| N/A | | GWIXP455BAD | Intel | IC MPU IXP455 533MHZ PBGA544 | Microprocessors | 544-PBGA (35x35) | N/A | 0°C ~ 70°C (TA) | Core Processor: Intel® IXP45x Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply Accumulate RAM Controllers: DDR, SDRAM Ethernet: Mll (3), SMII (3) USB: USB 1.1 (1), USB 2.0 (1) Operating Temperature: 0°C ~ 70°C (TA) Security Features: 3DES, AES, MD5, RNG, SHA1 Mounting Type: Surface Mount Supplier Device Package: 544-PBGA (35×35) | 19 | |
| N/A | | GWIXP460BAB | Intel | IC MPU INTEL 266MHZ PBGA544 | Microprocessors | 544-PBGA (35x35) | N/A | -40°C ~ 85°C (TA) | Core Processor: Intel® IXP45X Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply Accumulate RAM Controllers: DDR, SDRAM Ethernet: Mll (3), SMII (3) USB: USB 1.1 (1), USB 2.0 (1) Operating Temperature: -40°C ~ 85°C (TA) Security Features: 3DES, AES, DES, MD5, RNG, SHA1 Mounting Type: Surface Mount Supplier Device Package: 544-PBGA (35×35) | 1,174 | |
| N/A | | GWIXP460BAD | Intel | IC MPU INTEL 533MHZ PBGA544 | Microprocessors | 544-PBGA (35x35) | N/A | -40°C ~ 85°C (TA) | Core Processor: Intel® IXP45X Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply Accumulate RAM Controllers: DDR, SDRAM Ethernet: Mll (3), SMII (3) USB: USB 1.1 (1), USB 2.0 (1) Operating Temperature: -40°C ~ 85°C (TA) Security Features: 3DES, AES, DES, MD5, RNG, SHA1 Mounting Type: Surface Mount Supplier Device Package: 544-PBGA (35×35) | 489 | |
| N/A | | GWIXP460BADT | Intel | IC MPU INTEL 533MHZ PBGA544 | Microprocessors | 544-PBGA (35x35) | N/A | -40°C ~ 85°C (TA) | Core Processor: Intel® IXP45X Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply Accumulate RAM Controllers: DDR, SDRAM Ethernet: Mll (3), SMII (3) USB: USB 1.1 (1), USB 2.0 (1) Operating Temperature: -40°C ~ 85°C (TA) Security Features: 3DES, AES, DES, MD5, RNG, SHA1 Mounting Type: Surface Mount Supplier Device Package: 544-PBGA (35×35) | 688 | |
 | | GX1-233B-85-1.8 | Advanced Micro Devices | IC MPU 233MHZ 352EBGA | Microprocessors | 352-EBGA (35x35) | N/A | 0°C ~ 85°C (TC) | Core Processor: AMD Geode™ GX1 Number of Cores/Bus Width: 1 Core Graphics Acceleration: Yes Display & Interface Controllers: LCD Operating Temperature: 0°C ~ 85°C (TC) Mounting Type: Surface Mount Package / Case: 352-BGA Exposed Pad Supplier Device Package: 352-EBGA (35×35) | 24 | |
| N/A | | GX72170-DNT | Renesas | IC DRIVER | Drivers, Receivers, Transceivers | N/A | N/A | N/A | N/A | 105 | |
| N/A | N/A | GX72472-GNU | Renesas | IC MODULE REQUIRES WAFER | Drivers, Receivers, Transceivers | N/A | N/A | N/A | N/A | 823 | |
| N/A | N/A | GX72472B-GNU | Renesas | IC MODULE REQUIRES WAFER | Drivers, Receivers, Transceivers | N/A | N/A | N/A | N/A | 581 | |
| N/A | N/A | GX74870-JIU | Renesas | IC MODULE REQUIRES WAFER | Drivers, Receivers, Transceivers | N/A | N/A | N/A | | 797 | |
