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Total Products: 236,805
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Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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HD6417616RFV
HD6417616RFVRenesasIC MCU 32BIT ROMLESS 208LQFPMicrocontrollers208-LQFP (28x28)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-2 DSP
Core Size:
32-Bit Single-Core
Speed:
62.5MHz
Connectivity:
EBI/EMI, Ethernet, IrDA, FIFO, SCI, SIO
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
29
Program Memory Type:
ROMless
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-LQFP (28×28)
Package / Case:
208-LQFP
791
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HD6417616SFV
HD6417616SFVRenesasIC MCU 32BIT ROMLESS 208LQFPMicrocontrollers208-LQFP (28x28)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-2 DSP
Core Size:
32-Bit Single-Core
Speed:
62.5MHz
Connectivity:
EBI/EMI, Ethernet, IrDA, FIFO, SCI, SIO
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
29
Program Memory Type:
ROMless
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-LQFP (28×28)
Package / Case:
208-LQFP
893
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HD6417622F80V
HD6417622F80VRenesasIC MCU 32BIT ROMLESSMicrocontrollersN/AN/A-20°C ~ 75°C (TA)
Core Processor:
SH-DSP
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
EBI/EMI, FIFO, SCI, USB
Peripherals:
DMA, POR, WDT
Number of I/O:
96
Program Memory Type:
ROMless
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
1.75V ~ 2.05V
Data Converters:
A/D 4x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Package / Case:
208-LQFP
186
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HD6417705BP100BV
HD6417705BP100BVRenesasIC MCU 32BIT ROMLESS 208TFBGAMicrocontrollers208-TFBGA (12x12)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-3
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
EBI/EMI, FIFO, IrDA, SCI, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
105
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 1.6V
Data Converters:
A/D 4x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-TFBGA (12×12)
Package / Case:
208-TFBGA
1,155
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HD6417705BP100V
HD6417705BP100VRenesasIC MCU 32BIT ROMLESS 208TFBGAMicrocontrollers208-TFBGA (12x12)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-3
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
EBI/EMI, FIFO, IrDA, SCI, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
105
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 1.6V
Data Converters:
A/D 4x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-TFBGA (12×12)
Package / Case:
208-TFBGA
1,557
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HD6417705F133BV
HD6417705F133BVRenesasIC MCU 32BIT ROMLESS 208LQFPMicrocontrollers208-LQFP (28x28)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-3
Core Size:
32-Bit Single-Core
Speed:
133MHz
Connectivity:
EBI/EMI, FIFO, IrDA, SCI, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
105
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 1.6V
Data Converters:
A/D 4x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-LQFP (28×28)
Package / Case:
208-LQFP
1,194
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HD6417706BP133V
HD6417706BP133VRenesasRISC MCU, 133.34MHZMicrocontrollersN/AN/AN/A

N/A

841
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HD6417707RF60A
HD6417707RF60ARenesasIC MCU 32-BIT FLASHMicrocontrollers-N/A–
Core Size:
32-Bit
Program Memory Type:
FLASH
Mounting Type:
Surface Mount
742
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HD6417708RF100AV
HD6417708RF100AVRenesasIC MCU 32BIT ROMLESS 144LQFPMicrocontrollers144-LQFP (20x20)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-2
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
EBI/EMI, SCI, SmartCard
Peripherals:
POR, WDT
Number of I/O:
8
Program Memory Type:
ROMless
Voltage – Supply (Vcc/Vdd):
3.15V ~ 3.6V
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
567
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HD6417708SF60
HD6417708SF60RenesasIC MCU 32BIT ROMLESS 144LQFPMicrocontrollers144-LQFP (20x20)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-2
Core Size:
32-Bit Single-Core
Speed:
60MHz
Connectivity:
EBI/EMI, SCI, SmartCard
Peripherals:
POR, WDT
Number of I/O:
8
Program Memory Type:
ROMless
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
8
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HD6417710XVN/AHD6417710XVRenesasIC MCU 32BIT ROMLESS 256HQFPMicrocontrollersN/AN/A-20°C ~ 75°C (TA)
Core Processor:
SH-3 DSP
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
EBI/EMI, Ethernet, FIFO, SCI, SIO
Peripherals:
DMA, POR, WDT
Number of I/O:
24
Program Memory Type:
