZKB3 is an ARM926EJ-S based microprocessor from the OMAP-L13x series, featuring a single 32-bit core running at 375 MHz. Designed for embedded applications, it integrates a range of system interfaces and security features to support connected, display-capable designs.

With on-chip support for SDRAM control, LCD display interfacing, wired networking and storage connectivity, this device targets embedded systems that require moderate processing performance combined with peripheral integration and commercial-grade temperature support.

Key Features

  • Core and Performance  ARM926EJ-S single 32-bit core at 375 MHz provides deterministic control and application execution suitable for embedded systems.
  • Co‑Processors  Includes signal processing and system control co‑processor support (C674x and CP15) to extend processing capabilities for dedicated tasks.
  • Memory Interface  SDRAM controller support for system memory interfacing to enable typical embedded memory architectures.
  • Display Support  Integrated LCD display interface controller for designs requiring on‑device visual output.
  • Connectivity and Storage  Built‑in 10/100 Mbps Ethernet, SATA 3 Gbps, USB 1.1 with PHY and USB 2.0 with PHY provide a broad set of wired I/O for networking and storage integration.
  • Additional Interfaces  High‑performance parallel interface (HPI) included for direct external device communication.
  • Security  Boot security and cryptography features support secure device boot and basic cryptographic functions.
  • Package and Mounting  256‑ball BGA package (17 × 17 mm) designed for surface mount assembly to support compact board layouts.
  • Environmental and Grade  Commercial grade device with operating temperature range of 0 °C to 90 °C and RoHS compliance.
  • Graphics Acceleration  No dedicated graphics acceleration; suitable for applications where display control is required without hardware GPU.

Typical Applications

  • Industrial HMI and Control  Use the integrated LCD interface and SDRAM controller for machine interfaces, operator panels and embedded control displays.
  • Networked Embedded Systems  10/100 Mbps Ethernet and USB interfaces enable connectivity for routers, gateways and monitoring devices requiring wired networking.
  • Embedded Storage Appliances  SATA 3 Gbps and USB host functionality support local storage and data logging in compact embedded systems.

Unique Advantages

  • Integrated Peripheral Set: Multiple on‑chip interfaces (Ethernet, SATA, USB, LCD, HPI) reduce external component count and simplify board design.
  • Secure Boot and Cryptography: Built‑in boot security and cryptographic features help establish a secure device foundation from power‑up.
  • Compact BGA Package: 256‑BGA (17 × 17 mm) package enables dense PCB designs and reliable surface mount assembly.
  • Commercial Temperature Range: Rated for 0 °C to 90 °C operation to match many commercial embedded deployment environments.
  • Standards‑oriented I/O: Support for industry interfaces like USB, Ethernet and SATA eases integration with existing peripherals and systems.
  • RoHS Compliant: Environmentally compliant manufacturing support for regulatory requirements.

Why Choose XOMAPL137BZKB3?

The XOMAPL137BZKB3 combines a 375 MHz ARM926EJ-S core with a broad set of integrated interfaces and security features to deliver a balanced solution for embedded systems that require networking, storage connectivity and display support. Its commercial temperature rating and compact 256‑BGA package make it suitable for space‑constrained designs needing verified peripheral integration.

This part is well suited for developers and OEMs building connected embedded products such as industrial HMIs, networked controllers and storage‑enabled devices that benefit from on‑chip interfaces and secure boot capabilities while keeping board complexity manageable.

Request a quote or submit an inquiry to obtain pricing and lead‑time information for XOMAPL137BZKB3 and to discuss availability for your design requirements.

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