 | | LNY2W822MSEHBN | Nichicon | CAP ALUM 8200UF ±20% 450V SCREW | Aluminum Electrolytic Capacitors | N/A | 450 V | -40°C - 85°C | Applications: General Purpose Height Seated (Max): 17.3 cm Lifetime @ Temp: 2000 h @ 85°C Ripple Current High Frequency: 28.14 A @ 100 kHz Ripple Current Low Frequency: 20.1 A @ 120 Hz Size / Dimension: 170 x 76.2 mm Surface Mount Land Size: N/A | 1,376 | |
 | | LNY2W822MSEJ | Nichicon | CAP ALUM 8200UF ±20% 450V SCREW | Aluminum Electrolytic Capacitors | N/A | 450 V | -40°C - 85°C | Applications: General Purpose Height Seated (Max): 13.3 cm Lifetime @ Temp: 2000 h @ 85°C Ripple Current High Frequency: 28.14 A @ 10 kHz Ripple Current Low Frequency: 20.1 A @ 120 Hz Size / Dimension: 130 x 90 mm Surface Mount Land Size: N/A | 1,079 | |
 | | LNY2W822MSEJBB | Nichicon | CAP ALUM 8200UF ±20% 450V SCREW | Aluminum Electrolytic Capacitors | N/A | 450 V | -40°C - 85°C | Applications: General Purpose Height Seated (Max): 13.3 cm Lifetime @ Temp: 2000 h @ 85°C Ripple Current High Frequency: 28.14 A @ 10 kHz Ripple Current Low Frequency: 20.1 A @ 120 Hz Size / Dimension: 130 x 90 mm Surface Mount Land Size: N/A | 1,079 | |
 | | LNY2W822MSEJBN | Nichicon | CAP ALUM 8200UF ±20% 450V SCREW | Aluminum Electrolytic Capacitors | N/A | 450 V | -40°C - 85°C | Applications: General Purpose Height Seated (Max): 13.3 cm Lifetime @ Temp: 2000 h @ 85°C Ripple Current High Frequency: 28.14 A @ 10 kHz Ripple Current Low Frequency: 20.1 A @ 120 Hz Size / Dimension: 130 x 90 mm Surface Mount Land Size: N/A | 527 | |
 | | LP2985SF5-3.3 | TAEJIN Technology | REG LINEAR 3.3V 150MA | Voltage Regulators - Linear Low Drop Out (LDO) Regulators | SOT23-5 | 3.3V | -40°C ~ 125°C (TA) | Operating Temperature: -40°C ~ 125°C (TA) Supplier Device Package: SOT23-5 Number of Circuits (I/O): 1 | 1,818 | |
 | | LP2985SF5-5.0 | TAEJIN Technology | REG LINEAR 5V 150MA | Voltage Regulators - Linear Low Drop Out (LDO) Regulators | SOT23-5 | 5.0V | -40°C ~ 125°C (TA) | Operating Temperature: -40°C ~ 125°C (TA) Supplier Device Package: SOT23-5 Number of Circuits (I/O): 1 | 29 | |
 | | LP431GCSF | TAEJIN Technology | VREF SHUNT ADJ 0.5% | Voltage Reference | SOT23-3 | N/A | -40°C ~ 85°C (TA) | Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: SOT23-3 | 1,159 | |
 | | LPC1101LVUKZ | NXP Semiconductors | IC MCU 32BIT 32KB FLASH 25WLCSP | Microcontrollers | N/A | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.65V ~ 1.95V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 25-UFBGA, WLCSP | 375 | |
 | | LPC1102LVUKZ | NXP Semiconductors | IC MCU 32BIT 32KB FLASH 25WLCSP | Microcontrollers | N/A | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.65V ~ 1.95V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 25-UFBGA, WLCSP | 667 | |
 | | LPC1102UK,118 | NXP Semiconductors | IC MCU 32BIT 32KB FLASH 16WLCSP | Microcontrollers | 16-WLCSP (2.17x2.32) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 5x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 16-WLCSP (2.17×2.32) Package / Case: 16-UFBGA, WLCSP | 1,596 | |
| N/A | | LPC1104UK,118 | NXP Semiconductors | IC MCU 32BIT 32KB FLASH 16WLCSP | Microcontrollers | 16-WLCSP (2.17x2.32) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 5x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 16-WLCSP (2.17×2.32) Package / Case: 16-UFBGA, WLCSP | 183 | |
 | | LPC1110FD20,529 | NXP Semiconductors | IC MCU 32BIT 4KB FLASH 20SO | Microcontrollers | 20-SO | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 5x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 20-SO Package / Case: 20-SOIC (0.295″”, 7.50mm Width) | 32 | |
| N/A | | LPC1110FD20Y | NXP Semiconductors | SCALABLE ENTRY LEVEL 32-BIT MICR | Microcontrollers | 20-SO | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 5x10b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 20-SO Package / Case: 20-SOIC (0.295″”, 7.50mm Width) | 966 | |
 | | LPC1111FDH20/002,5 | NXP Semiconductors | IC MCU 32BIT 8KB FLASH 20TSSOP | Microcontrollers | 20-TSSOP | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 5x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 20-TSSOP Package / Case: 20-TSSOP (0.173″”, 4.40mm Width) | 525 | |
 | | LPC1111FHN33/101,5 | NXP Semiconductors | IC MCU 32BIT 8KB FLASH 32HVQFN | Microcontrollers | 32-HVQFN (7x7) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-HVQFN (7×7) Package / Case: 32-VQFN Exposed Pad | 565 | |
 | | LPC1111FHN33/102,5 | NXP Semiconductors | IC MCU 32BIT 8KB FLASH 32HVQFN | Microcontrollers | 32-HVQFN (7x7) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-HVQFN (7×7) Package / Case: 32-VQFN Exposed Pad | 113 | |
 | | LPC1111FHN33/102'5 | NXP Semiconductors | IC MCU 32BIT 8KB FLASH 32HVQFN | Microcontrollers | 32-HVQFN (7x7) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-HVQFN (7×7) Package / Case: 32-VQFN Exposed Pad | 785 | |
 | | LPC1111FHN33/102K | NXP Semiconductors | IC MCU 32BIT 8KB FLASH 32HVQFN | Microcontrollers | 32-HVQFN (7x7) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b SAR Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-HVQFN (7×7) Package / Case: 32-VQFN Exposed Pad | 706 | |
| N/A | | LPC1111FHN33/103 | NXP Semiconductors | IC MCU 32BIT 8KB FLASH 32HVQFN | Microcontrollers | 32-HVQFN (7x7) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b SAR Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-HVQFN (7×7) Package / Case: 32-VQFN Exposed Pad | 1,398 | |
 | | LPC1111FHN33/103,5 | NXP Semiconductors | IC MCU 32BIT 8KB FLASH 32HVQFN | Microcontrollers | 32-HVQFN (7x7) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-HVQFN (7×7) Package / Case: 32-VQFN Exposed Pad | 849 | |