 | | LPC1111FHN33/103K | NXP Semiconductors | IC MCU 32BIT 8KB FLASH 32HVQFN | Microcontrollers | 32-HVQFN (7x7) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b SAR Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-HVQFN (7×7) Package / Case: 32-VQFN Exposed Pad | 140 | |
 | | LPC1111FHN33/201,5 | NXP Semiconductors | IC MCU 32BIT 8KB FLASH 32HVQFN | Microcontrollers | 32-HVQFN (7x7) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-HVQFN (7×7) Package / Case: 32-VQFN Exposed Pad | 215 | |
 | | LPC1111FHN33/202,5 | NXP Semiconductors | IC MCU 32BIT 8KB FLASH 32HVQFN | Microcontrollers | 32-HVQFN (7x7) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-HVQFN (7×7) Package / Case: 32-VQFN Exposed Pad | 951 | |
 | | LPC1111FHN33/203,5 | NXP Semiconductors | IC MCU 32BIT 8KB FLASH 32HVQFN | Microcontrollers | 32-HVQFN (7x7) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-HVQFN (7×7) Package / Case: 32-VQFN Exposed Pad | 215 | |
 | | LPC1111JHN33/103E | NXP Semiconductors | IC MCU 32BIT 8KB FLASH 32HVQFN | Microcontrollers | 32-HVQFN (7x7) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-HVQFN (7×7) Package / Case: 32-VQFN Exposed Pad | 1,040 | |
 | | LPC1111JHN33/203E | NXP Semiconductors | IC MCU 32BIT 8KB FLASH 32HVQFN | Microcontrollers | 32-HVQFN (7x7) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-HVQFN (7×7) Package / Case: 32-VQFN Exposed Pad | 695 | |
 | | LPC1112FD20/102,52 | NXP Semiconductors | IC MCU 32BIT 16KB FLASH 20SO | Microcontrollers | 20-SO | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 5x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 20-SO Package / Case: 20-SOIC (0.295″”, 7.50mm Width) | 729 | |
| N/A | | LPC1112FD20/102Y | NXP Semiconductors | SCALABLE ENTRY LEVEL 32-BIT MICR | Microcontrollers | 20-SO | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 5x10b SAR Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 20-SO Package / Case: 20-SOIC (0.295″”, 7.50mm Width) | 997 | |
 | | LPC1112FDH20/102:5 | NXP Semiconductors | IC MCU 32BIT 16KB FLASH 20TSSOP | Microcontrollers | 20-TSSOP | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 5x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 20-TSSOP Package / Case: 20-TSSOP (0.173″”, 4.40mm Width) | 1,130 | |
 | | LPC1112FDH28/102:5 | NXP Semiconductors | IC MCU 32BIT 16KB FLASH 28TSSOP | Microcontrollers | 28-TSSOP | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 6x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 28-TSSOP Package / Case: 28-TSSOP (0.173″”, 4.40mm Width) | 25 | |
| N/A | N/A | LPC1112FHI33/102 | NXP Semiconductors | IC MCU 32BIT 16KB FLASH 32HVQFN | Microcontrollers | 32-HVQFN (5x5) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-HVQFN (5×5) Package / Case: 32-VFQFN Exposed Pad | 597 | |
 | | LPC1112FHI33/102,5 | NXP Semiconductors | IC MCU 32BIT 16KB FLASH 32HVQFN | Microcontrollers | 32-HVQFN (5x5) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-HVQFN (5×5) Package / Case: 32-VFQFN Exposed Pad | 14 | |
 | | LPC1112FHI33/202,5 | NXP Semiconductors | IC MCU 32BIT 16KB FLASH 32HVQFN | Microcontrollers | 32-HVQFN (5x5) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-HVQFN (5×5) Package / Case: 32-VFQFN Exposed Pad | 484 | |
 | | LPC1112FHI33/203,5 | NXP Semiconductors | IC MCU 32BIT 16KB FLASH 32HVQFN | Microcontrollers | 32-HVQFN (5x5) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-HVQFN (5×5) Package / Case: 32-VFQFN Exposed Pad | 65 | |
 | | LPC1112FHN24/202,1 | NXP Semiconductors | IC MCU 32BIT 16KB FLASH 24HVQFN | Microcontrollers | 24-HVQFN (4x4) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 6x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 24-HVQFN (4×4) Package / Case: 24-VFQFN Exposed Pad | 765 | |
 | | LPC1112FHN24/202J | NXP Semiconductors | IC MCU 32BIT 16KB FLASH 24HVQFN | Microcontrollers | 24-HVQFN (4x4) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 6x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 24-HVQFN (4×4) Package / Case: 24-VFQFN Exposed Pad | 34 | |
 | | LPC1112FHN33/101,5 | NXP Semiconductors | IC MCU 32BIT 16KB FLASH 32HVQFN | Microcontrollers | 32-HVQFN (7x7) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-HVQFN (7×7) Package / Case: 32-VQFN Exposed Pad | 750 | |
 | | LPC1112FHN33/102,5 | NXP Semiconductors | IC MCU 32BIT 16KB FLASH 32HVQFN | Microcontrollers | 32-HVQFN (7x7) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-HVQFN (7×7) Package / Case: 32-VQFN Exposed Pad | 650 | |
 | | LPC1112FHN33/102K | NXP Semiconductors | IC MCU 32BIT 16KB FLASH 32HVQFN | Microcontrollers | 32-HVQFN (7x7) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b SAR Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-HVQFN (7×7) Package / Case: 32-VQFN Exposed Pad | 141 | |
 | | LPC1112FHN33/103,5 | NXP Semiconductors | IC MCU 32BIT 16KB FLASH 32HVQFN | Microcontrollers | 32-HVQFN (7x7) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-HVQFN (7×7) Package / Case: 32-VQFN Exposed Pad | 1,417 | |