ROMless
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 1.6V
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
1,455
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HD6417712BPV
HD6417712BPVRenesasIC MCU 32BIT ROMLESS 256LFBGAMicrocontrollers256-LFBGA (17x17)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-3 DSP
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
EBI/EMI, Ethernet, FIFO, SCI, SIO
Peripherals:
DMA, POR, WDT
Number of I/O:
24
Program Memory Type:
ROMless
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 1.6V
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-LFBGA (17×17)
Package / Case:
256-LFBGA
869
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HD6417712XVN/AHD6417712XVRenesasIC MCU 32BIT ROMLESS 256HQFPMicrocontrollersN/AN/A-20°C ~ 75°C (TA)
Core Processor:
SH-3 DSP
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
EBI/EMI, Ethernet, FIFO, SCI, SIO
Peripherals:
DMA, POR, WDT
Number of I/O:
24
Program Memory Type:
ROMless
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 1.6V
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
800
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N/A
HD6417713BPVRenesasIC MCU 32BIT ROMLESS 256LFBGAMicrocontrollers256-LFBGA (17x17)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-3 DSP
Core Size:
32-Bit
Speed:
200MHz
Connectivity:
EBI/EMI, Ethernet, FIFO, SCI, SIO, UART/USART
Peripherals:
DMA, POR, WDT
Number of I/O:
24
Program Memory Type:
ROMless
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 3.6V
Oscillator Type:
External, Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-LFBGA (17×17)
Package / Case:
256-LFBGA
1,586
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HD6417713XVN/AHD6417713XVRenesasIC MCU 32BIT ROMLESS 256HQFPMicrocontrollersN/AN/A-20°C ~ 75°C (TA)
Core Processor:
SH-3 DSP
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
EBI/EMI, Ethernet, FIFO, SCI, SIO
Peripherals:
DMA, POR, WDT
Number of I/O:
24
Program Memory Type:
ROMless
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 1.6V
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
222
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HD6417720BP133CV
HD6417720BP133CVRenesasIC MCU 32BIT ROMLESS 256LFBGAMicrocontrollers256-LFBGA (17x17)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-3 DSP
Core Size:
32-Bit Single-Core
Speed:
133MHz
Connectivity:
FIFO, I2C, IrDA, Memory Card, SCI, SD, SIO, SIM, USB
Peripherals:
DMA, LCD, POR, WDT
Number of I/O:
117
Program Memory Type:
ROMless
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 1.6V
Data Converters:
A/D 4x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-LFBGA (17×17)
Package / Case:
256-LFBGA
24
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HD6417727BP100CV
HD6417727BP100CVRenesasIC MCU 32BIT ROMLESS 240LFBGAMicrocontrollers240-LFBGA (13x13)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-3 DSP
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
FIFO, SCI, SIO, SmartCard, USB
Peripherals:
DMA, LCD, POR, WDT
Number of I/O:
104
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 2.05V
Data Converters:
A/D 6x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
240-LFBGA (13×13)
Package / Case:
240-LFBGA
1,531
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HD6417727BP160CV
HD6417727BP160CVRenesasIC MCU 32BIT ROMLESS 240LFBGAMicrocontrollers240-LFBGA (13x13)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-3 DSP
Core Size:
32-Bit Single-Core
Speed:
160MHz
Connectivity:
FIFO, SCI, SIO, SmartCard, USB
Peripherals:
DMA, LCD, POR, WDT
Number of I/O:
104
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.7V ~ 2.05V
Data Converters:
A/D 6x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
240-LFBGA (13×13)
Package / Case:
240-LFBGA
1,102
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HD6417727X100CV
HD6417727X100CVRenesasIC MCU 32BIT ROMLESS 240HQFPMicrocontrollersN/AN/A-20°C ~ 75°C (TA)
Core Processor:
SH-3 DSP
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
FIFO, SCI, SIO, SmartCard, USB
Peripherals:
DMA, LCD, POR, WDT
Number of I/O:
104
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 2.05V
Data Converters:
A/D 6x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
576
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HD6417727X160CV
HD6417727X160CVRenesasIC MCU 32BIT ROMLESS 240HQFPMicrocontrollersN/AN/A-20°C ~ 75°C (TA)
Core Processor:
SH-3 DSP
Core Size:
32-Bit Single-Core
Speed:
160MHz
Connectivity:
FIFO, SCI, SIO, SmartCard, USB
Peripherals:
DMA, LCD, POR, WDT
Number of I/O:
104
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.7V ~ 2.05V
Data Converters:
A/D 6x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
409
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