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Total Products: 236,805
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Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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HD6417750BP200M
HD6417750BP200MRenesasIC MCU 32BIT ROMLESS 256BGAMicrocontrollers256-BGA (27x27)N/A-20°C ~ 75°C
Core Processor:
SH-4
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
EBI/EMI, FIFO, SCI, SmartCard
Peripherals:
DMA, POR, WDT
Number of I/O:
28
Program Memory Type:
ROMless
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.6V
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C
Mounting Type:
Surface Mount
Supplier Device Package:
256-BGA (27×27)
Package / Case:
256-BBGA
406
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HD6417750BP200MV
HD6417750BP200MVRenesasIC MCU 32BIT ROMLESS 256BGAMicrocontrollers256-BGA (27x27)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-4
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
EBI/EMI, FIFO, SCI, SmartCard
Peripherals:
DMA, POR, WDT
Number of I/O:
28
Program Memory Type:
ROMless
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.6V
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-BGA (27×27)
Package / Case:
256-BBGA
1,425
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HD6417750F167
HD6417750F167RenesasIC MCU 32BIT ROMLESS 208HQFPMicrocontrollers208-HQFP (28x28)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-4
Core Size:
32-Bit Single-Core
Speed:
167MHz
Connectivity:
EBI/EMI, FIFO, SCI, SmartCard
Peripherals:
DMA, POR, WDT
Number of I/O:
28
Program Memory Type:
ROMless
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 2V
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-HQFP (28×28)
Package / Case:
208-BFQFP Exposed Pad
1,582
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HD6417750F167D
HD6417750F167DRenesasRISC MPU, 32-BIT, 167MHZMicroprocessorsQFPN/A0 °C – 70 °C
Speed:
167 MHz
Voltage – I/O:
1.8 V – 3.3 V
Core Processor:
SH-4
Number of Cores/Bus Width:
1 Core, 32-Bit
Graphics Acceleration:
No
Qualification:
Consumer
119
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HD6417750RBP200V
HD6417750RBP200VRenesasIC MCU 32BIT ROMLESS 256BGAMicrocontrollers256-BGA (27x27)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-4
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
EBI/EMI, FIFO, SCI, SmartCard
Peripherals:
DMA, POR, WDT
Number of I/O:
28
Program Memory Type:
ROMless
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.6V
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-BGA (27×27)
Package / Case:
256-BBGA
955
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HD6417750RF200DV
HD6417750RF200DVRenesasIC MCU 32BIT ROMLESS 208HQFPMicrocontrollers208-HQFP (28x28)N/A-40°C ~ 85°C (TA)
Core Processor:
SH-4
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
EBI/EMI, FIFO, SCI, SmartCard
Peripherals:
DMA, POR, WDT
Number of I/O:
28
Program Memory Type:
ROMless
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.6V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-HQFP (28×28)
Package / Case:
208-BFQFP Exposed Pad
850
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HD6417750RF200V
HD6417750RF200VRenesasIC MCU 32BIT ROMLESS 208HQFPMicrocontrollers208-HQFP (28x28)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-4
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
EBI/EMI, FIFO, SCI, SmartCard
Peripherals:
DMA, POR, WDT
Number of I/O:
28
Program Memory Type:
ROMless
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.6V
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-HQFP (28×28)
Package / Case:
208-BFQFP Exposed Pad
1,534
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HD6417750RX200DV
HD6417750RX200DVRenesasIC MCU 32BIT ROMLESS 208QFPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
SH-4
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
EBI/EMI, FIFO, SCI, SmartCard
Peripherals:
DMA, POR, WDT
Number of I/O:
28
Program Memory Type:
ROMless
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.6V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
201
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HD6417750RX200V
HD6417750RX200VRenesasIC MCU 32BIT ROMLESS 208QFPMicrocontrollersN/AN/A-20°C ~ 75°C (TA)
Core Processor:
SH-4
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
EBI/EMI, FIFO, SCI, SmartCard
Peripherals:
DMA, POR, WDT
Number of I/O:
28
Program Memory Type:
ROMless
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.6V
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
297
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HD6417750RX240DV
HD6417750RX240DVRenesasIC MCU 32BIT ROMLESS 208QFPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
SH-4