| N/A | | GX76470-DNT | Renesas | IC DRIVER 4/4 | Drivers, Receivers, Transceivers | N/A | - | – | Number of Drivers/Receivers: 4/4 | 762 | |
| N/A | | GX76471-DNT | Renesas | IC DRIVER 4/4 | Drivers, Receivers, Transceivers | N/A | - | – | Number of Drivers/Receivers: 4/4 | 1,045 | |
| N/A | | GX76472-DNT | Renesas | IC DRIVER 4/4 | Drivers, Receivers, Transceivers | N/A | - | – | Number of Drivers/Receivers: 4/4 | 414 | |
| N/A | | GX76473-DNT | Renesas | IC DRIVER 4/4 | Drivers, Receivers, Transceivers | N/A | - | – | Number of Drivers/Receivers: 4/4 | 869 | |
| N/A | | GX76474-F-DNT | Renesas | IC DRIVER 4/0 DIE | Drivers, Receivers, Transceivers | Die | - | – | Number of Drivers/Receivers: 4/0 Mounting Type: Surface Mount Supplier Device Package: Die | 935 | |
| N/A | | GX76476-DNT | Renesas | IC LINEAR DIFF | Drivers, Receivers, Transceivers | N/A | N/A | N/A | N/A | 121 | |
 | | GXC1E151MCQ1GS | Nichicon | CAP ALUM HYB 150UF ±20% 25V SMD | Aluminum - Polymer Capacitors | N/A | 25 V | -55°C - 135°C | Applications: Automotive, High Temperature Reflow Height Seated (Max): 1.05 cm Lifetime @ Temp: 4000 h @ 135°C Ripple Current High Frequency: 2.8 A @ 100 kHz Ripple Current Low Frequency: 420 mA @ 120 Hz Size / Dimension: 10 x 8 mm Surface Mount Land Size: 8.3 x 8.3 mm | 1,401 | |
 | | GXC1E151MCW1GS | Nichicon | CAP ALUM HYB 150UF ±20% 25V SMD | Aluminum - Polymer Capacitors | N/A | 25 V | -55°C - 135°C | Applications: Automotive, High Temperature Reflow Height Seated (Max): 1.05 cm Lifetime @ Temp: 4000 h @ 135°C Ripple Current High Frequency: 2.8 A @ 100 kHz Ripple Current Low Frequency: 420 mA @ 120 Hz Size / Dimension: 10 x 8 mm Surface Mount Land Size: 8.3 x 8.3 mm | 1,993 | |
 | | GXC1E221MCQ1GS | Nichicon | CAP ALUM HYB 220UF ±20% 25V SMD | Aluminum - Polymer Capacitors | N/A | 25 V | -55°C - 135°C | Applications: Automotive, High Temperature Reflow Height Seated (Max): 1.05 cm Lifetime @ Temp: 4000 h @ 135°C Ripple Current High Frequency: 2.8 A @ 100 kHz Ripple Current Low Frequency: 420 mA @ 120 Hz Size / Dimension: 10 x 8 mm Surface Mount Land Size: 8.3 x 8.3 mm | 897 | |
 | | GXC1E221MCW1GS | Nichicon | CAP ALUM HYB 220UF ±20% 25V SMD | Aluminum - Polymer Capacitors | N/A | 25 V | -55°C - 135°C | Applications: Automotive, High Temperature Reflow Height Seated (Max): 1.05 cm Lifetime @ Temp: 4000 h @ 135°C Ripple Current High Frequency: 2.8 A @ 100 kHz Ripple Current Low Frequency: 420 mA @ 120 Hz Size / Dimension: 10 x 8 mm Surface Mount Land Size: 8.3 x 8.3 mm | 871 | |
 | | GXC1E271MCQ1GS | Nichicon | CAP ALUM HYB 270UF ±20% 25V SMD | Aluminum - Polymer Capacitors | N/A | 25 V | -55°C - 135°C | Applications: Automotive, High Temperature Reflow Height Seated (Max): 1.05 cm Lifetime @ Temp: 4000 h @ 135°C Ripple Current High Frequency: 3.3 A @ 100 kHz Ripple Current Low Frequency: 495 mA @ 120 Hz Size / Dimension: 10 x 10 mm Surface Mount Land Size: 10.3 x 10.3 mm | 1,693 | |