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
EBI/EMI, FIFO, SCI, SmartCard
Peripherals:
DMA, POR, WDT
Number of I/O:
28
Program Memory Type:
ROMless
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 1.6V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
969
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HD6417750RX240V
HD6417750RX240VRenesasIC MCU 32BIT ROMLESS 208QFPMicrocontrollersN/AN/A-20°C ~ 75°C (TA)
Core Processor:
SH-4
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
EBI/EMI, FIFO, SCI, SmartCard
Peripherals:
DMA, POR, WDT
Number of I/O:
28
Program Memory Type:
ROMless
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 1.6V
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
44
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HD6417750SBP200V
HD6417750SBP200VRenesas32-BIT RISC MICROPROCESSORMicroprocessorsBGAN/A0 °C – 70 °C
Speed:
200 MHz
Voltage – I/O:
1.8 V – 3.3 V
Core Processor:
SH-4
Number of Cores/Bus Width:
1 Core, 32-Bit
Graphics Acceleration:
No
Qualification:
Consumer
928
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HD6417750SF200V
HD6417750SF200VRenesasIC MCU 32BIT ROMLESS 208HQFPMicrocontrollers208-HQFP (28x28)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-4
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
EBI/EMI, FIFO, SCI, SmartCard
Peripherals:
DMA, POR, WDT
Number of I/O:
28
Program Memory Type:
ROMless
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 2.07V
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-HQFP (28×28)
Package / Case:
208-BFQFP Exposed Pad
1,358
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HD6417750SVF133V
HD6417750SVF133VRenesasIC MCU 32BIT ROMLESS 208HQFPMicrocontrollers208-HQFP (28x28)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-4
Core Size:
32-Bit Single-Core
Speed:
133MHz
Connectivity:
EBI/EMI, FIFO, SCI, SmartCard
Peripherals:
DMA, POR, WDT
Number of I/O:
28
Program Memory Type:
ROMless
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 1.7V
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-HQFP (28×28)
Package / Case:
208-BFQFP Exposed Pad
814
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HD6417750SVX133VN/AHD6417750SVX133VRenesasIC MCU 32BIT ROMLESS 208QFPMicrocontrollersN/AN/A-20°C ~ 75°C (TA)
Core Processor:
SH-4
Core Size:
32-Bit Single-Core
Speed:
133MHz
Connectivity:
EBI/EMI, FIFO, SCI, SmartCard
Peripherals:
DMA, POR, WDT
Number of I/O:
28
Program Memory Type:
ROMless
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 1.7V
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
32
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N/AN/AHD6417750SX167VRenesasIC MCU 32BIT ROMLESS 208QFPMicrocontrollersN/AN/A-20°C ~ 75°C (TA)
Core Processor:
SH-4
Core Size:
32-Bit Single-Core
Speed:
167MHz
Connectivity:
EBI/EMI, FIFO, SCI, SmartCard
Peripherals:
DMA, POR, WDT
Number of I/O:
28
Program Memory Type:
ROMless
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 2V
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
1,094
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N/AN/AHD6417750SX200VRenesasIC MCU 32BIT ROMLESS 208QFPMicrocontrollersN/AN/A-20°C ~ 75°C (TA)
Core Processor:
SH-4
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
EBI/EMI, FIFO, SCI, SmartCard
Peripherals:
DMA, POR, WDT
Number of I/O:
28
Program Memory Type:
ROMless
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 2.07V
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
918
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HD6417750VF128V
HD6417750VF128VRenesasRISC MPU, 32-BIT, 128MHZMicroprocessorsVFBGAN/A0 °C – 70 °C
Speed:
128 MHz
Voltage – I/O:
1.8 V – 3.3 V
Core Processor:
SH-4
Number of Cores/Bus Width:
1 Core, 32-Bit
Graphics Acceleration:
No
Qualification:
Consumer
1,363
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N/AN/AHD6417750X167VRenesasIC MCU 32BIT ROMLESS 208QFPMicrocontrollersN/AN/A-20°C ~ 75°C (TA)
Core Processor:
SH-4
Core Size:
32-Bit Single-Core
Speed:
167MHz
Connectivity:
EBI/EMI, FIFO, SCI, SmartCard
Peripherals:
DMA, POR, WDT
Number of I/O:
28
Program Memory Type:
ROMless
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 2V
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
330
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HD6417751RBP200
HD6417751RBP200RenesasIC MCU 32BIT ROMLESS 256BGAMicrocontrollers256-BGA (27x27)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-4
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
EBI/EMI, FIFO, SCI, SmartCard
Peripherals:
DMA, POR, WDT
Number of I/O:
39
Program Memory Type:
ROMless
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.6V
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-BGA (27×27)
Package / Case:
256-BBGA
738
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